Integration Of Electronic Systems Research Articles

Assessing urban family physician program challenges in Iran: the insurance organizations’ perspective(2021)

BackgroundThe Family Physician Programme is a key health reform in Iran that faces significant challenges in urban areas, particularly in Mazandaran and Fars provinces The study aims to critically evaluate the challenges encountered in the Urban Family Physician Program, with a particular focus on the perspectives of insurance organizations.MethodsA qualitative approach was adopted, involving semi-structured interviews with 22 experts and managers from basic health insurance funds. Snowball sampling facilitated participant selection, and interviews proceeded until saturation. Data analysis utilized content analysis and Atlas-T software, adhering to COREQ criteria.ResultsImplementation problems of the urban family physician program were categorized into ten Categories and 22 Subcategories, including financing, stewardship, human resources, structure, culture, information system, payment, monitoring and control, the function of insurance organizations, and implementation.ConclusionThe urban family physician program’s implementation challenges, as viewed by health insurance organizations, underscore the necessity for strategic decision-making in financing, payment models, electronic system integration, structural adjustments, comprehensive monitoring, evaluation, cultural considerations, and appropriate devolution to insurance entities.

All-printed 3-dimensional micro-supercapacitors with homogeneous Ag interface: Achieving precision on curved surfaces through Electrohydrodynamic jet printing

Despite advancements in manufacturing techniques for micro-supercapacitors (MSCs), significant challenges remain in achieving on-chip miniature devices that conform to complex surfaces, which is crucial for the seamless integration in advanced electronic systems. This study utilizes direct electrohydrodynamic (EHD) 3-dimensional (3D) printing to fabricate all-printed MSCs on planar and curved surfaces, employing Ag as a base material for both current collectors and electrodes to ensure homogeneous interfaces throughout the printed structures. Our approach uniquely manipulates the applied nozzle voltage in the EHD 3D printing process to achieve finely controlled and uniform 3D structures on both flat and curved surfaces. The high-precision EHD jet printer produces MSCs with notably narrow electrode linewidths of approximately 144μm. A 3D MSC cell is then fabricated with 15 EHD 3D-printed stacked layers to achieve a remarkable electrode-line height/width (h/w) ratio of 4.2, which exhibits exceptional electrical performance with an areal capacitance of 763.1 mF cm−2 and energy density of 256.6 μWh cm−2. Additionally, multiple MSCs are EHD 3D-printed on a curved substrate to successfully energize an LED. These findings verify that EHD 3D printing can be utilized to fabricate scalable energy storage devices that can be easily integrated with the next generation electronic systems.

Remote patient monitoring for early detection of immune checkpoint inhibitor therapy-related pneumonitis in high-risk patients: A pilot-feasibility study.

e13806 Background: Immune checkpoint inhibitor therapy-related (ICI) pneumonitis poses a significant challenge for patients with cancer. It is associated with increased clinical morbidity and mortality, often resulting in prolonged hospital stays and delays and/or discontinuation of cancer-directed treatment. Early detection and prompt treatment of ICI pneumonitis is critical to improve patient outcomes. Therefore, our institution implemented a remote patient monitoring (RPM) program leveraging in-home, electronic health record-integrated technology and virtual centralized nursing to monitor vital signs and patient symptoms in “high-risk” patients treated with immunotherapy. Methods: Patients receiving immunotherapy deemed to be “high-risk” for ICI pneumonitis seen at Mayo Clinic Rochester, Minnesota were offered enrollment in the RPM program beginning in June 2023. High-risk patients included those with pre-existing lung disease (chronic obstructive pulmonary disease, interstitial lung disease); those with a history of resolved ICI pneumonitis being rechallenged with immunotherapy; and those with grade 1 ICI pneumonitis continuing immunotherapy. Eligible patients who agreed to participate in the program were provided a kit consisting of RPM technology and electronic symptom questionnaires. The kit included an armband for continuous vital sign monitoring, a blood pressure monitor, a scale to measure weight, and a pre-connected cellular-enabled tablet for questionnaire answering. RPM data utilized real-time electronic health system integration and predetermined parameters to alert RPM nurses. Pre-specified escalation care pathways were then used to respond and escalate care, as necessary. The primary outcome of this pilot study was to assess the feasibility of implementing an RPM program in this patient population with a secondary outcome to determine the ability to detect ICI pneumonitis before significant clinical symptoms. Results: Sixteen patients were enrolled of whom 5 declined participation (2 due to inconvenience and 3 for unclear reasons) resulting in 11 patients who underwent monitoring. Five patients graduated monitoring without detection of ICI pneumonitis within a 4-month timeframe. Six patients are currently undergoing RPM. 372 alerts occurred of which 8 (2%) were escalated to physician review. These alerts included elevated heart rate in 4, shortness of breath in 3, and elevated blood pressure in 1. One patient was triaged to an emergency department and diagnosed with grade 2 ICI pneumonitis. Conclusions: We show that RPM in patients who are at high-risk for developing ICI pneumonitis can be effectively integrated into a care model and monitor pneumonitis related symptoms. Further studies are needed to prove whether RPM is beneficial in this population including other ICI toxicities.

Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration

AbstractHeterogeneous integration is a key driver within the field of advanced electronic packaging. The realization of tomorrow’s highly integrated electronic systems depends on the combination and compatibility of various integration technologies at the same hierarchy level. The adoption of novel bonding technologies for a cost-effective realization of multi-chiplet systems is a key aspect. Cu nanowire (NW) interconnects exhibit distinct advantages in terms of their scalability down to a few micrometers, the resulting joint properties and moderate demands with respect to the surface preparation, and the cleanliness of the bonding environment. No solder or flux is required for the bonding process, but the NW bumps still can compensate low height differences. The bonding process can be carried out near room temperature under ambient conditions. We demonstrate the technological possibility to integrate the Cu-NWs for a bump processing scheme including the Cu seed etching on 300 mm wafer for the first time. This paper focuses on the microstructure evaluation and the shear test of the formed Cu-NW interconnects fabricated under ambient conditions within a few seconds. The microstructure analysis shows the intact bonded interconnects and reveals high-resolution details of Cu-NWs. The shear strength of the formed interconnects varies between 4.6 MPa and 90.5 MPa depending on the bonding and annealing conditions. Overall, the results of this study highlight the potential of Cu-NW interconnects for future 3D heterogeneous system integration.

Documentation for Orthopaedic Surgery: An Audit to Ensure Compliance with the Most Recent Guidelines

Background: Consistent and thorough documentation in orthopaedic surgery is critical for ensuring quality patient care and protecting the legal interests of surgeons. Adherence to the Royal College of Surgeons (RCS) guidelines is fundamental to achieving this. However, studies have identified a persistent deficiency in compliance with these guidelines across various surgical specialities. Objective: The audit aimed to evaluate the existing compliance of orthopaedic surgical documentation with RCS guidelines at Dr. Ziauddin Hospital and to implement a tool to improve documentation practices. Methods: A closed-loop, two-cycle audit was conducted. The first cycle retrospectively analysed 200 surgical notes from January to July 2023, using a standardized operation sheet to assess compliance with RCS guidelines. Identified deficiencies were addressed by introducing an aide-memoir in all orthopaedic operating rooms. The second cycle prospectively analysed 100 surgical notes from August to October 2023 to evaluate the impact of the intervention. Results: The initial audit revealed a 0% compliance rate in documenting the date, time, and type of surgery (elective or emergency). Following interventions, the second cycle showed significant improvements, with compliance rates rising to 100% for date and time, and to 87% for identifying the surgery type. Additional documentation parameters such as the recording of the assistant's name and incision details also improved, though exact numerical increases were not specified. Conclusion: Introducing an aide-memoir significantly enhanced compliance with RCS surgical documentation guidelines. This simple, effective tool facilitated a remarkable improvement in the quality of operative notes, underscoring the need for regular audits and potential integration of electronic documentation systems.

Chiplets for Integration of Electronic Systems

Scaling down of transistor sizes has made it possible to integrate billions of devices in the same chip, allowing us to build entire electronic systems into tiny “systems on chip” (SoC). For about four decades after the proclamation of Moore's law, device scaling resulted in improvements in area, performance as well as power. In the last two decades, many semiconductor manufacturers stopped investing in new technology nodes since the design, manufacturing, and test challenges in deep submicron technologies are far too steep. Today, semiconductor companies do not rely on improvements in photolithography alone to build more complex systems. Similarly, optimizations at gate level or register-transfer level through electronic design automation tools will not suffice to bring in order-of-magnitude increase in the complexity of SoC, since these tools are already mature. Therefore, optimization at the system level is the only logical step forward. Chiplets represent a system-level packaging innovation and there is much research and development in using this technology for building high-performance computing systems. We believe that it will be worthwhile to include the topic of system-level integration in a course on Very Large-Scale Integrated Circuit Design taught in the Universities and provide a tutorial treatment to help teachers and students.

Hybrid Printed Rigidity‐Programmable Substrate/Liquid Metal 3D Circuits Toward Stretchable Electronics

AbstractStretchable electronics have the unique capability of 3D (three dimensional) deformation, overcoming the brittleness of traditional inorganic electronics. However, during large deformations, different scale strains between the rigid and stretchable components lead to mismatch, causing interconnect failures. Therefore, the development of the rigidity‐programmable substrate with effective strain shielding capabilities has become a research hotspot. Furthermore, the exponential growth in electronic density presents challenges in the circuit design of stretchable electronics. The urgent need is to develop highly integrated stretchable electronic systems. In this study, a highly integrated stretchable pulse sensor with effective strain shielding capabilities using hybrid 3D printing technology is developed, which comprises electronic chips, a rigidity‐programmable substrate/encapsulation layer printed by using PSC (polydimethylsiloxane/silica‐nanoparticles composite)‐based ink, and LM (liquid metal)‐based 3D circuits. First, the PSC‐based ink is optimized to enhance the strain shielding effectiveness of the rigidity‐programmable substrate. Meanwhile, 3D printing parameters are optimized to achieve high printing precision with minimum line widths below 100 µm. The resulting stretchable pulse sensor demonstrated good mechanical and electrical stability under complex 3D deformations, including bending, twisting, and stretching. The PSC region strain of the sensor is only ≈2% when the global strain is up to ≈65%, which exhibited effective strain shielding capabilities.

Recent Development of Lens Array Fabrication: A Review

The lens array is a multi-functional optical element, which can modulate the incident light such as diffusion, beam shaping, light splitting, and optical focusing, thereby achieving large viewing angle, low aberration, small distortion, high temporal resolution, and infinite depth of field. Meanwhile, it has important application potential in the form, intelligence and integration of op-to electronic devices and optical systems. In this paper, the optical principle and development history of lens arrays are introduced, and the lens array fabrication technologies such as ink jet printing, laser direct writing, screen printing, photo lithography, photo polymerization, hot melt reflow and chemical vapor deposition are reviewed. The application progress of lens arrays in imaging sensing, illumination light source, display and photovoltaic fields is presented. And this paper prospected the development direction of lens arrays, and discussed the development trends and future challenges of new directions such as curved lenses, superimposed compound eye systems, and the combination of lenses and new op-to electronic materials.

BLAST: A Wafer‐Scale Transfer Process for Heterogeneous Integration of Optics and Electronics

AbstractA general transfer method is presented for the heterogeneous integration of different photonic and electronic materials systems and devices into a single substrate. Called BLAST, for Bond, Lift, Align, and Slide Transfer, the process works at wafer scale and offers precision alignment, high yield, varying topographies, and suitability for subsequent lithographic processing. BLAST's capabilities is demonstrated by integrating both GaAs and GaN µLEDs with silicon photovoltaics to fabricate optical wireless integrated circuits that up‐convert photons from the red to the blue. The study also shows that BLAST can be applied to a variety of other devices and substrates, including CMOS electronics, vertical cavity surface emitting lasers (VCSELs), and 2D materials. BLAST further enables the modularization of optoelectronic microsystems, where optical devices fabricated on one material substrate can be lithographically integrated with electronic devices on a different substrate in a scalable process.

Pharmacovigilance in Saudi Arabia: A Narrative Review on Adverse Drug Reaction Reporting

Adverse drug reaction (ADR) reporting is an important aspect of pharmacovigilance (PV) in ensuring drug safety during the post-marketing surveillance phase. Currently, the National Pharmacovigilance Center (NPC) established by the Saudi Food and Drug Authority (SFDA) is the regulatory authority receiving ADR reports in Saudi Arabia. Spontaneous ADR reports from healthcare professionals and the public are received by the NPC through an electronic platform known as the Saudi Vigilance System. Signal analysis of the received ADR reports aids the decision-making initiatives related to the reported drugs. Stakeholders’ contribution to ADR reporting, and implementation of effective electronic platforms are important factors affecting the national PV performance. The concept of stakeholders reporting on ADR is relatively new in Saudi Arabia, especially to the public. In this narrative review the national studies describing the stakeholders’ knowledge, perception and barriers toward ADR reporting, and the incidence of ADR reporting by healthcare institutions in Saudi Arabia were evaluated. The findings indicate that more efforts are needed by the SFDA to educate stakeholders about the importance of ADR reporting. The study recommends ADR electronic systems integration between the SFDA and healthcare institutions to improve the frequency and quality of ADR reports, and regular feedback on decisions made about ADR reports should be provided by the SFDA to stakeholders to improve their awareness of the importance of ADR reporting and enhance their contribution to PV and ADR reporting process.

Hydrophilic Bonding of SiO2/SiO2 and Cu/Cu using Sequential Plasma Activation

Hybrid bonding is an indispensable technique for the 3D integration of electronic systems. Cu-to-Cu interconnections and SiO2-to-SiO2 dielectric layers should be bonded simultaneously in the wafer-to-wafer bonding process. In this study, sequential plasma activation (SPA) including O2 plasma, N2 plasma, and N radical is investigated for low-temperature bonding of Cu and TEOS SiO2 at 200°C. The SPA bonding improves the bond strength to more than 1 J/m2 compared to the conventional single gas plasma activation bonding. The surface analysis indicates that SPA forms oxynitrides on TEOS SiO2 surface and Cu oxide with adsorbed water on the Cu surface, facilitating the bonding interface formation. The presented technique will contribute to the hybrid bonding applications at lower temperatures.

Highly Reliable Textile-Type Memristor by Designing Aligned Nanochannels.

Information-processing devices are the core components of modern electronics. Integrating them into textiles is the indispensable demand for electronic textiles to form close-loop functional systems. Memristors with cross-bar configuration are regarded as promising building blocks to design woven information-processing devices that seamlessly unify with textiles. However, the memristors always suffer from severe temporal and spatial variations due to the random growth of conductive filaments during filamentary switching processes. Here, inspired by the ion nanochannels across synaptic membranes, we report a highly reliable textile-type memristor made of Pt/CuZnS memristive fiber with aligned nanochannels, showing small set voltage variation (<5.6%) under ultralow set voltage (∼0.089V), high on/off ratio (∼106 ) and low power consumption (0.1 nW). Experimental evidences indicate that nanochannels with abundant active S defects could anchor silver ions and confine their migrations to form orderly and efficient conductive filaments. Such memristive performances enable the resultant textile-type memristor array to have high device-to-device uniformity and process complex physiological data like brainwave signals with high recognition accuracy (95%). Our textile-type memristor arrays are mechanically durable to withstand hundreds of bending and sliding deformations, and seamlessly unified with sensing, power-supplying and displaying textiles/fibers to form all-textile integrated electronic systems for new-generation human-machine interactions. This article is protected by copyright. All rights reserved.

LIGHT: Lightweight Authentication for Intra Embedded Integrated Electronic Systems

As embedded integrated electronic systems (EIESs) become more pervasive (including in mission-critical applications), the need to ensure the security of data exchange in such a system against various malicious activities becomes more pronounced. However, designing secure and efficient solutions, such as authentication protocols, for the many different embedded systems with varying internal communication modes remains challenging. Therefore, in this paper, we propose a lightweight authenticated key-exchange (AKE) protocol for EIESs based on half-duplex and “command/response” bus. Specifically, the proposed protocol is designed to operate on resource-constrained devices, as well as having minimal number of interactions. We then prove the security of the proposed protocol and present the security parameter selection strategy for protocol implementation based on the empirical evaluations. Moreover, efficiency analysis also shows that the protocol can be effectively deployed in the EIESs environment.

Nanopolyhybrids: Materials, Engineering Designs, and Advances in Thermal Management.

The fundamental requirements for thermal comfort along with the unbalanced growth in the energy demand and consumption worldwide have triggered the development and innovation of advanced materials for high thermal-management capabilities. However, continuous development remains a significant challenge in designing thermally robust materials for the efficient thermal management of industrial devices and manufacturing technologies. The notable achievements thus far in nanopolyhybrid design technologies include multiresponsive energy harvesting/conversion (e.g., light, magnetic, and electric), thermoregulation (including microclimate), energy saving in construction, as well as the miniaturization, integration, and intelligentization of electronic systems. These are achieved by integrating nanomaterials and polymers with desired engineering strategies. Herein, fundamental design approaches that consider diverse nanomaterials and the properties of nanopolyhybrids are introduced, and the emerging applications of hybrid composites such as personal and electronic thermal management and advanced medical applications are highlighted. Finally, current challenges and outlook for future trends and prospects are summarized to develop nanopolyhybrid materials.

Biohybrid 3D Printing of a Tissue-Sensor Platform for Wireless, Real-Time, and Continuous Monitoring of Drug-Induced Cardiotoxicity.

Drug-induced cardiotoxicity is regarded as a major hurdle in the early stages of drug development. Although there are various methods for preclinical cardiotoxicity tests, they cannot completely predict the cardiotoxic potential of a compound due to the lack of physiological relevance. Recently, 3D engineered heart tissue (EHT) has been used to investigate cardiac muscle functions as well as pharmacological effects by exhibiting physiological auxotonic contractions. However, there is still no adequate platform for continuous monitoring to test acute and chronic pharmacological effects in vitro. Here, a biohybrid 3D printing method for fabricating a tissue-sensor platform, composed of a bipillar-grafted strain gauge sensor and EHT, is first introduced. Two pillars are three-dimensionally printed as grafts onto a strain gauge-embedded substrate to promote the EHT contractility and guide the self-assembly of the EHTs along with the strain gauge. In addition, the integration of a wireless multi-channel electronic system allows for continuous monitoring of the EHT contractile force by the tissue-sensor platform and, ultimately, for the observation of the acute and chronic drug effects of cardiotoxicants. In summary, biohybrid 3D printing technology is expected to be a potential fabrication method to provide a next-generation tissue-sensor platform for an effective drug development process.

A Review of Flexible Strain Sensors Based on Natural Fiber Materials

AbstractFlexible strain sensors with outstanding stretchability and sensitivity can be widely used in medical health, smart robot, intelligent garment, man‐machine interaction, and other fields. The use of natural fibers enables a green manufacturing pathway to design strain sensors within the context of increasingly serious environmental pollution. Commercialized natural fibers, including cellulose fibers (cotton and fibrilia), protein fibers (wool and silk), and their regenerated materials (viscose and silk fibroin) exhibit low cost, easy acquisition, and degradability as the basis materials. This paper reviews the preparation methods, performances, and applications of flexible strain sensors based on these natural fibers. Cellulose and protein fibers are carbonized or coated with conductive nanomaterials to form the strain sensing network, and then, elastic polymers are used to improve the sensor strain range. Regenerated natural fiber materials can be uniformly mixed with conductive materials to form conductive composites for sensors. The strain‐sensing performances and mechanisms are analyzed and compared. Natural fiber‐based strain sensors are studied to pave the way for practical integration in electronic systems.

Artificial Intelligence Based Approach for Classification of Human Activities Using MEMS Sensors Data.

The integration of Micro Electronic Mechanical Systems (MEMS) sensor technology in smartphones has greatly improved the capability for Human Activity Recognition (HAR). By utilizing Machine Learning (ML) techniques and data from these sensors, various human motion activities can be classified. This study performed experiments and compiled a large dataset of nine daily activities, including Laying Down, Stationary, Walking, Brisk Walking, Running, Stairs-Up, Stairs-Down, Squatting, and Cycling. Several ML models, such as Decision Tree Classifier, Random Forest Classifier, K Neighbors Classifier, Multinomial Logistic Regression, Gaussian Naive Bayes, and Support Vector Machine, were trained on sensor data collected from accelerometer, gyroscope, and magnetometer embedded in smartphones and wearable devices. The highest test accuracy of 95% was achieved using the random forest algorithm. Additionally, a custom-built Bidirectional Long-Short-Term Memory (Bi-LSTM) model, a type of Recurrent Neural Network (RNN), was proposed and yielded an improved test accuracy of 98.1%. This approach differs from traditional algorithmic-based human activity detection used in current wearable technologies, resulting in improved accuracy.

Van der Waals Layer Transfer of 2D Materials for Monolithic 3D Electronic System Integration: Review and Outlook.

Two-dimensional materials (2DMs) have attracted a great deal of interest due to their immense potential for scientific breakthroughs and technological innovations. While some 2D transition metal dichalcogenides (TMDC) such as MoS2 and WS2 are considered as the ultimate channel materials in unltrascaled transistors as replacements for Si, there has also been increasing interest in the monolithic 3D integration of 2DMs on the Si CMOS platform or in flexible electronics as back-end-of-line transistors, memory devices/selectors, and sensors, taking advantage of 2DM properties such as a high current driving capability with low leakage current, nonvolatile switching characteristics, a large surface-to-volume ratio, and a tunable bandgap. However, the realization of both of these scenarios critically depends on the development of manufacturing-viable high-yield 2DM layers transfer from the growth substrate to the Si, since the growth of high-quality 2DM layers often requires a high-temperature growth process on template substrates. Motivated by this, extensive efforts have been made by the 2DM research community to develop various 2DM layer transfer methods, leveraging the van der Waals transfer capability of the layer-structured 2DMs. These efforts have led to a number of successful demonstrations of wafer-scale 2D TMDC layer transfer, while 2DM-enabled template growth/transfer of some functional bulk materials such as III-V, Ge, and AlN has also been demonstrated. This review surveys and compares different 2DM transfer methods developed recently, with a focus on large-area 2D TMDC film transfer along with an introduction of 2DM template-assisted van der Waals growth/transfer of non-2D thin films. We will also briefly present an outlook of our envisioned multifunctionalities in 3D integrated electronic systems enabled by monolithic 3D integration of 2DMs and III-V via van der Waals transfer and discuss possible technology options for overcoming remaining challenges.

Improving the handover of complex trauma patients by implementing a standardised process

BackgroundPatient handover continues to be an international health priority in the prevention of patient harm. Transitioning patients from the intensive care unit (ICU) to the ward is complex, particularly for trauma patients, due to the multifaceted aspects of their care requirements as a result of multiple injuries and different speciality teams. Objectives/aimTo design, implement, and evaluate the efficacy of a standardised handover process and tool for the transfer of ICU trauma patients. MethodsA multimethod before/after study design was used. This included observations before and after an implemented transfer process and semistructured interviews with ICU and ward nurses caring for trauma patients. Comparisons were made of data before and after the intervention. ResultsEleven patient handovers were observed, and 21 nurses (11 from the ICU and 10 from the ward) were interviewed. Patients and family members were included during the handover following the intervention (n = 0/10 [0%] vs n = 4/11 [36%]) and the ward nurses were asked if they had any concerns (n = 5/10 [50%] vs n = 10/11 [91%]). Improvements in patient observations handed over were reported following the intervention. However, omissions remained in some key areas including patient introduction, patient identity, fluid balance, and allergies/alerts. Thematic analysis of interviews revealed that the new handover process was perceived advantageous by both ICU and ward nurses because of its structured and comprehensive approach. Identified future improvements included the need for hospital service managers to ensure integration of ICU and ward electronic health record systems. ConclusionPrecise, accurate, and complete handover remains a patient safety concern. Improvements were achieved using a standardised process and handover tool for the transfer of complex trauma patients. Further improvements are required to reduce the failure to hand over essential patient information.

Failure Mechanism of pHEMT in Navigation LNA under UWB EMP.

With the development of microelectronic technology, the integration of electronic systems is increasing continuously. Electronic systems are becoming more and more sensitive to external electromagnetic environments. Therefore, to improve the robustness of radio frequency (RF) microwave circuits, it is crucial to study the reliability of semiconductor devices. In this paper, the temporary failure mechanism of a gallium arsenide (GaAs) pseudomorphic high electron mobility transistor (pHEMT) in a navigation low-noise amplifier (LNA) under the jamming of ultra-wideband (UWB) electromagnetic pulses (EMP) is investigated. The failure process and failure mechanism of pHEMT under UWB EMP are elaborated by analyzing the internal electric field, current density, and temperature distribution. In detail, as the amplitude of UWB EMP increases, the output current, carrier mobility, and transconductance of pHEMT decrease, eventually resulting in gain compression. The injection experiment on LNA, which effectively verified the failure mechanism, indicates that the gain of pHEMT is suppressed instantaneously under the jamming of UWB EMP and the navigation signal cannot be effectively amplified. When UWB EMP amplitude increases to nearly 10 V, the BeiDou Navigation Satellite System (BDS) carrier signal is suppressed by nearly 600 ns. Experimental results accord well with the simulation of our model. UWB EMP jamming is a new and efficient type of electromagnetic attack system based on the device saturation effect. The performance degradation and failure mechanism analysis contribute to RF reinforcement design.