High-temperature Pb-free Solders Research Articles

Thermodynamic Modeling of the Au-Ge-X (X = In, Sb, Si, Zn) Ternary Systems.

In this study, the CALPHAD approach was employed to model the thermodynamics of the Au-Ge-X (X = In, Sb, Si, Zn) ternary systems, leveraging experimental phase equilibria data and previous assessments of related binary subsystems. The solution phases were modeled as substitutional solutions, and their excess Gibbs energies were expressed using the Redlich-Kister polynomial. Owing to the unavailability of experimental data, the solubility of the third elements in the Au-In, Au-Sb, and Au-Zn binary intermetallic compounds was excluded from consideration. Additionally, stable ternary intermetallic compounds were not reported in the literature and, thus, were not taken into account in the present thermodynamic calculations. Calculations of liquidus projections, isothermal sections, and vertical sections for these ternary systems have been performed, aligning with existing experimental findings. These thermodynamic parameters form a vital basis for creating a comprehensive thermodynamic database for Au-Ge-based alloys, which is essential for the design and development of new high-temperature Pb-free solders.

A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications

Sn-based high-temperature lead-free (HTLF) solder pastes have been developed as a drop-in solution to replace the high-Pb solder pastes in power discrete applications. The pastes were designed to combine the merits of two constituent powders. A SnSbCuAg powder, with the melting temperature above 320°C, was designed to maintain a high-temperature performance. A SnAgCuSb powder, with a melting temperature around 228°C, was added to the paste to enhance wetting and improve joint ductility. In the design, the final joint will have the low-melting phase (the melting temperature >228oC) in a controllable quantity embedded into the high-melting SnSbCuAg matrix. HTLF-1, one of the designs, maintained the bond shear strength up to 15MPa, even around 290°C. Another design, HTLF-2, has a similar bond shear strength as Pb92.5/Sn5/Ag2.5 around 290°C, but exceeds substantially below 250°C. The power discrete components had been built with both HTLF solder pastes for both die-attach and clip-bond through the traditional high-Pb process, which demonstrated the drop-in processing compatibility. The components survived three additional SMT reflows (peak temperature of 260°C) and passed moisture sensitivity level 1. This confirmed that the maintained joint strength (comparable to or stronger than high-lead), helped to keep the joint integrity within the encapsulated components, even with melting phases in a controllable quantity existing above 228°C. Both HTLF solder pastes outperformed Pb92.5/Sn5/Ag2.5 in RDS(on) even after 1000cycles of TCT (-55/175oC), which is attributed to the intrinsic lower electrical resistivity of Sn of both HTLF pastes. Microstructural observation had shown no corner cracks for both die-attach and clip-bond joints after TCT.

A Drop-in High-Temperature Pb-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications

Sn-based high-temperature lead-free (HTLF) solder pastes have been developed as a drop-in solution to replace the high-Pb solder pastes in power discrete applications. The pastes were designed to combine the merits of two constituent powders. A SnSb-based Ag/Cu-containing high temperature powder, with the melting temperature above 320° C, was designed to maintain a high-temperature performance. A Sn-rich SnAgCu-Sb powder, with a melting temperature around 228° C, was added to the paste to enhance wetting and improve joint ductility. In the design, the final joint will have the low-melting phase (the melting temperature >228o C) in a controllable quantity embedded into the high-melting SnSb matrix. HTLF-1, one of the designs, maintained the bond shear strength up to 15MPa, even around 290° C. Another design, HTLF-2, has a similar bond shear strength as Pb92.5/Sn5/Ag2.5 around 290° C, but exceeds substantially below 250° C. The power discrete components had been built with both HTLF solder pastes for both die-attach and clip-bond through the traditional high-Pb process, which demonstrated the drop-in processing compatibility. The components survived three additional SMT reflows (peak temperature of 260° C) and passed moisture sensitivity level 1. This confirmed that the maintained joint strength (comparable to or stronger than high-lead), helped to keep the joint integrity within the encapsulated components in the following SMT process, even with the controlled quantity of the melting phases above 228° C. Both HTLF solder pastes outperformed Pb92.5/Sn5/Ag2.5 in the resistance from drain to source when power is on (RDS(on)), even after 1000cycles of TCT (-55/175o C), which is attributed to the intrinsic lower electrical resistivity of Sn of both HTLF pastes. Microstructural observation had shown no corner cracks for both die-attach and clip-bond joints after TCT.

A Drop-In High-Temperature Pb-Free Solder Paste That Outperforms High-Pb Pastes in Power Discrete Applications

Sn-based high-temperature Pb-free (HTLF) solder pastes have been developed as a drop-in solution to replace high- Pb solder pastes in power discrete applications. The pastes were designed with Indium Corporation’s DurafuseVR technology, to combine the merits of two constituent powders. A SnSb-based Ag/ Cu-containing high-temperature powder, with a melting temperature above 320 degrees C, was designed to maintain high-temperature performance. A Sn-rich SnAgCu-Sb powder, with a melting temperature around 228 degrees C, was added to the paste to enhance wetting and improve joint ductility. In the design, the final joint will have the low-melting phase (the melting temperature >228 degrees C) in a controllable quantity embedded into the high-melting SnSb matrix. HTLF-1, one of the designs, maintained the bond shear strength up to 15 MPa, even around 290 degrees C. Another design, HTLF-2, has a similar bond shear strength as Pb92.5/Sn5/Ag2.5 around 290 degrees C, but exceeds substantially below 250 degrees C. The power discrete components had been built with both HTLF solder pastes for both die-attach and clip-bond through the traditional high-Pb process, which demonstrated the drop-in processing compatibility. The components survived three additional surface mounting (SMT) reflows (peak temperature upto 260 degrees C) and passed moisture sensitivity level 1 (MSL1). This confirmed that the maintained joint strength (comparable to or stronger than high-Pb), helped to keep the joint integrity within the encapsulated components in the following SMT process, even with the controlled quantity of the melting phases above 228 degrees C. Both HTLF solder pastes outperformed Pb92.5/Sn5/Ag2.5 in the resistance from drain to source when power is on (RDS(on)), even after 1,000 cycles of temperature cycling test (TCT) under 255/175 degrees C, which is attributed to the intrinsic lower electrical resistivity of Sn in both HTLF pastes. Microstructural observation had shown no corner cracks for both die-attach and clip-bond joints after TCT.

The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder

PurposeThis study aims to study the impact of intermetallic compound on microstructure, mechanical characteristics and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder.Design/methodology/approachIn this paper, a new group of lead-free high-temperature Pb-free solder bearing alloys with five weight percentages of different silver additions, Bi-Agx (x = 3.0, 3.5, 4.0, 4.5 and 5.0 Wt.%) have been developed by rapidly solidification processing (RSP) using melt-spun technique as a promising candidate for the replacement of conventional Sn-37Pb common solder. The effect of the addition of a small amount of Ag on the structure, microstructure, thermal and properties of Bi-Ag solder was analyzed by means of X-ray diffractometer, scanning electron microscopy, differential scanning calorimetry and Vickers hardness technique. Applying the RSP commonly results in departures from conventional microstructures, giving an improvement of grain refinement. Furthermore, the grain size of rhombohedral hexagonal phase Bi solid solution and cubic IMC Bi0.97Ag0.03 phase is refined by Ag addition. Microstructure analysis of the as soldered revealed that relatively uniform distribution, equiaxed refined grains of secondary IMC Bi0.97Ag0.03 particles about 10 µm for Bi-Ag4.5 dispersed in a Bi matrix. The addition of trace Ag led to a decrease in the solidus and liquidus temperatures of solder, meanwhile, the mushy zone is about 11.4°C and the melting of Sn-Ag4.5 solder was found to be 261.42°C which is lower compared with the Sn-Ag3 solder 263.60°C. This means that the silver additions into Bi enhance the melting point. The results indicate that an obvious change in electrical resistivity (?) at room temperature was noticed by the Ag addition. It was also observed that the Vickers microhardness (Hv) was increased with Ag increasing from 118 to 152 MPa. This study recommended the use of the Bi-Ag lead-free solder alloys for higher temperature applications.FindingsSilver content is very important for the soldering process and solder joint reliability. Based on the present investigations described in this study, several conclusions were found regarding an evaluation of microstructural and mechanical deformation behavior of various Bi-Ag solders. The effect of Ag and rapid solidification on the melting characteristics, and microstructure of Bi-Ag alloys were studied. In addition, the mechanical properties of Bi with different low silver were investigated. From the present experimental study, the following conclusions can be drawn. The addition of Ag had a marked effect on the melting temperature of the lead-free solder alloys, it decreases the melting temperature of the alloy from 263.6 to 261.42°C. Bi-Ag solders are comprised of rhombohedral Hex. Bi solid solution and cubic Ag0.97Bi0.03 IMC is formed in the Bi matrix. The alloying of Ag could refine the primary Bi phase and the Bi0.97Ag0.03 IMC. With increasing Ag content, the microstructure of the Bi-Ag gradually changes from large dimples into tiny dimple-like structures. The refinement of IMC grains was restrained after silver particles were added into the matrix. The inhibition effect on the growth of IMC grains was most conspicuous when solder was doped with Ag particles. As a result, the Vickers microhardness of the Bi-Ag lead-free solder alloys was enhanced by more than 100% ranging from 118.34 to 252.95 MPa. Bi-Ag high-temperature lead-free solders are a potential candidate for replacing the tin-lead solder (Sn-37Pb) materials which are toxic to human and the environment and has already been banned.Originality/valueThis study recommended the use of the Bi-Ag lead-free solder alloys for high-temperature applications.

In-situ observation of high-temperature Pb-free electric interconnections by synchrotron microradiography

Despite a large amount of research on transient liquid phase (TLP) bonding methods for high operating temperature Pb-free solder electric interconnections using Cu6Sn5 intermetallics (IMCs), two fundamental difficulties remain, namely, slow TLP process kinetics and uncontrolled void formation. Here we observe the TLP processes for rapid Cu6Sn5 growth using a recently developed technique via real-time synchrotron X-ray imaging. The technique enables in-situ characterization of the growth kinetics and real-time observation of the IMC evolution at the molten solder/solid substrate interfaces and the formation of voids and cracking during TLP bonding, which will contribute to the development of products suitable for high reliability and high-temperature applications, e.g., electric vehicles.

Investigations of high-temperature tensile properties of Zn–25Sn–x(0.1–0.2)Cu–y(0.01–0.02)Ti high-temperature Pb-free solders

The use of Pb-containing solders in electronic products has been restricted due to their harm to both human health and the environment. Although the Sn–37Pb solder has been well replaced by Sn–3.0Ag–0.5Cu or other Pb-free solders, there is no drop in replacement for high-temperature Pb-free solders. In this study, the microstructure and high-temperature tensile properties of the Zn–25Sn–x(0.1–0.2)Cu–y(0.01–0.02)Ti high-temperature Pb-free solders were investigated. The design of the moderate alloy composition prevented undesirable Cu- and Ti-containing intermetallic compound formation that may cause alloy embrittlement. The solders exhibit superior tensile strength and competitive elongation compared with the conventional high-Pb solders and the other potential candidates. The Zn–25Sn–xCu–yTi solders can be strengthened in terms of the tensile strength enhancement without a loss of ductility under both room-temperature and high-temperature testing conditions. The minor Cu and Ti elements served as heterogeneous nucleation sites for inducing the microstructure refinement of the primary (Zn) phase. The Cu-in-Zn solid solution phenomenon as well as the formation of deformation twins during the high-temperature tensile test also contributed to the superior tensile properties of the designed alloys.

The Electronic Packaging Interconnect Technology Symposium (EPITS 2019)

24-25 November 2019PrefaceEPITS 2019 provides an excellent opportunity for intellectual discourse on demonstration of advances and research results in the fields of electronic packaging interconnect technology and green materials. This conference brings together all academics, researchers, engineers and scientists around the world contributing to the global debate on these fields. Topics of interest or submission include, but are not limited to;• Challenges in improving the reliability of Tin (Sn) base Pb-free solder alloys.• Challenges in implementing the Restriction of Hazardous Substances (RoHS).• Emerging interconnect and green materials technologies.• Non-solder interconnect materials at chip and package levels.• Fundamental materials behavior for electronic packaging materials and green materials.• Electromigration, thermomigration, stress-migration and mechanical effects on materials developments.• Advanced characterization methods as applied to electronic packaging technology and materials processing and technology• Whisker growth in tin, tin-based alloys and other metallic systems related to electronic packaging materials.• Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics

Joint effects of Ti and Cu additions on microstructure and mechanical properties of Zn-25Sn-xCu-yTi high-temperature Pb-free solders

The aim of the present study is to investigate the joint effects of Ti and Cu additions on mechanical properties of high-temperature Zn–25Sn-x(0.1–0.4)Cu-y(0.01–0.04)Ti Pb-free solders. The microstructures, tensile properties, and micro-hardness of the cast Zn–25Sn-xCu-yTi solders were investigated. The results delineate that the appropriate combination of Cu and Ti additions can enhance the ultimate tensile strength and micro-hardness of the Zn–25Sn solder without a loss of ductility. The enhancement of mechanical properties was attributed to grain refining by Ti addition and solid-solution strengthening by Cu addition. Among the various xCu-yTi compositions investigated, the Zn–25Sn-(0.1–0.2Cu)-0.02Ti appear to be promising high-temperature Pb-free solder alternatives based on the mechanical properties evaluations.

The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders

The effects of Cu alloying on the microstructure and mechanical properties of Zn-25Sn-xCu (x = 0–1.0 wt%) high temperature Pb-free solders were investigated in the present study. The 1 wt% Cu alloying enhanced the ultimate tensile strength and the micro-hardness of the primary η-Zn phase by 23.1% and 144.0% increments, respectively. These mechanical property variations were attributed to the combined effects of grain refining strengthening of the primary η-Zn phases, precipitation strengthening of the fine ε-CuZn5 compounds in the η-Zn matrix (Cu content greater than 0.3 wt%), and solid-solution strengthening of the Cu inclusion in the η-Zn matrix. The granular two-phase (η-Zn + ε-CuZn5) microstructure, composed of refined η-Zn matrix and fine ε-CuZn5 precipitations, contributed to superior mechanical strength of the Zn-25Sn-xCu high temperature Pb-free solders.

Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

This study investigated the effect of Ti content on microstructure and mechanical properties of the high temperature Pb-free solder Zn25SnxTi (x = 0–0.06). The SEM microstructure images show that the addition of Ti refined the grain size of the Zn-rich phases. It was evident that the addition of Ti tends to refine the grain size of the Zn-rich phase at the eutectic structure. The ultimate tensile strength, elongation, and toughness of the alloys were investigated with respect to Ti addition. The Zn25Sn0.02Ti exhibits the largest elongation and the best toughness among all the solders investigated. The microstructure and the fractograph of the alloys show the formation of ternary Ti–Sn–Zn compounds at the addition of 0.03%Ti and above. The variation in toughness with respect to Ti content was ascribed to the combination effect of grain refining and the formation of the intermetallic compound.

The microstructure and mechanical properties of Zn-25Sn-XAl (X=0–0.09 wt%) high temperature lead free solder

The microstructure and mechanical properties of Zn-25Sn-XAl ( X=0, 0.01, 0.03, 0.05, 0.09wt% ) high temperature Pb-free solders were investigated. The addition of Al tends to refine the grain size and depress the undercooling behavior of the solder. The needle-like zinc-rich phase of the eutectic region was coarsened upon Al addition. The increasing addition of Al up to 0.09wt% enhanced the ultimate tensile strength (UTS) of the alloy from 67.28 to 78.61MPa (16.84% improved), and the yield strength from 42.52 to 52.81MPa (24.2% improved). The strain of the solder degraded from 39.02–32.83% when the addition of Al ranged from 0 to 0.09wt%.

Study of off-eutectic Zn–xMg high temperature solder alloys

Researchers have been working for some times to develop a Pb-free substitute for high-Pb containing solders in electronics. In this study the effect of Mg content on microstructure, melting behavior, thermal, electrical and mechanical properties of a new high-temperature Pb-free solder based on binary Zn–Mg alloy were investigated. The nominal compositions of Zn–xMg (x = 0.5–6.0) alloys were synthesized by conventional melting and casting route. The microstructures of the solders changed significantly on adding Mg content. Higher Mg containing alloys were found rich in intermetallic phases. The formation of the Mg2Zn11 and metastable MgZn2 intermetallic phases were identified and were also quantified by X-ray diffraction analysis. The presence of higher amount of intermetallic compounds in hypereutectic Zn–Mg systems deteriorated the tensile properties of the binary alloy. The results of electrical resistivity test indicated that the Mg could elevate the resistivity of newly developed Zn–Mg alloys. The melting behavior of the solder alloys studied by differential thermal analysis (DTA) analysis revealed that the melting temperature range of the solder alloys narrowed with Mg addition. Thermal mechanical analysis (TMA) analysis revealed that the co-efficient of thermal expansion (CTE) decreased on increasing Mg content.

Thermodynamic Calculation of Bi-Au-Lu, Nd Ternary Systems

With available melting point and hardness, the Bi-based filler alloy is considered as one choice of high-temperature Pb-free solder. Phase diagram can play an important role in the design of new type of Pb-free solder.In the present work, the thermodynamic assessments of the Au-Nd and the Au-Lu binary systems have been carried out by the Calculation of Phase Diagram (CALPHAD) method based on the available experimental data. The Gibbs free energies of the solution phases were described by subregular solution models with the Redlich-Kister equation, and those of the intermetallic compounds were described by sublattice models. A set of self-consistent and reasonable thermodynamic parameters is obtained for the binary systems, which describes the Gibbs energies of the solution phases and the intermetallic compounds phases. Additionally, combined the reported Bi-Au, Bi-Lu and Bi-Nd binary systems, the thermodynamic database of the Bi-Au-Lu and the Bi-Au-Nd ternary systems have been developed, which will provide important thermodynamic information for the phase equilibria of the multicomponent Bi-based alloy systems.

The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling

The explosion of high density and high temperature electronic devices is intensifying the desire for high temperature Pb-free solders. Alloying high melting point elements with conventional solders is one of the most potential solutions drawing attention. In this paper, the relationship between cracking and microstructure evolution of SnAgCu and Ni, Sb, Bi alloyed SnAgCu solders during thermal cycling was systematically studied and compared by ultrasonic C-scanning, SEM, EDX, EBSD, etc. It turned out that alloying Ni, Sb, Bi with SnAgCu solder offered better crack resistance by strengthening and recrystallization energy consumption before ~600 cycles. However, its failure dramatically accelerated after those cycles because of the large amount of grain boundaries caused by severe early recrystallization, the coarsened IMCs, and the decrease of Schmid Factor as SnAgCu were softened, while SnAgCuNiSbBi can be excessively hardened by thermal cycles.

Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

A Novel Electronic Packaging Method to Replace High-Temperature Sn-Pb Solders

The In/Ni/Cu/Ni/In multilayer was prepared by an electroplating method to replace high-temperature Sn-Pb solders that are conventionally used but are very harmful to the environment. This study shows all the sandwich couples that formed the (Cu,Ni)6(Sn,In)5 and Cu2In3Sn phases at the interface. When the solder joint was reflowed at 200°C, a planar layer (Ni,Cu)3(Sn,In)4 formed near the Ni layer. When the reflowing temperature was increased to 300°C, another planar layer Cu3(Sn,In) formed near the Cu substrate. The greater part of the intermetallic compounds in this case were the (Cu,Ni)6(Sn,In)5 and Cu3(Sn,In) phases. The Cu3(Sn,In) phase thickness was increased with increasing aging time. The thicker formation of Cu3(Sn,In) phase improved the solder-joint strength. The samples reflowed at 300°C exhibited the best mechanical strength, which was 57.6 kg/cm2 as reflowed. This In/Ni/Cu/Ni/In multilayer structure is a suitable candidate for high-temperature Pb-free solders.

Research and prospect of binary high-temperature Pb-free solders

Purpose – This paper aims to identify a variety of binary system solders by alloying, and relevantly derive multiple system Pb-free solders from the former, attempting to replace the high temperature Sn-Pb solder. Design/methodology/approach – The basis of the paper is the synthesis of previous studies. In terms of some binary high temperature solder alloys, such as Au-20Sn, Bi-2.5Ag, Sn-5Sb, Au-12.5Ge, Zn-6Al and Zn-Sn, taking the alloy phase diagram as the starting point, the melting characteristics, microstructure, mechanical properties, wetting ability and reliability of solder joint are analysed and the prospect is consequently indicated. Findings – Based on the analysis of the six groups of Pb-free solders, the present binary system solder alloys, from the perspective of melting properties, mechanical properties, soldering or reliability of solder joint, rarely meet the comprehensive requirements of replacing the high-temperature Sn-Pb solder. It is assumed to be a solution that multiple-system Pb-free solders derive from a variety of binary system solders by means of alloying. The future development of high temperature Pb-free solder may focus on some factors such as physical properties, mechanical properties, processing, reliability of solder joint, environmental performance and expense. Originality/value – The paper concentrates on the issue of Pb-free solders at high temperature. From a specific perspective of binary system solders, the presently available Pb-free solders are suggested from the starting point of the alloy phase diagram and the prospect of alternatives of Sn-Pb solders at high temperature are indicated.

Interfacial Reactions of High-Bi Alloys on Various Substrates

Bi-Sn alloys with high Bi concentration are potential candidates to replace high-Pb alloys as high-temperature Pb-free solders. Interfacial reactions between high-Bi alloys (Sn concentration 2 wt.%, 5 wt.%, and 10 wt.%) and various substrates have been investigated to understand the intermetallic compound formation and interfacial morphological evolution at the joint interface. The substrates investigated include Ni, Au/Ni, Cu, and Ag/Cu layers deposited on Si chips. The interfacial reactions were carried out at 300°C and 120°C to simulate the liquid/solid and solid/solid reactions, respectively, at such solder joints. Experimental results reveal that the intermetallic compound formation and interfacial morphological evolution vary with the substrate and the Sn concentration of the Bi-Sn alloy.

Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

There is a need for electromechanical devices capable of operating in high-temperature environments (>200°C) for a wide variety of applications. Today's wide-bandgap semiconductor-based power electronics have demonstrated a potential of operating above 400°C, however, they are still limited by packaging. Among the most promising alternatives is the Au-Sn eutectic solder, which has been widely used due to its excellent mechanical and thermal properties. However, the operating temperature of this metallurgical system is still limited to ~250°C owing to its melting temperature of 280°C. Therefore, a high-temperature-resistant system is much needed, but without affecting the current processing temperature of ~325°C, typically exhibited in most high-temperature Pb-free solders. In this paper, we present the development and characterization of a fluxless die-attach soldering process based on gold-enriched solid-liquid interdiffusion (SLID). A low-melting-point material (eutectic Au-Sn) is deposited in the face of a substrate, whereas a high-melting-point material, gold in this instance, is deposited in its mating substrate. Deposition of all materials was performed using a jet vapor deposition (JVD) equipment where thicknesses are controlled to achieve specific compositions in the mixture. Sandwiched coupons are isothermally processed in a vacuum reflow furnace for different reflow times. Post-processed samples confirm the interdiffusion mechanism as evidenced by the formation of sound joints that prove to be thermally stable up to ~490°C after the completion of the SLID process. Differential scanning calorimetry demonstrate the progression of the SLID process by quantifying the remaining low-melting-point constituent as a function of time and temperature, this serving as an indicator of the completion of the soldering process. Mechanical testing reveals a joint with shear strength varying from 39 to 45.5 MPa, demonstrating to be stable even after 500 h of isothermal aging. Moreover, these investigations successfully demonstrate the use of the Au-Sn SLID system and the JVD technology as potential manufacturing processes and as a lead-free die-attach technology.