Heat Sink Design Research Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Abstract The increased power consumption and continued miniaturization of high-powered electronic components have presented many challenges to their thermal management. To improve the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal performance while reducing the required pumping power by lowering the pressure drop across the heat sink. The considered designs were benchmarked to a commercially available heat sink in terms of their thermal and hydraulic performances. The proposed manifolds were designed to distribute fluid through alternating inlet and outlet branched internal channels. It was found that using the manifold design with 3 channels reduced the thermal resistance from 0.061 to 0.054 °C/W with a pressure drop reduction of 0.77 kPa from the commercial cold plate. A geometric parametric study was performed to investigate the effect of the manifold's internal channel width on the thermohydraulic performance of the proposed designs. It was found that the thermal resistance decreased as the manifold's channel width decreased, up until a certain width value, below which the thermal resistance started to increase while maintaining low-pressure drop values. Where the thermal resistance significantly decreased in the 7 channels design by 16.4% and maintained a lower pressure drop value below 0.6 kPa.

Heat transfer enhancement for microchannel heat sink by strengthening fluids mixing with backward right-angled trapezoidal grooves in channel sidewalls

To strengthen the fluids mixing in channels for enhancing heat transfer, a new design of microchannel heat sink with periodic gradual-expansion and sudden-constriction cross-sections was proposed by arranging backward right-angled trapezoidal grooves in channel sidewalls. The flow and heat transfer characteristics in the new design was numerically investigated and compared with those in two comparative microchannels, which have the same channel volume and the same or almost the same convective heat transfer area as the new design. The pressure and viscous resistances of channel walls were innovatively analyzed for explaining why grooves can maintain a lower pressure drop for microchannels. The results indicate that the new microchannel shows a significant improvement of heat transfer enhancement and overall performance although its pressure resistance and viscous resistance are much higher than those of other ones. The pressure drop and Nusselt number of the new microchannel are 1.02–1.45 and 1.31–2.14 times higher than those of the smooth straight microchannel, respectively. After an optimum process of the forward angle (θ) of grooves, the relative Nusselt number of the new microchannel can be achieved up to 2.23 at θ = 15°and Re = 737 while the overall heat transfer factor can be achieved up to 1.89 at θ = 18°and Re = 442.

Numerical investigation on melting behaviour of phase change materials/metal foam composites under hypergravity conditions

The integration of electronic devices in aerospace vehicles leads to a significant increase in the heat dissipation, which makes thermal management a severe challenge. Due to the high thermal energy storage capacity and the excellent thermal diffusivity, phase change materials (PCM)/metal foam composite is a potential thermal management material. In order to deepen the understanding of melting behaviour of PCM/metal foam under hypergravity, the numerical model considering natural convection, flow resistance of metal foam, and non-equilibrium heat transfer is proposed, and the effects of inclination angle, hypergravity value, metal foam porosity, and pore density on the melting are analyzed. It shows that the inclination angle has a great influence on the morphology of the melting interface, while has limited influence on the variation of PCM liquid fraction. As the inclination angle changes from 0° to 180°, the heated wall temperature first decreases, and then increases after reaching the lowest value at 45°, which is the optimal inclination angle. With the rise of hypergravity value, natural convection is enhanced, the heated wall temperature is reduced, while the hypergravity value has limited effect on the PCM liquid fraction. Furthermore, with the increase of metal foam porosity, natural convection is enhanced, while the heated wall temperature and the melting time become larger. When the porosity is larger than 0.95, the effect of metal foam on natural convection suppression is greater than that of heat conductivity enhancement, leading to that the performance of PCM/metal foam is worse than that of the pure PCM. Besides, with the decrease of pore density, natural convection is enhanced, the heated wall temperature becomes lower. Therefore, metal foam with lower pore density is preferred. This paper provides guidance to the optimal design of PCM-based heat sink for aerospace applications.

Topology optimization for a water-cooled heat sink in micro-electronics based on Pareto frontier

• An efficient Pareto frontier based design strategy for heat sinks is proposed. • A fitting formula of the Pareto frontiers is introduced to accelerate the design. • The 2D topology design results are validated by 3D CFD simulations. • Effects of temperature dependent properties on the results are significant. Topology optimization has been increasingly adopted as a non-intuitive methodology for heat sink design in the thermal management of microelectronics. In this work, a bi-objective topology optimization method for heat sink design in micro-electronics is suggested by considering the trade-off between two contradicting objectives, i.e., the heat transfer and hydraulic performances. The method in this work focused on the laminar water flow with Reynolds number less than 100 based on the channel width for a wide temperature range that covers different types of micro-electric devices. A series of Pareto frontiers were acquired for heat sink designs with different topologies, which can be used to decide the optimum design in respect of heat transfer and pressure drop. Particularly, an analytical formula in terms of inlet Reynolds numbers was obtained for the fast generation of the Pareto frontiers under different working conditions which help to determine the weight parameters of two contradicting objectives readily. The new strategy for weight parameter determination significantly reduces the workload of trial-and-error during the weight parameter determination in the traditional bi-objective topology optimization and thus accelerates the design process. Besides, the temperature-dependent physical properties (viscosity and thermal conductivity) in the design model were considered and were found to affect the design results significantly. Finally, the 3D heat sink model was reconstructed from the 2D topology optimization, and the thermal-fluid analyses were conducted. The results indicate that the 3D reconstructed model can well satisfy the design objective specified in the topology optimization, thereby confirming the validity and robustness of our design method.

Experimental and Thermal Analysis of Desktop FDM 3D Printers "Ender 3" and "CR-10S Pro" Hot Ends

Nowadays, the desktop 3D printers are common in computer aided manufacturing and widely used in multiple applications across homes, offices, and in several business sectors, etc. A wide variety of filaments like PLA, ABS, PETG, TPU, etc. are now being used in Fused Deposition Modeling (FDM). These filaments require different temperatures to print. FDM is a process in which a material in its filament form is melted and deposited layer by layer to form the required object. The hot end of a printer plays a crucial role in the melting of these filaments for printing. It is a major component of a 3D printer, where the filament is brought to a semi-solid state, to extrude and deposit the filament in layers. In this research study, the hot end of "Ender 3" and "CR-10S Pro" are modeled using Computer Aided Designing software, and thermal analysis using Finite Element Analysis, is carried out by applying the maximum printing temperature of PLA for the two printer hot ends. To optimize the problem of wide temperature gradient which often results in clogs and jams across the hot end, the design of heat sink is modified to maximize heat dissipation. Alongside, the simulation result is also compared with manual experimental readings.

Structural Optimization of Heat Sink for Thermoelectric Conversion Unit in Personal Comfort System

Based on the research background of improving personal thermal comfort and promoting building energy efficiency, personal comfort systems (PCSs) have recently received considerable attention. The thermoelectric conversion unit (TECU) has great potential in PCSs as it is compact in size, environmentally friendly and highly reliable. Aiming to improve heat exchange efficiency, this paper investigates the structural optimization of heat sink for the TECU used in PCSs. Firstly, the heat exchange mechanism of the thermoelectric module is analyzed. The structural design of the cold-side heat sink in the TECU is summarized as a multiobjective optimization problem in which four structural parameters (number of fin rows, fin thickness, fin height and thickness of base) of the heat sink are selected as the adjusting variables. Then, based on the establishment of the cold-side computational fluid dynamics simulation model, a multiobjective genetic algorithm is utilized for the optimization task. Sensitivity analysis demonstrates that the number of rows and the fin thickness have significant influence on the optimization objectives. Taking both the outlet airflow temperature and the velocity into consideration, five representative heat sinks involving two different materials are customized. A testing platform is built for performance comparison. Results show that the proposed optimization method can effectively improve the heat exchange efficiency of a TECU, which provides a reference for the TECU-based PCS design.

Novel design of a liquid-cooled heat sink for a high-performance processor based on constructal theory: A numerical and experimental approach

This study presented a novel liquid-cooled heat sink based on constructal theory. An experiment was conducted to investigate the influence of boundary conditions, such as the mass flow rate (ṁ), on heat transfer rate (Qin) and pressure drop. Five cylinder heater cartridges were used in the experiment for 11 different mass flow rates (0.008292 <ṁ (kg/s) < 0.03307).Through numerical simulation, the effects of changing the number of clusters on heat transfer and pressure drop were studied. The results showed that the optimal combination of pressure drop and Nusselt number occurs in four clusters. According to the results, increasing the number of clusters can increase the Nusselt number by up to 11.98% and 13.62% for the highest (ṁ = 0.03307 kg/s) and lowest (ṁ = 0.008292 kg/s) mass flow rates, respectively. This work may lay the foundation for creating the next generation of thermal management systems for compact heat sources, such as the CPU in a self-driving car, robots and high-performance computers (HPC).

Utilization of Additive Manufacturing in the Thermal Design of Electrical Machines: A Review

Additive manufacturing (AM) is a key technology for advancing many fields, including electrical machines. It offers unparalleled design freedom together with low material waste and fast prototyping, which is why it has become to focus of many researchers. For electrical machines, AM allows the production of designs with optimized mechanical, electromagnetic and thermal parameters. This paper attempts to give the reader an overview of the existing research and thermal solutions which have been realized with the use of AM. These include novel heat sink and heat exchanger designs, solutions for cooling the machine windings directly, and additively manufactured hollow windings. Some solutions such as heat pipes, which have been produced with AM but not used to cool electrical machines, are also discussed, as these are used in conventional designs and will certainly be used for additively manufactured electrical machines in the future.

Enhanced Net Channel Based-Heat Sink Designs for Cooling of High Concentration Photovoltaic (HCPV) Systems in Dammam City

In this study, enhanced net channel based heat sink designs for cooling HCPV systems at geometrical concentration ratios ranging from 500× to 3000× are presented. The effect of increasing the number of layers in the parallel flow net channel, as well as the fraction of the coolant mass flow rate in the counter flow net channel, on the overall performance of the HCPV systems, are investigated. The various configurations of each proposed net channel based-heat sink design are examined, and a comparative analysis between the different proposed designs is performed under the climate weather conditions of Dammam city, Saudi Arabia. On one hand, the double-layered counter flow net channel heat sink outperformed the other designs in terms of electrical efficiency and in keeping the solar cell operating well below the safe operating limits, achieving a reduction in maximum cell temperature relatively compared to the parallel flow net channel with five layers and conventional mini channel of 11.72% and 12.01%, respectively. On the other hand, for effective usability of the heat recovery rate by the cooling mechanism, the parallel flow net channel is the most appropriate design since it has recorded 27.55% higher outlet water temperature than the double-layered counter flow net channel.

Efficacy of diverse structures of wavy baffles on heat transfer amplification of double-diffusive natural convection inside a C-shaped enclosure filled with hybrid nanofluid

Indeed, C-shaped cavity is a unique feature that invites most favorable applications include cooling of electronic devices, design of heat sink devices etc. Double-diffusive natural convection (DDNC) plays a ubiquitous role in enormous industrial manufacturing processes. The second law analysis is important so as to explore the role of entropy optimization in specific thermal systems. Keeping such relevance in mind, this article is framed to fact-find on DDNC impact on fluid flow, heat and mass transfer inside C-shaped enclosure filled with hybrid nanofluid and emplacing two wavy baffles. The finite element method is the instrumental to devise a well-defined solution of the governing equations. The precise details of the outcomes of the present study are that streamlines intensify by 245.64%, 141.65%, 69.77%, 23.91% with rise in buoyancy ratio, Rayleigh number Ra, Lewis number and amplitude of wavy baffle respectively while that whittles down by 25.4% with rise in wave number. Stream functions of streamlines, velocities, and heat and mass transfer rates intensify for any amplitude of wavy baffles. Local Nusselt ameliorates effectively with amplification of Ra. Average entropy is lower and Bejan number attains higher values at low Ra while the opposite result is visualized at high Ra.

Experimental investigation of a topology-optimized phase change heat sink optimized for natural convection

In this study, a topology-optimized heat sink is developed and applied to electronics cooling by utilizing a phase change material interspersed through a finned structure. The topology optimization is performed by the minimization of the global thermal compliance in the solution of the modified momentum equation with the Boussinesq approximation to account for natural convection. The optimized heat sink, namely the natural convection topology-optimized heat sink, was fabricated by Selective Laser Melting, a metal additive manufacturing technique. The natural convection topology-optimized heat sink was experimentally characterized based on its base temporal temperature and its operation time. The performance of our newly developed heat sink was then evaluated by comparing against a conventional heat sink design, a baseline design with no surface enhancements, and a second topology-optimized heat sink based on heat conduction. The results show that the natural convection topology-optimized heat sink has a lower base temperature compared to the conventional heat sink, but higher base temperature than the second topology-optimized heat sink during the PCM melting phase. However, the natural convection topology-optimized heat sink has an operation time which is 31.0% longer than all the other heat sinks with enhanced structures. Through visualization of the melting process, we can deduce that the longer operation time of the natural convection topology-optimized heat sink is primarily due to the movement of the melt front which results in a slower melting, while optimizing natural convection of the melted material. These mechanisms maintain a reasonably low heat sink base temperature.

Experimental and numerical investigation on thermal and hydraulic performance of novel serpentine minichannel heat sink for liquid CPU cooling

A novel serpentine design for minichannel heat sink is investigated experimentally and numerically to enhance thermal performance of the heat sink for liquid CPU cooling. The heat sink is fabricated from aluminum and is located in a plexiglass container. The channels have square cross section with deep and width of 2 mm. Mass flow rate and inlet temperature effect on the performance of the maze serpentine heat sink are studied. Five different mass flow rate varies between 0.0017 kg/s and 0.0087 kg/s and three different inlet temperature (15°C, 20°C and 25 °C) is investigated. Pure water is used as the coolant. The results indicate that by changing the minichannel design from straight to the proposed mazed shape geometry, baseplate temperature decreases 11.2% and Nusselt number increases 4.2 times in the maximum mass flow rate. Thermal resistance is decreased in the novel maze serpentine minichannel heat sink and by increasing mass flow rate the difference get larger so that maximum convective thermal resistance difference for and the novel maze serpentine minichannel is 54% that is observed in the lowest mass flow rate. Also, higher thermal performance is achieved in the maze serpentine minichannel heat sink.

Effect of structural characteristics on the natural convective heat transfer performance of copper foam

• Copper foam with highly controllable structure was manufactured. • The relationship between structure and heat transfer performance was studied. • When the porosity is > 78%, the heat transfer performance drops sharply. • The optimal porosity and pore size for convective heat transfer have been found. • Side-heated foams exhibit better heat transfer than the bottom-heated foams. The effects of porosity, pore diameter and heating direction on the heat transfer performance of copper foam under natural convection were experimentally investigated. The open cell copper foam with highly controllable porosity ranging from 65% to 85% and mean pore diameters of 330 μm, 560 μm, 850 μm and 1200 μm were manufactured using a space holder method. The natural convective heat transfer coefficient of the copper foam was measured using a purpose-designed device. The influence mechanism of porosity, pore diameter and heating direction on heat transfer was analysed and discussed. The results showed that when the porosity is less than 75%, the effect of porosity on heat transfer is not significant, but as the porosity increases further, the heat transfer performance decreases significantly. The optimal pore size was found to be 850 μm, while the heat transfer performance of other pore sizes depends on the porosity. It was also found that the samples heated from the side generally showed better heat transfer performance than the samples heated from the bottom. The influence of porosity and pore size on natural convective heat transfer performance is mainly caused by changes in thermal conductivity and permeability. This research provides important guidance for the design of future heat sinks.

High-sensitivity self-powered temperature/pressure sensor based on flexible Bi-Te thermoelectric film and porous microconed elastomer

• A self-powered Bi-Te and porous microcone-based temperature/pressure sensor is presented. • A flexible TEG could harvest body heat to power pressure sensor and sense temperature. • Bi-Te based TE thin film with heat sink achieves a high-precision temperature sensor. • The porous microconed architectures greatly enhance the sensitivity of pressure sensor. Electronic skins are artificial skin-type multifunctional sensors, which hold great potentials in intelligent robotics, limb prostheses and human health monitoring. However, it is a great challenge to independently and accurately read various physical signals without power supplies. Here, a self-powered flexible temperature-pressure bimodal sensor based on high-performance thermoelectric films and porous microconed conductive elastic materials is presented. Through introducing flexible heat-sink design and harvesting body heat energy, the thin-film thermoelectric device could not only precisely sense temperature signal but also drive the pressure sensor for detecting external tactile stimulus. The integration of Bi-Te based thermoelectric film with high stability in wide temperature range enables the sensor to sense the ambient temperature with high resolution (<0.1 K) as well as excellent sensitivity (3.77 mV K –1 ). Meanwhile, the porous microconed elastomer responds to pressure variation with low-pressure detection (16 Pa) and a high sensitivity of 37 kPa –1 . Furthermore, the bimodal sensor could accurately and simultaneously monitor human wrist pulse and body temperature in real time, which demonstrates promising applications in self-powered electronic skins for human health monitoring systems.

A natural convection horizontal straight-fin heat sink design problem to enhance heat dissipation performance

An optimized design for a three-dimensional natural convection horizontal straight-fin heat sink (SFHS) is numerically and experimentally examined in this study. The fin heights and shift displacement of the fins are considered as design variables, and this study aims to determine the optimal values of the design variables using the Levenberg–Marquardt method (LMM) to yield the minimum base surface temperature of the heat sink and thus enhance the heat dissipation performance of the system. Three design models (A, B and C) are examined, and the design parameters are considered to be the fin heights, the shift displacement of the fins, and both together. Numerical results show that the thermal resistance of designs A, B and C can be reduced by 5.7%, 14.4% and 15.6% compared to that of the original SFHS. These results imply that the shift displacement of the fin is a more effective design variable than the fin heights with regard to improving the heat sink's thermal performance. When both variables are considered as design variables, computational time increased tremendously, and the contribution of the fin height was trivial. Therefore, design B is recommended for practical application. Experiments were then performed on the manufactured original SFHS and design B heat sink to verify the validity of the optimal designs. Results showed that the error between the computed and measured base surface temperatures of the heat sink is small (less than 2%). The validity of using the proposed optimization algorithm to design the optimized shape of the natural convection SFHS is thus confirmed.

A Novel Mini-Channel Heat Sink Design with Arc-Type Design Domain by Topology Optimization.

Based on the advantages of the topology optimization method, a new mini-channel heat sink with arc-type design domain topology design is proposed in this work. This arc-type design domain is used to realize the flow distribution uniformity. Two dual objective optimization functions were selected to complete the topology design, and two topology optimization mini-channel models M1 and M2 were obtained. The aim of M1 is to achieve minimum average temperature and fluid dissipation of the heat source area. The fluid dissipation was used to characterize the pressure drop characteristics. The aim of M2 is to achieve minimum temperature difference and fluid dissipation of the heat source area. Then, the fluid and heat transfer characteristics of M1, M2, and the traditional straight heat sink M3 were analyzed by numerical simulation. Compared with straight mini-channel heat sink M3, the temperature differences of the mini-channel heat sink designed M1 and the mini-channel heat sink designed M2 were decreased by 31.6% and 42.48%, respectively. Compared with M3, the pressure drops of M1 and M2 were decreased by 22.7% and 30.9%, respectively. Moreover, the Nusselt number of the mini-channel heat sink designed M1 was increased by 34.43%. In comparison, that of the mini-channel heat sink-designed M2 increased by 15.86%. The thermal performance evaluation criteria (PEC) showed that the PEC value of M1 was greater than 1.4, while the PEC value of M2 was less than 1.14. Finally, experiments were conducted for M1 to verify the accuracy of the numerical simulation. It was found that the simulation results agreed well with the experimental results.

A case study on innovative design and assessment of a microchannel heat sink with various turbulators arrangements

The design configuration of the microchannel heat sinks plays a critical role in heat transfer improvement. The microchannel geometry has 3D configurations, which is needed to be incorporated into the analysis. The present study focuses on the innovative design of a 3D microchannel with turbulators and evaluates the thermal performance of the resulting channels. The thermal performance analysis relies on the assessment of Nusselt Number, channel base temperature, pressure drop, and friction factor for various flow Reynold numbers within the range of 200–800. In the design configurations, five cases, having different locations of turbulators on the channel wall, are considered and the effect of three different microchannel widths (0.05 mm–0.15 mm) along with different wall heat fluxes (1 × 106 W/m2 to 3 × 106 W/m2) is evaluated for each case. The case, at which the turbulators are located on 75% of channel length with a pitch of 0.75 mm, demonstrates the highest thermal performance with the maximum Nusselt number at Reynolds number of 800. However, turbulator location close to the channel exit (Cases 1 and 5) gives rise to the lowest thermal performance.

Pseudo 3D topology optimization of microchannel heat sink with an auxiliary objective

This paper investigated the application of pseudo 3D (P3D) variable-density topology optimization to the design of microchannel heat sink (MHS). To mitigate the grey-element issue and improve the precision of P3D model, outside surface viscous dissipation, adaptive equivalent heat transfer coefficient and auxiliary objective was introduced. The effects of adaptive equivalent heat transfer coefficient, auxiliary objective and its corresponding weight factor on the optimal design were analyzed. The results showed that the new proposed topological model can effectively mitigate intermediate density, improved accuracy and produced a well-defined structure. Furthermore, to validate the design of topology optimization, full 3D numerical simulations were adopted to investigate the fluid flow and heat transfer performance of the topological model and the results were compared with the conventional straight MHS. It is found that the increase of average inlet velocity and temperature uniformity of the topological MHS can be up to 305% and 69%, respectively, under the same inlet pressure. While under the same pumping power consumption, the average heat source temperature of the topological microchannel heat sink can be 9.3°C lower than the conventional one.

Experiment investigation on flow boiling heat transfer in a bidirectional counter-flow microchannel heat sink

Improving the critical heat flux (CHF) and avoiding dry out downstream are the keys to enhance the two-phase cooling performance of microchannel heat sinks. In this work, a novel type of bidirectional counter-flow (BCF) microchannels with 600 μm depth and 300μm width, giving a hydraulic diameter of 400μm, is fabricated in an oxygen-free copper base. Flow boiling experiments are conducted in bidirectional counter-flow microchannels and conventional unidirectional parallel-flow (UPF) microchannels, with the deionized water being used as the working fluid. Cases under six mass fluxes ranging from 118 kg/m2·s to 370 kg/m2·s and three inlet subcoolings of 30 ℃, 50 ℃, and 70 ℃ are tested. Two-phase flow behaviors in microchannels are simultaneously captured by a high-speed camera. It is found that, unlike conventional UPF microchannels, the location for the onset of nucleate boiling (ONB) in BCF microchannels is moved from downstream to the middle region. The downstream dry-out, which is usually occurred in UPF microchannels, can be well avoided in BCF microchannels due to the substantial feeding of liquid in adjacent microchannels. The CHF in BCF microchannels can be increased by 33.8∼57.2% compared with the conventional UPF microchannels. Under the combined effect of expanded nucleate boiling region and shortened subcooling region, the average heat transfer coefficient (HTC) in BCF microchannels can be increased by 36.6%∼56.7%. More interestingly, the improvement of heat transfer performance is found to be accompanied by a significant reduction in pressure drop for BCF microchannels in all the experiment cases. In addition, two-phase instabilities in terms of wall temperature and pressure drop oscillations can be significantly suppressed by using BCF microchannels instead of the conventional UPF microchannels. This study proposes a more efficient microchannel heat sink design scheme to deal with the microelectronic cooling challenges.

Improvement on the cyclic thermal shock resistance of the electronics heat sinks using two-objective optimization

Phase change materials (PCMs) can isothermally absorb heat in electronic devices, and optimizing PCM heat sink designs to improve heat dissipation is therefore important to improve the performance of a system, including its ability to withstand cyclic thermal shocks. In this study, a low melting point alloy (LMPA)-based heat sink with crossed copper fins is developed and optimized to cope with cyclic ultra-high thermal shocks (100 W/cm²). Gallium is selected as an LMPA candidate due to its high thermal conductivity. The numerical model is validated against available experimental results where the transient temperature is predicted with a maximum discrepancy of 4.9%. The main goal of the study is to determine the design configurations that minimize the heat sink peak temperature after thermal shock and with minimal cooling time. An approach that couples the Response Surface Methodology (RSM) with numerical simulations is applied for this purpose. The height and thickness of fins and the PCM thickness, are treated as design variables in the two-objective optimization. Two correlations are presented to estimate the peak temperature and cooling period of the system in presence of thermal shock. The effect of the three parameters is thoroughly analysed following the optimization process. The optimum values for fin height, fin thickness and PCM thickness are found to be 8.77 mm, 0.55 mm, and 1.51 mm, respectively, where the PCM volumetric percentage is found to be 53.73%. Single-objective optimizations are also conducted to design a system satisfying a minimum peak temperature or minimum cooling period separately. Overall, the cyclic evaluation shows that the two-objective optimized heat sink delivers peak temperature up to 8.63% and 36.26% lower than that of single-objective optimized systems after five cycles of thermal shocks within periods of 30–60 s. This study shows how LMPA-based heat sink may be optimized and demonstrates a potential approach in the design of novel thermal management systems to prevent overheating from thermal shocks.