The possibility of using colloidal lithography at the industrial level depends on the ability to form defect-free coatings over large areas. The spin-coating method has not yet shown acceptable results, but a more detailed studying of the regularities of this process may improve the quality of masks. The Langmuir-Blodgett method is expected to be the most preferable for forming high-quality large-scale monolayers. Real-time controlling the surface pressure of the monolayer can allow to obtain close-packed arrays with long-range order. In this work, to develop the spin-coating technology, the influence of technological parameters (spin-coating speed and time, concentrations of components in suspension) on the substrate coverage area with a monolayer of polystyrene spheres (1.25 μm) was studied. An original automated Langmuir-Blodgett system was developed to study the influence of the monolayer surface pressure on its quality using polystyrene spheres (1.25, 1.8, 2.1 μm). The developed spin-coating technology resulted in a record coverage area (90%) of Si substrate (76 mm) and a defect-free hexagonally ordered domain area of 500 μm2. As a result of the developed Langmuir-Blodgett technique, a close-packed monolayer coating was obtained over the entire substrate area (coverage area 99.5%, defect-free domain area 3000 μm2) without the use of any surfactants.
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