Abstract
The deposition mechanism in palladium electroless plating from ethylenediamine complex solutions containing trimethylamine borane (TMAB) as a reducing agent was investigated.The TMAB utilization factor was found to be 68% to 86% for palladium deposition and 25% to 32% for boron deposition. The deposition mechanism can be explained by the electrochemical mechanism, based on the following reactions.Local anodic reaction(CH3)3NBH3+2H2O→(CH3)3N+BO2-+7H+6e-Local cathodic reactionPd2++2e-→PdmPd2++(CH3)3NBH3+(2m-3)e-→PdmB+(CH3)3N+3H+
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