Effect of Bi on the Tensile and Viscoplastic Behavior of Sn-Ag-Cu-Bi Alloys Used for Microelectronics Applications

Abstract

Sn-Ag-Cu-Bi (SAC-Bi) alloys are gaining popularity as a potential replacement for current lead-free solder alloys in microelectronic packages. In this study, the tensile and viscoplastic behaviors of eight SAC-Bi alloys with 0, 1 wt.%, 2 wt.%, and 3 wt.% Bi content were investigated. The samples of these eight alloys were cast, aged at room temperature, 75 °C and 125 °C, and tensile-tested at rates of 0.1/s, 0.01/s, and 0.001/s in ambient and elevated temperature environments to facilitate the quantification of viscoplasticity using the Anand viscoplastic model. The Anand parameters of all eight alloys in the as-cast and aged conditions were determined. Tensile strength was found to increase with the addition of Bi. Additionally, alloys containing 2 and 3 wt.% Bi showed a 5 to 10% increase in tensile strength after isothermal aging of 90 days at 125 °C. On the contrary, the tensile strength of alloys with up to 1 wt.% Bi decreased by 22 to 48% after such aging. Using a Scanning Electron Microscope (SEM) and energy dispersive spectroscopy (EDS), the microstructure of the alloys was characterized. The aging-induced property changes in the samples were correlated to strengthening by Bi solute atoms for alloys with 1 wt.% Bi and the formation of Bi precipitation for alloys with 2 wt.% and 3 wt.% Bi.