Thermal Stability Characterization of the Au–Sn Bonding for High-Temperature Applications

Abstract

There is a need for electromechanical devices capable of operating in high-temperature environments (>200°C) for a wide variety of applications. Today's wide-bandgap semiconductor-based power electronics have demonstrated a potential of operating above 400°C, however, they are still limited by packaging. Among the most promising alternatives is the Au-Sn eutectic solder, which has been widely used due to its excellent mechanical and thermal properties. However, the operating temperature of this metallurgical system is still limited to ~250°C owing to its melting temperature of 280°C. Therefore, a high-temperature-resistant system is much needed, but without affecting the current processing temperature of ~325°C, typically exhibited in most high-temperature Pb-free solders. In this paper, we present the development and characterization of a fluxless die-attach soldering process based on gold-enriched solid-liquid interdiffusion (SLID). A low-melting-point material (eutectic Au-Sn) is deposited in the face of a substrate, whereas a high-melting-point material, gold in this instance, is deposited in its mating substrate. Deposition of all materials was performed using a jet vapor deposition (JVD) equipment where thicknesses are controlled to achieve specific compositions in the mixture. Sandwiched coupons are isothermally processed in a vacuum reflow furnace for different reflow times. Post-processed samples confirm the interdiffusion mechanism as evidenced by the formation of sound joints that prove to be thermally stable up to ~490°C after the completion of the SLID process. Differential scanning calorimetry demonstrate the progression of the SLID process by quantifying the remaining low-melting-point constituent as a function of time and temperature, this serving as an indicator of the completion of the soldering process. Mechanical testing reveals a joint with shear strength varying from 39 to 45.5 MPa, demonstrating to be stable even after 500 h of isothermal aging. Moreover, these investigations successfully demonstrate the use of the Au-Sn SLID system and the JVD technology as potential manufacturing processes and as a lead-free die-attach technology.