Abstract
Bi-Sn alloys with high Bi concentration are potential candidates to replace high-Pb alloys as high-temperature Pb-free solders. Interfacial reactions between high-Bi alloys (Sn concentration 2 wt.%, 5 wt.%, and 10 wt.%) and various substrates have been investigated to understand the intermetallic compound formation and interfacial morphological evolution at the joint interface. The substrates investigated include Ni, Au/Ni, Cu, and Ag/Cu layers deposited on Si chips. The interfacial reactions were carried out at 300°C and 120°C to simulate the liquid/solid and solid/solid reactions, respectively, at such solder joints. Experimental results reveal that the intermetallic compound formation and interfacial morphological evolution vary with the substrate and the Sn concentration of the Bi-Sn alloy.
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