Isothermal Aging Research Articles

Microstructural Modifications and Failure Mechanisms of an Aluminum‐Based Abradable Coating System during Isothermal and Cyclic Aging

Abradable systems are used in the aeronautical industry to improve the efficiency of gas turbine. Those materials are exposed in service to temperature up to 450 °C. The increase in gas turbine efficiency requires to increase the operating temperature and therefore the service temperature of abradable coating. The present study focuses on the isothermal and cyclic thermal aging of the Al–Si abradable coating system in a laboratory air at high temperature up to 500 °C. The investigation encompasses the microstructural evolution, phase transformation, and the formation of cracks, along with their interrelated effects. During aging, silicon particles precipitate in the abradable top coat. In addition, coarsening of those particles is observed and the coarsening kinetics appears to be faster in cyclic thermal aging conditions compared to isothermal aging. During cyclic and isothermal aging, brittle aluminides develope at the abradable top–coat/bond–coat interface, due to the interdiffusion of Al and Ni species. During cyclic aging, thermal cycles create thermomechanical stress at the top‐coat/bont‐coat interface due to coefficient of thermal expansion mismatch between the Al‐Si deposit and intermetallic phases. The stress generated results in the formation of cracks and porosities at the top–coat/bond–coat interface resulting in a dramatic failure of the system.

Computational thermodynamics-guided alloy design and phase stability in CoCrFeMnNi-based medium-and high-entropy alloys: An experimental-theoretical study

A computational thermodynamics approach has been employed to design CoCrFeMnNi-based medium- and high-entropy alloys (M/HEAs) with systematically varied compositions (Co((80-X)/2)Cr((80-X)/2)FeXMn10Ni10 with x = 30, 40, and 50 at.%) and phase stability. Since the formation of sigma phase, usually brittle and undesirable, is a common concern, when this class of alloys is subjected to elevated temperatures (600–1000 °C), predicting its formation becomes essential. Thus, its formation and the phase equilibria were studied using the CALPHAD method, and two empirical methods, namely, valence electron concentration (VEC) and paired sigma-forming element (PSFE). Isothermal aging treatments at 900–1100 °C for 20 h were performed, since CALPHAD and VEC/PSFE predictions diverged. Both prediction methods were compared with experimental characterization by a combination of scanning electron microscopy and high-energy synchrotron X-ray diffraction. The predictions from the VEC/PSFE and CALPHAD calculations (depending on the database used) were shown to be quite accurate.

Improved Tensile Strength and SCC Resistance via Nonisothermal Creep Aging under a High Stress Level

Compared with conventional isothermal creep aging (ICA), non‐ICA (NICA) does not involve a prolonged holding stage, but only has heating and cooling stages. During the NICA process, the precipitates nucleate and grow up in the early part of heating stage, resulting in fluctuations in creep rate and an increase in strength. The coarsening of precipitates in the later part of the heating stage can lead to significant increase of creep rate. Upon approaching the peak temperature, the dissolution of the precipitates occurs in conjunction with a partial coarsening of the remaining precipitates, causing a reduction in strength. However, the secondary precipitation during the cooling stage facilitates a significant strength enhancement in a relatively shorter period. In contrast to the ICA, the targeted NICA treatment gives an increase in ultimate strength while improves the stress corrosion cracking resistance. Moreover, the time required for NICA to obtain ultimate strength is only 13.9% of that of the ICA treatment. A large amount of creep strain can be generated during the NICA process, which is equivalent to 630% of that of creep age forming treatment.

Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications

Sn-Ag-Cu-Bi (SAC-Bi) alloys are gaining popularity as a potential replacement for current lead-free solder alloys in microelectronic packages. In this study, the tensile and viscoplastic behaviors of eight SAC-Bi alloys with 0, 1 wt.%, 2 wt.%, and 3 wt.% Bi content were investigated. The samples of these eight alloys were cast, aged at room temperature, 75 °C and 125 °C, and tensile-tested at rates of 0.1/s, 0.01/s, and 0.001/s in ambient and elevated temperature environments to facilitate the quantification of viscoplasticity using the Anand viscoplastic model. The Anand parameters of all eight alloys in the as-cast and aged conditions were determined. Tensile strength was found to increase with the addition of Bi. Additionally, alloys containing 2 and 3 wt.% Bi showed a 5 to 10% increase in tensile strength after isothermal aging of 90 days at 125 °C. On the contrary, the tensile strength of alloys with up to 1 wt.% Bi decreased by 22 to 48% after such aging. Using a Scanning Electron Microscope (SEM) and energy dispersive spectroscopy (EDS), the microstructure of the alloys was characterized. The aging-induced property changes in the samples were correlated to strengthening by Bi solute atoms for alloys with 1 wt.% Bi and the formation of Bi precipitation for alloys with 2 wt.% and 3 wt.% Bi.

Improvement in thermal stability of ODS-W alloy through formation of complex oxide dispersoids

Thermal stability is a crucial issue for engineering application of tungsten, especially as plasma facing material in future fusion reactor. Two kinds of ODS-W alloys of W-0.5Y2O3 (WY) and W-0.5Y2O3-0.25Ti (WYT) were fabricated by ball milling and spark plasma sintering aiming at formation of oxide dispersoids with different crystallographic structures. Thermal stability of both ODS-W alloys was evaluated in terms of microhardness and microstructure evolution during isothermal aging at 1100 °C. Dispersoids of sesquioxide Y2O3 were identified in sintered WY, while pyrochlore Y2Ti2O7 with finer size and higher number density were developed in sintered WYT, resulting in higher bending strength of 1020 MPa and microhardness of 880 HV. Compared with sesquioxide Y2O3, complex dispersoids of pyrochlore Y2Ti2O7 exhibited much better coarsening resistance during isothermal aging at 1100 °C up to 100 h, where the intracrystalline and GB dispersoids maintained around 10 nm and 30 nm, respectively. The excellent coarsening resistance of complex Y2Ti2O7 with pyrochlore structure contributed to grain refinement and improved microstructure stability of WYT due to the effect of Zener drag.

The phase transformation and enhancing mechanical properties in high Zn/Mg ratio Al–Zn–Mg–Cu(-Si) alloys

Aging behavior and phase transformation of Al–5Zn–1Mg–1Cu(-Si) alloys under different isothermal temperatures were investigated using transmission electron microscope (TEM) and mechanical tests. The aging temperature and Si addition significantly influenced to the types of precipitated phases and mechanical properties of the Al–Zn–Mg–Cu alloys. Adding Si in this alloy changed the precipitated phases from T′ and η′ phases to the dual-sized η and GPB-II phases. With increasing isothermal aging temperature, more GPB-II phases formed in alloys with the same composition, effectively improving the microhardness and mechanical properties. When aging at 150 °C, 0.5 wt%Si-containing alloy reached the highest peak hardness of about 150HV and maintained stable hardness, while an alloy without Si only reached 120HV and later declined by 15HV. The tensile strength and yield strength of the 0.5 wt%Si-containing alloy were higher than those of non-Si alloy by 132 MPa and 165 MPa, increasing 51% and 90%, respectively. This result was due to the presence of fine and dispersed 4–8 nm GPB-II phases in 0.5 wt%Si-containing alloy. The GPB-II phase had a core-shell structure, with the core region mainly enriched in Mg and Si, and the shell region mainly enriched in Cu and Zn. Compared with the stability of T′ and η′ phases, this core-shell structure of GPB-II effectively inhibited its growth and beneficially maintained a smaller-sized GPB-II phase. The strengthening effect of GPB-II phase was better than that of η or T phases when aging at 150 °C or 200 °C. The mechanical properties of high Zn/Mg ratios Al–Zn–Mg–Cu alloys can enhanced by adding Si.

Finite-element stress and strain analysis of tin–silver–copper solders exposed to isothermal ageing at 100°C

This research aims to investigate the influence of pre-isothermal aging on the mechanical behaviour of 98.5Sn–1.0Ag-0.5Cu (SAC105) and 96.5Sn–3.0Ag–0.5Cu (SAC305) interconnects using non-linear finite-element simulations. To accomplish this, reliable literature sources are used to gather the material properties (both elastic and inelastic) of the aged SAC solders, which are then appropriately incorporated into the simulation process. Various aging durations, ranging from 1 to 6 months, are analysed. The results of the numerical computations demonstrate that the mechanical response of pre-aged SAC solders, subjected to thermal cycling, is significantly influenced by the ageing process. Specifically, the non-aged SAC305 configuration exhibits lower inelastic deformations and strain energies compared to the SAC105 system, indicating potentially better thermal fatigue performance. However, SAC105 solders generally exhibit greater resistance to aging, leading to lower levels of inelastic strains and strain energies, particularly for shorter aging durations. In general, it is expected that pre-aged SAC105 solders will demonstrate improved thermal fatigue performance compared to aged SAC305 interconnects.

Enhanced age hardening response of a Mg-Y alloy by Ca addition at an elevated temperature

The effect of Ca addition on the age hardening response and precipitation behavior of a Mg-7Y-0.5Zr (wt%) alloy during isothermal aging at 350 ℃ has been studied by hardness test and high-angle annular dark-field scanning transmission electron microscopy. The addition of 0.6 wt% Ca can effectively enhance the age hardening response of Mg-7Y-0.5Zr alloy at 350 ℃, and the enhanced hardness is mostly attributed to the uniform precipitation of a novel strengthening precipitate phase, designated βp. The βp phase forms as plates on {101̅0}α planes. It has a Cd45Sm11-type structure (space group F4̅3m, lattice parameter a = 2.24 nm) and a composition of Mg5Y0.8Ca0.2. Its orientation relationship with the α-Mg matrix phase is such that [1̅11]βp // [21̅1̅0]α and (110)βp // (0001)α. After prolonged aging at 350 ℃, the metastable phase βp can transform in-situ to the equilibrium phase β-Mg24Y5 with a cube-to-cube orientation relationship. The βp → β phase transformation is associated with the transition of constituent atomic clusters and the re-distribution of selected atoms within clusters.

Microstructure and mechanical behavior of Sn15Bi-xAg\Cu solder joints during isothermal aging

Purpose This paper aims to focus on the reliability of Sn15Bi–xAg and Sn15Bi–xCu solder joints during isothermal aging. Design/methodology/approach The effects of Ag or Cu additions on the microstructure, interfacial metallic compound layer and shear strength of Sn–15Bi (Sn15Bi) based solder joints during were investigated. The effects of Ag or Cu additions on the microstructure and tensile properties of Sn15Bi-based bulk solders were also investigated to provide a comprehensive analysis. The interfacial morphology and microstructure were observed by scanning electron microscopy and the composition in the structure was examined by energy dispersive spectrometer. The shear tests were carried out on the as-soldered and as-aged joints using a ball shear tester. Findings The results revealed that by adding Ag or Cu, the microstructure of Sn15Bi solder can be refined. Ag addition increased the tensile strength of Sn15Bi solder but had little effect on elongation. However, Cu addition decreased the tensile strength and elongation of Sn15Bi solder. For solder joints, Ag addition increased the shear strength and toughness of Sn15Bi/Cu joints but Cu addition decreased the shear strength and toughness of Sn15Bi/Cu joints. Originality/value The authors can potentially provide a replacement for Sn40Pb traditional solder with Sn15Bi solder by alloying Ag or Cu due to its lower cost and similar melting point as Sn–Pb solder.

Isothermal aging treatment and its effect on the mechanical properties of Fe-Cr-Mn high-nitrogen austenitic steel

The high-temperature solution nitriding process is a suitable treatment for producing high-nitrogen steels by the diffusion of nitrogen from the surface to the center of steels under high nitrogen pressure at high temperatures. On the other hand, long-term solution nitriding at high temperatures can cause the formation of coarse-grained austenite. This study focused on the grain size, strength, and elongation properties of Fe-Cr-Mn high-nitrogen austenitic steels by isothermal aging. For this purpose, we produced high-nitrogen steels by three-step phase transformations: (i) high-temperature solution nitriding, (ii) isothermal aging, and (iii) reaustenitization. After solution nitriding, high-nitrogen austenitic steel was treated with isothermal aging to induce austenite decomposition. Supersaturated austenite (ϒ) transformed to less nitrogen-saturated austenite (ϒ′) and discontinuous cellular precipitation (DCP) during the isothermal aging treatment. Subsequently, the decomposed structure was reversed into austenite through reaustenitization. The results suggested that austenite grain refinement and increasing hardness were achieved by nucleating reversed austenite grains after reaustenitization treatment. On the other hand, a noticeable increase in elongation appeared after reaustenitization treatment for 30 min.

Effect of isothermal aging on Poly(N-isopropylacrylamide): Correlation between chemical structure and phase transition temperature property

Poly(N-isopropylacrylamide) (PNIPAm) is a stimuli-responsive polymer with wide applications as a scaffold in biomedical applications. This study presents the PNIPAm's thermoresponsive behavior during storage and its stability in potential pharmaceutical formulations as a drug delivery excipient. Therefore, the turbidity curves of linear PNIPAm aqueous solutions are investigated before and after its thermal oxidation under air at 120°C and 130°C. First, PNIPAm aqueous phase separation diagram is determined for unaged polymer and then compared to thermally aged samples at two distinct points (1 and 10%(w/w)). After isothermal aging, the transition temperature has increased with a shift up to 4°C. The correlation between PNIPAm's chemical structure and phase transition temperature properties is illustrated in terms of chemical modifications, macromolecular changes as well as the polar/non-polar groups balance. It is observed that the water affinity and glass transition temperature (Tg) have increased at the macromolecular level. In addition, chains scissions are highlighted and seem to explain the shift of transition temperature. Chemical changes have revealed the presence of supplementary polar groups induced by aging. This multiscale study suggests a possible mechanism for the partial thermal oxidation based on all the observations.

Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging

This paper studies how isothermal aging affects the micromechanical and structural properties of mixed solder joints made of 60Sn-40Pb (SnPb) with Sn-3.0Ag-0.5Cu (SAC305) and SnPb with Sn-0.7Cu (SnCu). The nanoindentation test was done to measure the micromechanical properties of SnPb/SAC305 and SnPb/SnCu mixed solder joints. These properties are hardness, reduced modulus, and stress exponent. Scanning electron microscopy (SEM) was used to look at the microstructure of a cross-section of mixed solder joints. The micrographs that were taken were then examined with open-source image processing software called ImageJ. It was found that the rate and distribution of intermetallic compound (IMC) formation and the reduction of Sn-rich phase grain size affect how the hardness and stress exponent values of mixed solder joints change after 1000 h of high temperature storage (HTS). ImageJ analysis shows that the Pb-rich phase particle count and distribution can be used to figure out how mixed solder joints respond to indentation creep and how that relates to isothermal aging. Using ImageJ, it’s clear that the indentation creep behavior of the GBS mechanism of an as soldered SnPb/SnCu mixed solder joint is caused by the highest number and size of Pb-rich phase particles that are not well distributed across the dendritic area of Sn-rich phase grain boundaries.

Nanoprecipitation induced giant magnetostriction: A time-resolved small-angle neutron scattering study of the vacancy-assisted kinetics

Solid-state precipitation is an effective strategy for tuning the mechanical and functional properties of advanced alloys. Structure design and modification necessitate good knowledge of the kinetic evolution of precipitates during fabrication, which is strongly correlated with defect concentration. For Fe-Ga alloys, giant magnetostriction can be induced by the precipitation of the nanoscale tetragonal L60 phase. By introducing quenched-in vacancies, we significantly enhance the magnetostriction of the aged Fe81Ga19 polycrystalline alloys to ∼305 ppm, which is close to the level of single crystals. Although vacancies were found to facilitate the generation of the L60 phase, their impact on the precipitation mechanism and kinetics has yet to be revealed. This study combined transmission electron microscopy (TEM) and time-resolved small-angle neutron scattering (SANS) to investigate the precipitation of the L60 phase during the isothermal aging at 350 and 400 °C, respectively. The evolution of L60 nanophase in morphology and number density in as-cast (AC) and liquid nitrogen quenched (LN) Fe81Ga19 alloys with aging time were quantitatively compared. Interestingly, the nucleation of the L60 phase proceeds progressively in AC while suddenly in LN specimens, indicating the homogenous to heterogeneous mechanism switching induced by concentrated vacancies. Moreover, excess vacancies can change the shape of nanoprecipitates and significantly accelerate the growth and coarsening kinetics. The magnetostrictive coefficient is optimized when the size (long-axis) of L60 precipitates lies between 100 and 110 Å with a number density between 3.2–4.3 × 10–7 Å–3. Insight from this study validates the feasibility of achieving high magnetoelastic properties through precise manipulation of the nanostructure.

The precipitation and corrosion behaviour of cast Al–Mg–(0.7, 1.3) Li–Cu alloys

Achieving the development of ultra-light Al–Li alloys with high strength and excellent corrosion resistance is always a challenge. In this study, the precipitation characteristics and electrochemical corrosion behaviours after isothermal aging of cast Al–Li alloys with two different Li contents were comparatively analysed. The results showed that the increase in Li content from 0.7 wt-% to 1.3 wt-% retarded the peak hardening and improved the Al–Li alloy hardness and strength by promoting the precipitation of the S′ (Al2CuMg) and T1 (Al2CuLi) phases. Besides, the galvanic coupling corrosion of the alloying element Cu with the aluminium matrix was reduced by more Li addition, thus improving the corrosion resistance of the alloy.

The Effect of Ageing on Phase Transformations and Mechanical Behaviour in Ni-Rich NiTi Alloys.

In this article, the results of research on a NiTi alloy with a high nickel content (51.7 at.%), produced using the additive technology SLM method and subjected to isothermal ageing after solution annealing, are presented. The study involved the determination of the sequence of phase transformations occurring using differential scanning calorimetry (DSC) and the determination of the temperature range of these transformations. In parallel, the phase composition was determined using the XRD method; the hardness and the Young's modulus were also determined. The analysis of the DSC results obtained indicates the following characteristic features of the NiTi alloy, which change with ageing time: (1) During cooling (from +150 °C to -50 °C), the type of transformation changes from a one-step transformation after solution annealing to a two-step transformation after the ageing process over 1, 20, and 100 h at 500 °C; (2) during heating (from -50 °C to +150 °C) for all the samples, regardless of the ageing time, only a one-step transformation from martensite M(B19') to austenite A(B2) is observed; (3) the temperature at which the transformation starts increases with the ageing time; (4) the width of the total temperature range of the transformation M(B19') → A(B2) during heating changes from large (ΔT = 49.7 °C), after solution annealing, to narrow (ΔT = 19.3 °C and ΔT = 17.9 °C after 20 h and 100 h of ageing); and, most importantly, (5) a comparison with the literature data shows that, irrespective of the composition of the NiTi alloy and the manufacturing technology of the alloy samples (regardless of whether this was traditional or additive technology), a sufficiently long ageing process period leads to the occurrence of the martensite → austenite transformation in the same temperature range.

Metallographic and Extraction Replica Methods for Characterization of Tungsten Heavy Alloy: H13 Clads

Tungsten heavy alloys are used in demanding high pressure die casting applications due to their high temperature strength, high thermal conductivity, and low thermal expansion. High cost limits applications to small sintered die inserts and manual gas tungsten arc weld repairs. A new tungsten heavy alloy consumable, Anviloy wire, was developed for automated cladding of hot work tool steel dies. Literature regarding characterization of tungsten heavy alloy die steel clads was lacking. Understanding base metal dilution effect on clad microstructure is critical but required new sample preparation methods. An Anviloy wire-H13 clad was made using hot wire gas tungsten arc cladding and analyzed with metallography. Samples were found to have grain boundary M6C carbide phase as-welded with the help of an alkaline sodium picrate etchant. An isothermally aged arc crucible melted sample of the same composition was characterized using metallography, scanning electron microscopy, and transmission electron diffraction. The clad representative arc crucible melted sample was subjected to isothermal aging at 725°C for 100 hours. Isothermal aging resulted in precipitation of a high volume fraction of intermetallic platelets. Using a new carbon extraction replica sample preparation method involving two chemical polishing steps, transmission electron diffraction of precipitates indicated they were mu phase intermetallic.

Constructing high-density dislocations by primary (Nb,Ti)(C,N) to induce massive secondary precipitations in austenitic heat-resistant cast steel

The microstructural evolution and the high-temperature tensile properties of a novel Nb-Ti-N alloyed austenitic heat-resistant cast steel were investigated during the isothermal aging at 900 °C for up to 1000 h. The mechanisms of enhancing strength-ductility synergy and the high-temperature tensile fracture behaviors after the aging process were analyzed in detail through tensile tests at 900 °C. Obtained results show that the high-density dislocation regions and the Cr segregation, formed around the intragranular primary (Nb,Ti)(C,N), provided numerous nucleation sites for submicron-sized secondary M23C6 precipitates. The density of secondary M23C6 significantly increased, while the coarsening rate was notably reduced during the aging process. Simultaneously, the uniform dispersed precipitation of nano-sized secondary (Nb,Ti)C was promoted by massive dislocations, which exhibited high resistance to coarsening during long-term aging. The improvement of high-temperature strength was attributed to the precipitation strengthening effects induced by the submicron-sized M23C6 and nano-sized (Nb,Ti)C particles. Additionally, the enhancement of ductility during aging was mainly due to the more effective stress transmission and the ameliorated interface relationship between primary (Nb,Ti)(C,N) and austenitic matrix, which was facilitated by the abundant precipitation of secondary phases. The current findings indicate that high-density dislocations constructed by the intragranular primary (Nb,Ti)(C,N) induce the extensive dispersion of secondary strengthening phases, which enhanced both ultimate tensile strength of 158 MPa and elongation of 45.3% at 900 °C after isothermal aging for 1000 h.

Rapid-thermal-process pre-treatment promoted precipitation towards strengthening hard magnetism of Sm2Co17-type magnets

Dislocations can act as heterogeneous nucleation sites but their annihilations upon heating sacrifice point defects nearby, weakening the driving force for precipitate nucleation. In order to keep a high density of dislocations and point defects together, here rapid-thermal-process (RTP) pre-treatment was carried out to promote the precipitate nucleation in Sm2Co17-type permanent magnets that evolve gradual formation and dissociation of dislocations during concurrent precipitation and recrystallization. As exhibited in a model magnet Sm25Co49.3Fe17.1Cu5.6Zr3.0 (wt.%) with high-density dislocations at solution-treated state, the RTP pre-treatment can induce excess point defects owing to the migration of solute atoms towards equilibrium state and the quenching of point defects, and suppress the early-stage diffusion-controlled dissociation of dislocations. After whole-process isothermal aging and slow cooling, the RTP pre-treated magnet possesses much higher fraction of hexagonal SmCo5 (1:5H) nanoprecipitates than the non-pre-treated one, giving rise to effective enhancements in coercivity Hcj from 26.20 to 30.34 kOe and in knee-point field Hk from 14.43 to 19.20 kOe. These findings add insight into controlling precipitation in dislocation-bearing supersaturated solid solutions, which are feasible for strengthening the Sm-Co-based magnets.

Thermal aging behavior and heat resistance mechanism of ultraviolet crosslinked ultra‐high molecular weight polyethylene fiber

AbstractAs advances in heat resistant ultrahigh molecular weight polyethylene (UHMWPE) fiber via ultraviolet (UV) crosslinking, it is worth paying attention to its thermal aging behavior and heat resistance mechanism. UHMWPE fibers in different forms, the fully drawn yarn (FDY) and the UV crosslinked FDY (UVFDY), are subjected to isothermal aging at 135°C. The effects of thermal aging on their surface morphology and mechanical properties are studied and compared initially. The results demonstrate that UVFDY is a kind of a heat‐resistant fiber. Subsequently, to reveal the heat resistance mechanism of UVFDY, its crystalline and orientation structure evolution during thermal aging are further studied. It is indicated that the formation of dense‐packing crystals and disorientation behavior lead to fiber shrink, so that a number of grooves appear on the fiber surface. Since the crosslinked stucture of UVFDY hinders its molecules movement, the crystallization and disorientation behavior of UVFDY are weaker than those of FDY, resulting in UVFDY possesses slighter thermal shrinkage (Ts), fewer grooves and better mechanical properties than those of FDY. Therefore, the heat resistance of the fiber improves effectively after UV crosslinking. This work provides insights into the structure–property relationship of UVFDY during thermal aging, and offers basis data for its application in specific conditions.

Reactive diffusion at the interface between Cu and Sn–Ag alloys

This study investigates the microstructural evolution and growth behavior of intermetallic compound (IMC) layers in the Cu/(Sn-yAg, y = 0.29–2.00 wt%) system during isothermal aging within the temperature range of 433–473 K. Through systematic variations in Ag content, aging temperature, and time, the fundamental mechanisms governing IMC formation and growth in Cu/(Sn–Ag) solder joints are elucidated. The results demonstrate that IMC growth kinetics follow a power-law relationship, with IMC layer thickness increasing systematically with annealing time. The addition of Ag significantly influences IMC nucleation and growth, with higher Ag content correlating with faster growth rates. Furthermore, the temperature dependence of IMC growth rates is investigated, revealing higher temperatures leading to increased growth rates, indicative of boundary diffusion-controlled growth. By calculating activation enthalpies, values of 36.4 kJ/mol for Sn-2.00Ag and 30.2 kJ/mol for Sn-0.50Ag were obtained, providing quantitative insights into the faster growth rate of intermetallic compound thickness in the Cu/(Sn-2.00Ag) diffusion couple within the experimental temperature range. These findings offer valuable insights into factors affecting the reliability and performance of solder joints in electronic packaging applications.