Generation Of Electronic Systems Research Articles

All-printed 3-dimensional micro-supercapacitors with homogeneous Ag interface: Achieving precision on curved surfaces through Electrohydrodynamic jet printing

Despite advancements in manufacturing techniques for micro-supercapacitors (MSCs), significant challenges remain in achieving on-chip miniature devices that conform to complex surfaces, which is crucial for the seamless integration in advanced electronic systems. This study utilizes direct electrohydrodynamic (EHD) 3-dimensional (3D) printing to fabricate all-printed MSCs on planar and curved surfaces, employing Ag as a base material for both current collectors and electrodes to ensure homogeneous interfaces throughout the printed structures. Our approach uniquely manipulates the applied nozzle voltage in the EHD 3D printing process to achieve finely controlled and uniform 3D structures on both flat and curved surfaces. The high-precision EHD jet printer produces MSCs with notably narrow electrode linewidths of approximately 144μm. A 3D MSC cell is then fabricated with 15 EHD 3D-printed stacked layers to achieve a remarkable electrode-line height/width (h/w) ratio of 4.2, which exhibits exceptional electrical performance with an areal capacitance of 763.1 mF cm−2 and energy density of 256.6 μWh cm−2. Additionally, multiple MSCs are EHD 3D-printed on a curved substrate to successfully energize an LED. These findings verify that EHD 3D printing can be utilized to fabricate scalable energy storage devices that can be easily integrated with the next generation electronic systems.

Passive Localization Countermeasure Based on Frequency Diverse Array

Passive localization technology is an integral part of electronic warfare. However, most methods for countering passive localization systems, such as radio frequency stealth and electronic interference, have limitations. This paper proposes a new passive localization countermeasure method based on Frequency Diverse Array (FDA). The unique beam scanning property reduces dwell time at a certain azimuth direction, making it difficult for a passive localization system to intercept FDA signals for a long time. In contrast, the time-varying characteristics of the FDA considerably reduce the signal-to-noise ratio of the received signal, increasing the difficulty in accurately detecting the localization information of the radiation source. Thus, using this new technology, the electronic system platform can perceive the external environment through the signals radiated by the FDA antenna while deceiving the enemy’s passive localization system. Both theoretical analysis and numerical results showed that FDA transmitted signal achieved significantly better localization countermeasure performance in direction finding by an interferometer, frequency difference of arrival, and time difference of arrival, which are particularly useful for a new generation of electronic systems with reconnaissance detection and passive localization countermeasures capability.

Современные устройства, антенны и отражатели с невзаимными свойствами (обзор).

The review deals with microwave antennas, devices (including reflectors), materials and media with nonreciprocal properties, which, due to their uniqueness and promising application, have become the topic of a large number of scientific studies and publications. It is noted that amplitude nonreciprocity can be realized not only with the help of magnetized ferrites and semiconductor amplifiers, but also based on parametric and nonlinear structures using space-time modulation. Therefore, polarization nonreciprocity can also be achieved on magnet-free components, including varactors, and other parametric elements. When analyzing reciprocal reflectors made both on "thin" surface structures and on bulk waveguides, it is appropriate to consider reciprocal cross-polarizing (depolarizing) "invisible"-reflectors, converting the initial polarization of the incident wave into the orthogonal polarization of the reflected wave, which can be built with using only reciprocal passive components without the use of non-reciprocal ones (ferrite circulators, gyrators, etc.). The combination of polarization and nonreciprocal properties in radar reflectors, RFID tags, etc., is an additional degree of freedom in the design of new generation electronic systems.

Two dimensional, bi-layered SnS2@Co3S4 heterostructure formation via SILAR method: Toward high performance supercapacitors with superior electrodes

Herein, we report bi-metal heterostructured cobalt-tin sulfides (h-CTS) via combination of layered structures of tin sulfides (TS) and cobalt sulfides (CS) by using selective ion layer adsorption and reaction (SILAR) method. 2 dimensional (2D) h-CTS (SnS2@Co3S4) exhibits the highest specific capacitance of 1580 Fg−1 at 1 mVs−1 and retain outstanding and improved cyclic stability of 94.8% after 3000 cycles. Excellent capacitive performance of bi-layered h-CTS material via simple and effective binder-free method make it suitable candidate for next generation electronic system.

Consumer Acceptance Analysis of the Home Energy Management System

The purpose of this paper is to study consumer acceptance of the Home Energy Management System, which is the next generation electronic management system that the Korean government plans to implement in households. The Home Energy Management System is a critical device in maximizing the efficiency of electric energy consumption for each household by using a smart grid. Because it can visualize real-time price information on the electricity, households can easily monitor and control the amount of electricity consumption. With this feature, the Home Energy Management System can contribute to consumers’ total energy savings. This is a major reason why the Korean government wishes to implement it nationwide. Since the Home Energy Management System is a product that applies new technology that has not yet been directly encountered by consumers, there may be a difference in the level of public perception of the Home Energy Management System. Therefore, the impact of consumers’ awareness of the Home Energy Management System on their intention to use is important. To do this, the Technology Acceptance Model is utilized in this study. Traditional research on the Technology Acceptance Model includes awareness of usefulness and ease of use as well as intention to use. In contrast, in this research, an extended Technology Acceptance Model with four additional factors—economic benefit, social contribution, environmental responsibility, and innovativeness—that may affect the consumer’s awareness of usefulness and ease of use, is proposed. To collect the data, the survey was conducted with 287 respondents. As a result, the proposed model proved to be suitable in explaining the intention to use with a 70.3% explanation power. It is found that economic benefit (0.231) and innovativeness (0.259) impact on usefulness of the Home Energy Management System. Moreover, usefulness (0.551) has a bigger effect on intention to use than ease of use (0.338) does. Based on this, it is desirable for the Korean government to pursue a public relations strategy that emphasizes the economic benefits, social contributions, and environmental responsibility that will be gained when introducing the Home Energy Management System. It is effective to focus on consumers who are inclined to accept innovation. In addition, more effective results can be obtained by referring to the usefulness of the Home Energy Management System rather than referring to ease of use.

Expression and detection of estrus in dairy cows: the role of new technologies

Despite the widespread adoption of hormonal synchronization protocols that allow for timed artificial insemination (AI), detection of estrus plays an important role in the reproductive management program on most dairies in the United States. Increased physical activity is a secondary sign of estrus in dairy cattle, and a new generation of electronic systems that continuously monitor physical activity to predict timing of AI have been developed and marketed to the dairy industry. A variety of management and physiologic challenges inhibit detection of behavioral estrus on farms, but the prevalence of anouvular cows near the end of the voluntary waiting period is particularly problematic. Only 70% of lactating Holstein cows were detected in estrus when using an activity monitoring system, with the remaining 20% of cows classified as anovular and 10% ovulating without showing signs of activity. Mean time of AI in relation to ovulation based on the activity monitoring system was acceptable for most of the cows with increased activity, however, variability in the duration of estrus and timing of AI in relation to ovulation could result in poor pregnancy outcomes in some cows. Use of a Presynch–Ovsynch protocol for submission of cows for first AI has been widely adopted by dairies in the United States, and a combined approach in which AI based on activity is followed by submission of cows not detected with activity to timed AI after synchronization of ovulation may be an effective strategy for submission of cows to first AI. Based on a field trial on a large commercial dairy in the United States, the activity monitoring system detected 70% of cows with increased activity after the second PGF2α injection of a Presynch–Ovsynch protocol, however, cows inseminated to increased activity had fewer pregnancies per AI (P/AI) compared with cows with increased activity after the second PGF2α injection that received timed AI after completing the Presynch–Ovsynch protocol. Based on an economic model comparing reproductive management programs with varying levels of AI to estrus v. timed AI, the rate of estrus detection and the P/AI to inseminations based on AI to detected estrus v. timed AI affected the decision to inseminate based on activity v. timed AI. In conclusion, an activity monitoring system detected increased activity in about 70% of lactating Holstein cows on a large commercial dairy in the United States, however, synchronization of ovulation and timed AI was beneficial to inseminate cows not detected with increased activity by the activity monitoring system.

Thermal Challenges in Next-Generation Electronic Systems

Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.

Thermal challenges in next generation electronic systems - summary of panel presentations and discussions

The presentations made, as well as the discussions, in the panels at the workshop, Thermal Challenges in Next Generation Electronic Systems (THERMES), are summarized in this paper. The panels dealt with diverse topics including thermal management roadmaps, microscale cooling systems, numerical modeling from the component to system levels, hardware for future high performance and Internet computing architectures, and transport issues in the manufacturing of electronic packages. The focus of the panels was to identify barriers to further progress in each area that require the attention of the research community.

Foreword contributions from thermal challenges in next generation electronic systems (THERMES)

S ELECTRONIC products become faster and incorporate greater functionality, they are also shrinking in size and weight, with continuing pressures for cost reduction. Thermal issues are key in electronic product development at all levels of the electronic product hierarchy, from the chip to the ultimate system. Shrinking system sizes are resulting in increasing volumetric heat generation rates and surface heat fluxes in many products. This has resulted in a significant interest in ultra-compact thermal management devices with high heat removal capabilities. Additional thermal management challenges arise as more and more electronic systems are employed in harsh environments, subject to large variations in ambient temperatures and external thermal loads. A synergistic activity is thermal characterization through computations. High-fidelity modeling schemes are being sought, as product development cycles shrink to a period of months in many portable products. The United Engineering Foundation Workshop “Thermal Challenges in Next Generation Electronic Systems (THERMES),” was held in Santa Fe, NM, January 13‐16, 2002, with support from the U.S. National Science Foundation. The focus was on recent advances in thermal management and characterization schemes, as well as forecasts and analyzes of future trends. Three keynote lectures and nine invited talks in selected emerging areas from leading experts in industry and academia were complemented with contributed papers organized into nine technical sessions. Five panel discussions

The automated interactive microscope (AIM) for investigating the functional dynamics of living cells: Status and vision

The current status and future development plans for the Automated Interactive Microscope (AIM), to better define the mechanisms of the function of living cells, is described. The development of AIM is fueled by biologists need to spatially and temporally correlate biochemical, molecular and genetic patterns to study cell functions such as division, locomotion and endocytosis. AIM will allow the investigator to use the cell as a “living microcuvette”.AIM redefines the meaning of the term “microscope” to include the functional capability of the microscope system provided by computerization, in addition to the more classical definition which emphasizes the opto-mechanical hardware. AIM is an next generation electronic light microscope imaging system which has grown out of our work in the development of the multimode light microscope. New functionality includes new experiment control facilities as well as related multidimensional image processing, image analysis and interactive data visualization. AIM is built around microscope hardware with high precision motion controls and a powerful host workstation computer linked, via a very high speed data gateway, with the high performance computing and communication (HPCC) facilities of the Pittsburgh Supercomputing Center (PSC).

The fifth generation process control architecture

The “fifth generation” architecture for process control systems will be based on the use of a “field bus” as being defined by the ISA SP50 standards committee. While a name has not yet been given to this architecture, this paper will call it “Network Control” to distinguish it from the fourth generation “Distributed Control”. While all previous generations worked to increase the operator's span of control, this new architecture will achieve most of its benefits through increased functionality and performance and decreased installed cost. One major driving force for this architecture should be the rapid segmentation of the process control market where parts of a total system would be supplied by the vendors most able to meet the user's needs at the lowest price. The effect of this will be a restructuring of the process control market, to the benefit of those users who can take advantage of the changed product offerings. While it is expected that all of the traditional process control system vendors will participate with their total product lines, they will no longer be able to control the market. The new functionality may also be the final blow to second generation pneumatic and electronic analog control systems.

Advanced Discrete Wiring Technology: A Solution for High Density Sub‐nanosecond Interconnection

Advanced discrete wiring systems are being developed to produce state‐of‐the‐art circuit boards for packaging the next generation electronic systems. The demands placed on electronic interconnection by very high speed VLSI devices have created a need for large circuit boards that will support high interconnection density. At the same time these circuit boards must maintain the necessary transmission line parameters to transport signals with sub‐nanosecond rise times and retain signal fidelity.