The development of miniaturized and more powerful electronic devices and microprocessors has resulted in high heat generation and temperature values in these components. That affects the performance, reliability and lifespan of the devices. In addition, more local hot spots are generated in the components that require even more attention to prevent stress failure and fatigue. As such, the employment of advanced electronics cooling systems is very essential to keep the temperature below the safe temperature. In this work, innovative cooling systems are developed and analyzed employing jet impingement technology, high conductive metal foam, rib structured target surfaces, confined non-uniform small-scale channel, and conductive heat spreader plate. The base of the foam-filled cooling channel is subject to a uniform high heat flux value resembling the electronics device to be cooled. For numerical modeling of thermal transport through foam filled region, the local thermal non-equilibrium model in porous media is utilized resulting in two energy equations for solid and fluid phases. For better understanding of flow and thermal characteristics of jet impingement through the combination of metal foam and rib structured surfaces in confined channels, several effective parameters are studied such as slot and circular jet impingements, the shape and orientation of the ribs, impinging jet velocity, applied heat flux and the thickness of conductive heat spreader plate for hotspot removal. The results show that the fully foam filled channel provides a more efficient cooling in comparison with partially foam filled channel. Furthermore, the results indicate the advantage of utilization of ribs at the stagnation region of the impinging jet, for local thermal treatment of hotspots. The perpendicular cuboid ribs placed at the stagnation zone of the coolant jet impingement provide 13% increase in maximum local Nusselt number while the increase in the pressure drop and required pumping power are as small as 4.2%. Doubling the velocity would result in 35.3% increase in the maximum local Nusselt number, 180% increase in the pressure drop and 460.7% increase in the required pumping power. An increase in the thickness of the conductive heat spreader plate increases the base local temperature but improves local temperature uniformity.
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