The productivity of semiconductor processing equipment can be expressed as the product of three factors: yield, throughput and availability. In this article new systems and equipment features for high productivity, developed at Varian for ion implantation and rapid thermal processing, will be reviewed. Yield-related features will be highlighted by real-time monitoring and control capabilities for critical process issues, such as uniformity, wafer charging, wafer temperature control, particulates, etc. Throughput enhancement features, such as those provided by increased beam current, new wafer cooling technology, high-speed wafer handling with integral wafer orientation and centering functions, and automation, will be presented. Availability improvements will focus on such system design aspects as control systems (including diagnostics, predictive maintenance and user-friendly setup capability), intelligent wafer-handling technology, vacuum system design and serviceability features. In the selection of examples particular emphasis will be placed on features of our new high-current ion implanter.
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