Electroless Plating Of Palladium Research Articles

ギ酸を還元剤とするモノアミノジカルボン酸錯体浴からの無電解パラジウムめっき

An electroless Palladium plating aiming “no emission” were investigated using formic acid as the reducing agent, and monoaminodicarboxylic acid as the complexing agent. Stability constants of Pd2+ complexes are log K1=15, log K2=6 for L-glutamic acid (Glu), and log K1=15, log K2=7 for L-aspartic acid (Asp). The potential-pH equilibrium diagram for Pd2+-Glu (or Asp) and HCOO--HCO3- systems indicates that electroless palladium plating is thermodynamically possible when formic acid is used as the reducing agent. These complex baths exhibited good storage stability, and pure palladium films were deposited autocatalytically. Results of testing for solderability and for electrical contact resistance indicated that electroless pure palladium plating is suitable as an alternative to electrolytic and electroless gold plating of electronic parts.

無電解めっき 無電解パラジウムめっきと応用

無電解めっき 無電解パラジウムめっきと応用

Electroless Palladium Plating from Ethylenediamine Complex Bath Using Formic Acid as a Reducing Agent.

We discuss plating conditions on electroless pure palladium plating from palladium-ethylenediamine complex baths and evaluate the adptability of this technique to different electronic parts

Laser-Enhanced Palladium Electroless Plating

SummaryLaser-enhanced palladium electroless plating was found to be possible in the presence of a small quantity of Tl+ or Pb2+. The thermal conductivity of the substrate is an important factor. In order to induce electroless plating, a localized increase in temperature at the metal-solution interface by laser irradiation is necessary. Although the laser-enhanced palladium plating did not occur on copper and brass, which are good heat-conductive materials, it became possible with 5 μm of poorly heat-conductive nickel plating on these metals. The effects of the velocity of flow of the plating solution and the laser power, on the shape of the palladium deposit were evaluated. Line drawing was attempted, and the best results were obtained at 7–7.5 μm/s of laser sweep rate, with which the line width was about 20 μm.

Electroless Palladium Plating from an Ethylenediamine Complex Bath using Phosphite as a Reducing Agent

SUMMARYElectroless palladium plating was investigated from palladium-ethylenediamine complex solutions containing sodium phosphite as a reducing agent.The deposition process proceeded autocatalytically as with hypophosphite, but the phosphorus content in the deposits was much lower.From the experimental results on solderability and electric contact resistance, it was suggested that electroless palladium plating could be utilized as an alternative to gold plating on electrical contacts and to solder or the preflux coat for ensuring good solderability.

トリメチルアミンボランを還元剤とする無電解パラジウムめっきの物質収支および析出機構

The deposition mechanism in palladium electroless plating from ethylenediamine complex solutions containing trimethylamine borane (TMAB) as a reducing agent was investigated.The TMAB utilization factor was found to be 68% to 86% for palladium deposition and 25% to 32% for boron deposition. The deposition mechanism can be explained by the electrochemical mechanism, based on the following reactions.Local anodic reaction(CH3)3NBH3+2H2O→(CH3)3N+BO2-+7H+6e-Local cathodic reactionPd2++2e-→PdmPd2++(CH3)3NBH3+(2m-3)e-→PdmB+(CH3)3N+3H+

トルメチルアミンボランを還元剤とする無電解パラジウムめっき皮膜の結晶構造

This report describes the crystal structure of and heat-induced structural changes in electroless palladium plating films deposited from an ethylenediamine complex bath using trimethylamine borane as a reducing agent. The boron content of the films and their crystallinity were proportional to the concentration of trimethylamine borane in the bath. X-ray diffraction data showed a diffused pattern, in as-plated films (before heat-treatment), which changed into the sharp crystalline features of PdH0.706 at 400°C, and the sharp crystalline features of the Pd phase after heat-treatment at 600°C. The diffraction angle of the Pd phase shifted to a slightly lower angle following an increase in boron content.

Laser-Enhanced Palladium Electroless Plating.

Laser-Enhanced Palladium Electroless Plating.

ＦＴＩＲ ＡＴＲ法による無電解パラジウム―リン合金めっき浴中の浴成分のモニタリング

Monitoring of electroless palladium plating baths using hypophosphite as a reducing agent and ethylenediamine (en) as a complexing agent was investigated by FTIR ATR spectrometry.Linear relationships were obtained between the absorbance of the characteristic absorption bands and the concentrations of Pden22+ complex, en, hypophosphite and phosphite. In continuously used baths with large accumulations of phosphite, the ATR spectra of phosphite, Pden22+ complex and hypophosphite overlapped, but even in these cases compositions could be determined by curve fitting.

亜リン酸塩を還元剤とする無電解Ｐｄ‐Ｐ合金めっき皮膜のはんだ付け性および接触抵抗

The solderability and electric contact resistance of chemically deposited Pd-P alloy using phosphite as reducing agent was investigated.From the experimental results, it is suggested that electroless palladium plating can be utilized as alternative both to the gold plating on electrical contacts and to soldering or preflux coating to retain good solderability.

低応力無電解パラジウムめっきとその特性

低応力無電解パラジウムめっきとその特性

Preparation of supported thin palladium-silver alloy membranes and their characteristics for hydrogen separation

Abstract Studies have been made on the characterization of composite membranes, consisting of a palladium-silver alloy film on the outer surface of an inorganic porous support, for hydrogen separation. The membranes were prepared in the manner of consecutive electroless-plating of palladium and silver, and then heat treatment in a stream of argon. As high temperatures above 1073 K were required to form a miscible palladium-silver alloy film, thermally durable porous alumina ceramic was selected as the support. The membranes thus prepared had a complete selectivity for hydrogen separation and they exhibited an extremely high rate of hydrogen permeation compared with commercial palladium-based membranes. For instance, permeation was about 30 times faster when 23 wt.% silver was melted to give a film thickness of 5.7 μm. The high rate of hydrogen permeation is a result of enhanced hydrogen solubility into the metal film as well as its reduced thickness.

小特集／無電解めっきの現状と将来 無電解パラジウムめっきの現状と将来

小特集／無電解めっきの現状と将来 無電解パラジウムめっきの現状と将来