Among the two dimensional (2D) transition metal dichalcogenides (TMDCs), tungsten diselenide (WSe2) have recently attracted much attention owing to its potential in CMOS technology, optoelectronics and high-speed device applications. One of the most challenging aspect in designing high performance devices is the metal-semiconductor interface. In this context, the potential of 2D materials even grows bigger because of their dangling-bond-free surface which leads to excellent interface quality. Additionally, the role of the contact metals also becomes very important as it explicitly determines the charge transport, carrier mobility, switching speed etc. In this work, WSe2 based field-effect transistors (FETs) were fabricated using different metal contacts such as Au (ϕm ∼ 5.47 eV) with Ti as adhesion layer, Mo (ϕm ∼ 4.53 eV) and Al (ϕm ∼ 4.08 eV). It was found that the charge transport properties in WSe2 changed from p-type (Au), then to ambipolar (Mo) and finally to n-type (Al) as work functions of the metals changed from high to low. Moreover, the effect of post-fabrication annealing was also studied, and it was found that the mobility increased up to ∼625 cm2/V-s, ∼410 cm2/V-s, and ∼366 cm2/V-s, for Au/Ti/WSe2, Mo/WSe2 and Al/WSe2 FETs respectively as a result of annealing. Finally, the interface properties were analyzed by determining the interface state densities Dit in the metal-2D WSe2 junctions and the values of Dit were found to decrease by an order of magnitude post-annealing treatment such as ∼4.65 × 1012 cm2 eV−1 for Au/Ti/WSe2, 1.08 × 1013 cm2 eV−1 for Mo/WSe2 and 2.28×1012 cm2 eV−1 for Al/WSe2 junctions. Our work shows the tunable charge transport properties in 2D WSe2 which is highly desirable for CMOS digital logic applications and the influence of annealing in improving the transport and interface state properties in 2D WSe2 FETs.
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