In order to make the service life of microelectronic devices longer, titanium nitride electrode films need to meet the requirements of high electrical conductivity and low internal stress. In this paper, the effect of substrate bias voltage on the properties of titanium nitride films prepared by direct current (DC) reactive magnetron sputtering was studied systematically. The changes of titanium nitride films properties were investigated in detail from the aspects of resistivity, growth rate, crystal orientation, roughness and internal stress. The results show that the introduction of substrate bias voltage is conducive to the formation of dense titanium nitride films. Considering that the resistivity and internal stress of titanium nitride film vary with substrate bias voltage, the film deposited at substrate bias voltage of -100 V is selected as the electrode film material with the best performance (resistivity of 47.5 μΩ·cm, roughness of 1.1 nm and internal stress of -5.6 GPa).
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