Thermal Resistance Research Articles

Investigation and Prediction of Outdoor Thermal Comfort under Different Protection and Activity Intensity Conditions in Summer in Wuhan

In the context of normalized epidemic prevention and control, the impact of masks and protective clothing on personal thermal comfort cannot be overlooked. To investigate the thermal comfort of outdoor personnel under various protective conditions, this study took Wuhan as an example and evaluated the outdoor thermal comfort of subjects under different protection and activity conditions through thermal environment monitoring, physiological measurements, and thermal comfort questionnaires. The results show significant differences in the PET thermal comfort baseline under various protective conditions. To address the problem that most areas have not yet established state-specific thermal comfort baselines, a State Outdoor Comfort Index (SOCI) model was developed to correct the insensitivity of PET indicators to clothing thermal resistance and metabolic rate. Finally, the performance of the SOCI model was evaluated through statistical indicators, demonstrating its good predictive capability. This study provides appropriate quantitative indicators to improve the thermal comfort of outdoor personnel.

PVA/whey protein nanofiber-coated PP melt blown integrated with Pickering emulsion of citral stabilized for potential medical applications

As an antibacterial agent with pleasant fragrance, citral (CIT) indicates hydrophobic character, and therefore has low water solubility. In this study, Pickering emulsions were formed and polyvinyl alcohol (PVA)/whey protein hydrophilic nanofibers were coated on PP melt blown non-woven surfaces by electrospinning method. In this context, hydrophobic citral essential oil is stabilized with β-cyclodextrin (β-CD) in the electrospinning process. PVA and whey protein polymer blend were used as nanofiber matrixes. The morphological, physical, and thermal properties of the β-CD/citral complexes were investigated in PVA/whey protein nanofiber-coated PP non-wovens at various β-CD levels (1:2, 1:4 and 1:6). Furthermore, zone inhibition procedure was performed to evaluate antibacterial activity of the samples against Gram (+) (Staphylococcus aureus ATCC® 25923) and Gram (-) (Escherichia coli ATCC® 25922, and Pseudomonas aeruginosa ATCC® 27853) bacteria. The morphology of fibers showed that all obtained nanofiber-coated PP surfaces were in the range with 216 - 330 nm average fiber diameter. Fourier Transform Infrared (FT-IR) and thermal gravimetric analysis (TGA) thermograms revealed that citral were successfully integrated into the bio-based nanofibers. As the amount of citral increased (i.e., the β-CD/citral increased), the thermal resistance of bio-based nanofiber coated PP surfaces increased. Antibacterial activity indicated the citral-loaded nanofiber-coated PP surfaces were most effective against Escherichia coli, while none of the samples have antibacterial activity against Pseudomonas aeruginosa. Overall, the results displayed that the fabricated PVA/whey protein nanofiber-coated PP samples integrated with Pickering emulsion of citral stabilized have promising wound dressing applications.

КОМПОЗИТНЫЕ МАТЕРИАЛЫ НА ОСНОВЕ ПОЛИМЕР/ГРАФЕНА В РОБОТИЗИРОВАННЫХ УСТАНОВКАХ ПОЖАРОТУШЕНИЯ

It is shown that numerous devices contain their own electrical power sources that use a significant number of bipolar transistors and thyristors of medium and high power, which require additional cooling in the form of external radiators to remove excess heat. For their manufacture, in addition to traditional alloys based on aluminum, materials such as polymers with fillers of high thermal conductivity are promising. A composite surface saturation technology is proposed that uses boron nitride nanocrystals to reduce thermal resistance at the interface. It has been established that the heat-conducting properties both along and across the polymer fibers, as the content of the nanocrystalline form of boron nitride increases to 25 %, they increase and reach a value of 21,3 W/(m K). This value is more than twice the possible maximum thermal conductivity coefficient in the absence of a graphene layer: 9,8 W/(m K) with a boron nitride mass content of up to 50 %. Due to its characteristics, polymer/graphene composite material has promise as a material for cooling devices with high energy density.

Nano-oxides boost aluminium heat resistance.

Nano-oxides boost aluminium heat resistance.

Bio-Based Thiol-ene Network Thermosets from Isosorbide and Terpenes.

Thermoset networks are chemically cross-linked materials that exhibit high heat resistance and mechanical strength; however, the permanently cross-linked system makes end-of-life degradation difficult. Thermosets that are inherently degradable and made from renewably derived starting materials are an underexplored area in sustainable polymer chemistry. Here, we report the synthesis of novel sugar- and terpene-based monomers as the enes in thiol-ene network formation. The resulting networks showed varied mechanical properties depending on the thiol used during cross-linking, ranging from strain-at-breaks of 12 to 200%. Networks with carveol or an isosorbide-based thiol incorporated showed plastic deformation under tensile stress testing, while geraniol-containing networks demonstrated linear stress-strain behavior. The storage modulus at the rubbery plateau was highly dependent on the thiol cross-linker, showing an order of magnitude difference between commercial PETMP, DTT, and synthesized Iso2MC. Thermal degradation temperatures were low for the networks, primarily below 200 °C, and the Tg values ranged from -17 to 31 °C. Networks were rapidly degraded under basic conditions, showing complete degradation after 2 days for nearly all synthesized thermosets. This library demonstrates the range of thermal and mechanical properties that can be targeted using monomers from sugars and terpenes and expands the field of renewably derived and degradable thermoset network materials.

Silicone Nanocomposites with Enhanced Thermal Resistance: A Short Review.

Continuous technological progress places significant demands on the materials used in increasingly modern devices. An important parameter is often the long-term thermal resistance of the material. The use of heat-resistant polymer materials worked well in technologically advanced products. An economically justified direction in searching for new materials is the area of polymer nanocomposite materials. It is necessary to appropriately select both the polymer matrix and the nanofillers best able to demonstrate the synergistic effect. A promising area of exploration for such nanocomposites is the use of organosilicon polymers, which results from the unique properties of these polymers related to their structure. This review presents the results of the analysis of the most important literature reports regarding organosilicon polymer nanocomposites with increased thermal resistance. Particular attention was paid to modification methods of silicone nanocomposites, focusing on increasing their thermal resistance related to the modification of siloxane molecular structure and by making nanocomposites using inorganic additives and carbon nanomaterials. Attention was also paid to such important issues as the influence of the dispersion of additives in the polymer matrix on the thermal resistance of silicone nanocomposites and the possibility of modifying the polymer matrix and permanently introducing nanofillers thanks to the presence of various reactive groups. The thermal stability mechanism of these nanocomposites was also analysed.

Development of hBN/natural fibres reinforced polymer composites using grey relation grade analysis for thermal and electrical applications

The objective of this work is to enhance the thermal conductivity and electrical properties of polymer hybrid composites through a systematic novel grey relation grade analysis (GRGA) optimization approach. This involves reinforcing the hybrid composites with hexagonal boron nitride (hBN) and various kinds of natural fibers or fillers. The development of a unique technology to produce multiphase composites using 2% of natural fibers or fillers such as coir fiber, rice husk filler, wood filler (WF), banana fiber (BF) and sugarcane fiber along with hBN (1, 3, 5 wt.%) particulates as reinforcements in epoxy matrix. The Taguchi L15 matrix array is utilized to fabricate interlaced composite samples via hand layup molding. Ultrasonic waves are used to ensure the uniform distribution of hBN filler into the matrix. Analysis of variance and GRGA reveal the significant results. It shows that the multiphase hybrid composites exhibit good thermal conductivity when higher content of hBN (5 wt.%) particulate for all the micro particulate polymer (MPP) composites. Multi-response optimization shows that the micro BF (2 wt.%) interlaces with hBN (5 wt.%) composite exhibits the higher thermal conductivity and electrical resistance compared to all other natural fiber interlaced composites. The aforementioned MPP composite has thermal conductivity of 1.03 W (m·K)−1 and electrical resistance of 279.88 Giga Ohms. Besides, the WF interlaced hBN (5 wt.%) composite shows the minimum dielectric constant compared to all other natural fiber composites. This desirable result is caused by the proper dispersion of hBN with the matrix which encourages interlocking with the fiber and the matrix. Maximum electrical resistance is observed for composite containing 5 wt.% of h-BN and 2 wt.% of BF. The developed MPP composite could be used in heat shields, electrical insulation components, and interior automotive components like dashboards, luggage compartments and interior walls.

Synthesis and application of environmental plasticizers based on benzene polyacid ester

AbstractUsing benzene‐1,3,5‐tricarboxylic acid, trimellitic anhydride, 2‐propylheptanol and 2‐ethylhexanol as raw materials, four kinds of environmental plasticizers were prepared, which were used as additives for polyvinyl chloride (PVC) products. Compared with commercially available di (2‐ethylhexyl) phthalate (DOP), di (2‐ethylhexyl) terephthalate (DOTP), and tributyl citrate (TBC), the application performance and plasticizing performance were compared. The structure of the target product was analyzed by fourier transform infrared spectroscopy and nuclear magnetic resonance spectroscopy to verify the fingerprint region of the molecular structure of the product. The properties of plasticized PVC films were tested by thermal weight loss analysis, oven thermal aging test, migration and volatility resistance test, DMA analysis, and scanning electron microscopy. The plasticizing mechanism was confirmed through quantum chemical calculations, and the results of the calculations were in line with the migration outcomes. The results showed that compared with commercially available plasticizers, benzene polyacid ester plasticizers had better thermal stability, and better cold resistance in the polar environments, suitable for high‐temperature and water‐based environments.Highlights The four plasticizers prepared in this study were compared with reference plasticizers, and the plasticizing mechanism was validated through quantum chemical calculations. The PVC film plasticized with benzene polyacid ester prepared in this study demonstrates outstanding thermal stability, surpassing certain plasticizers reported in current literature. Benzene polyacid esters plasticized PVC film has migration stability under various conditions, it has great potential in packaging and other applications.

Ecological packaging: Creating sustainable solutions with all-natural biodegradable cellulose materials

Plastics, accumulating globally as microplastics in living organisms, significantly contribute to environmental issues. Current materials like polylactic acid and commercial paper face limitations due to inadequate heat and water resistance, resulting in various practical inconveniences. This study reports a high-strength, water-resistant, recyclable, and naturally degradable pure cellulose food packaging material, which is crafted from bacterial cellulose (BC) and ethyl cellulose (EC) by a straightforward filtration and scratch coating process. The use of the EC ethanol solution eliminates the need for additional binders. Remarkably, the EC-BC pure cellulose material exhibits excellent mechanical properties (tensile strength of 195.3 ± 23.2 MPa), a stability in liquid environments (136.9 ± 24.2 MPa mechanical strength after 30 minutes of immersion in water), recyclability, natural degradability, cost-effectiveness, and non-toxicity. These attributes position binder-free hybrid designs, based on cellulose structures, as a promising solution to address environmental challenges arising from the extensive use of single-use plastics.

Thermal Conductivity and Sintering Mechanism of Aluminum/Diamond Composites Prepared by DC-Assisted Fast Hot-Pressing Sintering.

A novel DC-assisted fast hot-pressing (FHP) powder sintering technique was utilized to prepare Al/Diamond composites. Three series of orthogonal experiments were designed and conducted to explore the effects of sintering temperature, sintering pressure, and holding time on the thermal conductivity (TC) and sintering mechanism of an Al-50Diamond composite. Improper sintering temperatures dramatically degraded the TC, as relatively low temperatures (≤520 °C) led to the retention of a large number of pores, while higher temperatures (≥600 °C) caused unavoidable debonding cracks. Excessive pressure (≥100 MPa) induced lattice distortion and the accumulation of dislocations, whereas a prolonged holding time (≥20 min) would most likely cause the Al phase to aggregate into clusters due to surface tension. The optimal process parameters for the preparation of Al-50diamond composites by the FHP method were 560 °C-80 MPa-10 min, corresponding to a density and TC of 3.09 g cm-3 and 527.8 W m-1 K-1, respectively. Structural defects such as pores, dislocations, debonding cracks, and agglomerations within the composite strongly enhance the interfacial thermal resistance (ITR), thereby deteriorating TC performance. Considering the ITR of the binary solid-phase composite, the Hasselman-Johnson model can more accurately predict the TC of Al-50diamond composites for FHP technology under an optimal process with a 3.4% error rate (509.6 W m-1 K-1 to 527.8 W m-1 K-1). The theoretical thermal conductivity of the binary composites estimated by data modeling (Hasselman-Johnson Model, etc.) matches well with the actual thermal conductivity of the sintered samples using the FHP method.

Steam Condensation Heat Transfer in the Presence of Noncondensable Gases (NCGs) in Nuclear Power Plants (NPPs): A Comprehensive Review of Fundamentals, Current Status, and Prospects for Future Research

Efficient steam condensation is crucial for safe nuclear power plant (NPP) operations, preventing pressure buildup, overheating, and the release of radioactive materials. However, the presence of noncondensable gases (NCGs), such as air, nitrogen, hydrogen, or helium, can hinder the condensation process by creating a thermal resistance layer that impedes steam diffusion and condensation on the system’s surface. Maximizing the efficiency of steam condensation requires a thorough grasp of the fundamental processes, theories, advancements, and technical hurdles. Therefore, this work thoroughly addresses these needs, with a particular emphasis on addressing the challenges posed by NCGs by dividing the work into four thematic areas. The first theme relates to a comprehensive examination of pure steam condensation phenomena, which includes an exploration of familiar condensation scenarios and various film condensation types. The second theme examines condensation in the presence of NCGs, their mixture properties, and related theories and modelling of heat and mass transfer. The third theme investigates condensation in NPP by exploring passive cooling systems and condensation phenomena under both natural and forced convection conditions during nuclear accidents, the origin of NCGs in NPP and their transportation aspects. This is followed by experimental work related to condensation scenarios and scale. Finally, the last theme looks upon the recent advancements in computational fluid dynamics (CFD) modelling of wall condensation, system analysis codes coupling with CFD, and the implementation of machine learning (ML) for predicting the condensation HTC. By bridging the gap between fundamental knowledge and practical applications, the four thematic areas presented in this work are aimed at providing a comprehensive foundation for researchers and experts in the field of steam condensation when NCGs are involved. The ultimate objective is to bolster the safety and efficacy of NPP operations by understanding the heat and mass transfer mechanisms while mitigating the risk of catastrophic events.

In situ three-roll mill exfoliation approach for fabricating asphalt/graphite nanoplatelet composites as thermal interface materials

Thermal interface materials (TIMs) are vital to dissipate excess heat generated by electronic components with ever-growing power density to ensure their reliability and performance. However, the limited dispersibility of nano-sized thermal conductive fillers hinders further enhancement of thermal conductivity in TIMs. It remains challenging to manufacture high-performance TIMs with simultaneous high thermal conductivity, low cost, and capability of large-scale production. Herein, a solvent-free and scalable approach was adopted to fabricate asphalt/graphite nanoplatelets (GNPs) composites by in situ exfoliating graphite in asphalt melt using a three-roll mill. During exfoliation, asphalt was adsorbed onto the surface of GNPs via π-π interaction and improved their dispersibility. Hence, GNPs formed integrated thermal conductive pathways with reduced interfacial thermal resistance, which significantly improved the thermal conductivity of asphalt/GNP composites. At 25 vol% loading, the asphalt/GNP composite displayed a thermal conductivity of 1.95 W m−1 K−1, showing a 114 % increase compared to the asphalt/commercial GNP (c-GNP) composite prepared by conventional mechanical mixing. Moreover, the heat-resistant and mechanical properties of the asphalt/GNP composites were also enhanced due to the improved filler dispersion and filler-matrix interactions. Thus, the asphalt/GNP composites fabricated by in situ three-roll milling possessed remarkable advantages as TIMs compared with asphalt/c-GNP composites and commercial silicone rubber thermal pads.

Thermal insulation box design for maintaining cool temperature and the postharvest quality of okra

Postharvest loss of okra is caused by its high respiration rate and temperature fluctuations in the supply chain. To address this, five thermal insulation boxes were designed, combining different materials, and evaluated for okra quality during simulated transportation and storage. The treatments included the standard foam box, metalized foam sheet (two layers consisting of aluminum foil and expanded polyethylene), prototype-A (three layers consisting of dual layer of aluminum foil and expanded polyethylene), prototype-B (four layers consisting of aluminum foil, nonwoven, expanded polyethylene, and aluminum foil), and standard regular slotted container. Material tests revealed that aluminum foil and expanded polyethylene had the lowest thermal heat energy. The composite sandwich box design, prototype-A, demonstrated the highest maximum insulation time of 28 h and thermal resistance of 0.332 m2°C/W. Prototype-A and prototype-B effectively maintained low temperature fluctuation, minimized air and okra temperature changes, and maintained 6.19 to 8.25 % CO2, which was within an acceptable range of 4–10 % for okra. Both prototypes exhibited reduced percentage mass loss in okra below 5 %. Importantly, both prototypes demonstrated the lowest incidence of okra pod surface browning and maintained the quality for 6 d, surpassing metalized foam sheet and standard regular slotted container. These findings offer sandwich design with 3 or 4 layers as promising alternatives for thermal insulation boxes in cold chain management, enhancing the transport packaging of okra under ambient environments compared to the standard foam box.

Моделирование и анализ распределений температуры и термомеханических напряжений в многокристальном электронном модуле

A mathematical thermomechanical model of a multi-chip electronic module (MEM) containing three silicon dies of high-power transistors fixed with a conductive adhesive on a copper plate placed on a radiator is considered in the form of a system of equations of thermal conductivity and thermoelasticity with specified boundary conditions. As a result of computational studies of the model in the COMSOL Multiphysics software environment, distributions of temperature and thermomechanical stresses in the MEM structural elements were obtained depending on the heating power, the thickness of the adhesive and the size of the model defect in the contact connection of one of the MEM crystals with a copper plate in the form of voids in the adhesive layer. It is shown that voids in the adhesive layer lead to a sharply non-uniform temperature distribution over the crystal area and thermomechanical shear stresses in the contact layer that exceed the maximum permissible values for the adhesive. It has been established that thermomechanical stresses decrease with increasing thickness of the adhesive layer and increase with increasing size of the defect(voids) in this layer. The simulation results are in good agreement with the results of measuring the thermal impedance of power transistor crystals using the modulation method, which indicates the correctness and adequacy of the developed model.

Impact of Chaos on MOSFET Thermal Stress and Lifetime

The reliability of power electronic switching components is of great concern for many researchers. For their usage in many mission profiles, it is crucial for them to perform for the duration of their intended lifetime; however, they can fail because of thermal stress. Thus, it is essential to analyze their thermal performance. Non-linear switching action, bifurcation and chaotic events may occur in DC-DC power converters. Consequently, they show different behaviors when their parameters change. However, this is an opportunity to study these bifurcation phenomena and the existence of chaos, e.g., in boost converters, on their performance as the effects of load variations (mission profiles) on the system’s behavior. These variations generate many non-linear phenomena such as periodic behavior, repeated period-doubling bifurcations and chaos in the MOSFET drain-source current. Thus, we propose, for the first time, an analysis of the influence of chaos on the junction temperature. First of all, this paper provides a step-by-step procedure to establish an electrothermal model of a C2M0080120D MOSFET with integrated power loss. Then, the junction temperature is estimated by computing the power losses and a thermal impedance model of the switch. Additionally, this model is used to investigate the bifurcation and chaotic behavior of the MOSFET junction temperature. The paper contributes by providing a mathematical model to calculate several coefficients based on experimental data and thermal oscillations. Estimation of the number of cycles to failure is given by the Coffin–Manson equation, while temperature cycles are counted using the rainflow counting algorithm. Further, the accumulated damage results are calculated using the Miner’s model. Finally, a comparison is made between the damage accumulated during different mission profiles: significant degradation of the MOSFET’s lifetime is pointed out for chaotic currents compared to periodic ones.

Oral soluble shell prepared from OSA starch incorporated with tea polyphenols for the microencapsulation of Sichuan pepper oleoresin: Characterization, flavor stability, release mechanisms and its application in mooncake

The market share of Sichuan pepper oleoresin (SPO) in the flavor industry is increasing steadily; however, its high volatility, low water solubility, and poor stability continue to pose significant challenges to application. The microencapsulation prepared by emulsion embedding and spray drying is considered as an effective technique to solve the above problems. Sodium octenyl succinate starch (OSA starch) and tea polyphenols (TPs) were used to develop OSA-TPs complex as encapsulants for SPO to prepare orally soluble microcapsules. And the optimum doping of TPs was determined. SPO microcapsules have good properties with high encapsulation efficiency up to 88.13 ± 1.48% and high payload up to 41.58 ± 1.86% with low water content and high heat resistance. The binding mechanism of OSA starch with TPs and its regulation mechanism and effect on SPOs were further analyzed and clarified. The binding mechanism between OSA starch and TPs was clarified in further analyses. The OSA-TPs complexes enhanced the rehydration, release in food matrix and storage stability of SPO, and exhibited good sensory immediacy. Flavor-improved mooncakes were successfully developed, achieving the combination of mooncake flavor and SPO flavor. This study provided a valuable way to prepare flavoring microcapsules suitable for the catering industry, opened up the combined application of SPO and bakery ingredients, and was of great practical value and significance for improving the processing quality of flavor foods, driving the development of the SPO industry, and enhancing the national dietary experience.

Thermal Safety Assessment Method for Power Devices in Natural Air-Cooled Converters

The junction temperature of a power device in a natural air-cooled power converter fluctuates randomly due to the variation in airflow rate in ambient environments. Most of the existing thermal analysis methods do not pay attention to the uncertain influence of airflow on the heat-dissipation capacity of such converters, making it difficult to accurately evaluate the thermal safety of these devices. To address this issue, a thermal safety assessment method for power devices in natural air-cooled converters is proposed in this paper. In the proposed method, convective heat resistance samples of converter housing are extracted with an equivalent thermal network model and the historical operation temperature of the converter. Wavelet packet transform is used to analyze the time–frequency domain characteristics of the convective heat resistance, and Monte Carlo simulation is employed to simulate the random influence of the airflow rate on the device junction temperature. The thermal safety of power devices is assessed in the form of over-temperature probability, which is expressed by a two-variable growth function. An experimental platform is designed to validate the effectiveness of the proposed method. The results show that the proposed method can accurately estimate the over-temperature risk of a power device in a natural air-cooled converter under different ambient temperature and current levels, thus effectively improving the thermal reliability of converters.

Detailed visualization experiments on the start-up process and stable operation of pulsating heat pipes: Effects of dividing boards

To broaden the applicable orientation for the existing closed loop pulsating heat pipe (CLPHP) with a relatively large tube (internal diameter of 6 mm), this work fabricated a novel quartz CLPHP inserted with a dividing board in the straight section of each tube. The dividing board forms two semi-circles with an effective hydraulic diameter (Dh) of 3.09 mm. This method amplifies the surface tension effect with almost no change in the mass inventory of working fluid. Through a series of visualization experiments, the effect of filling ratio (FR) on the pulsation in the boarded model are first revealed by comparing with the original non-boarded CLPHP under the vertical and the horizontal orientations. The four longitudinal corners generated by dividing board are found not only accelerated the drain down of the liquid slugs but beneficial to the onset of nucleate boiling, prompting the threshold of pulsation motion for 10 - 20 W. Also, the visualization results for the vertical orientation show that the sealing between the dividing boards and the inner tube had a great impact on the performance and heat transfer behavior. The thermal resistance can be improved by 22 - 43 % without leakage between the semi-circles. Under the horizontal orientation, the boarded CLPHP with only three number of turns can be incited with pulsation motion successfully. The boarded design provides additional vapor channels and avoids the liquid slug trains being pushed away from the evaporator during the initial heating period. Also, the un-balanced capillary force due to the hydraulic diameter difference can sustain subsequent pulsation motion. However, the success under only FR = 50 % indicates that an appropriate FR was also necessary.

Bidirectional interlayer cooling of 3D chip stack for temperature uniformity enhancement and hotspot mitigation

In this work, bidirectional interlayer cooling with both enhanced temperature uniformity and low flow resistance is proposed for effective 3D chip stack thermal management. Staggered uniform micropin fins and curved entrance and exit regions are elaborately designed. Experimental and numerical studies are carried out to investigate the cooling characteristics under different Reynolds numbers and heat fluxes. In comparison with common interlayer cooling solutions, counter-flow arrangement is achieved between the layers and vertical heat transfer within the chip stack is utilized. Heat fluxes of 300 W/cm2 and 100 W/cm2 are dissipated in the hotspot and background zones respectively. Total thermal resistance of 0.18 K/W is obtained. The maximum decrease in temperature difference is up to 66.2%. Both thermal resistance and coefficient of performance (COP) are considered and compared with the results from previous studies for comprehensive performance evaluation. The maximum COP of 11,523 is reached. The thermal and hydraulic performance advantages of the present design can be verified. The bidirectional interlayer cooling offers new potential for thermal management of 3D chip stack.

Determination of Self-Heating in Silicon Photomultipliers.

The main consequence of radiation damage on a silicon photomultiplier (SiPM) is a significant increase in the dark current. If the SiPM is not adequately cooled, the power dissipation causes it to heat up, which alters its performance parameters. To investigate this heating effect, a measurement cycle was developed and performed with a KETEK SiPM glued to an Al2O3 substrate and with HPK SiPMs glued to either an Al2O3 substrate or a flexible PCB. The assemblies were connected either directly to a temperature-controlled chuck on a probe station, or through layers of materials with defined thermal resistance. An LED operated in DC mode was used to illuminate the SiPM and to tune the power dissipated in a measurement cycle. The SiPM current was used to determine the steady-state temperature reached by the SiPM via a calibration curve. The increase in SiPM temperature due to self-heating is analyzed as a function of the power dissipation in the SiPM and the thermal resistance. This information can be used to adjust the operating voltage of the SiPMs, taking into account the effects of self-heating. Similarly, this approach can be applied to investigate the unknown thermal contact of packaged SiPMs.