DUV LEDs Research Articles

High Efficiency Deep Ultraviolet Light-Emitting Diodes With Polarity Inversion of Hole Injection Layer

In this work, we investigate the performance improvement of N-polar AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs) by the inversion of the hole injection layer from N-polar to Ga-polar. The influence of different inversion points on the performance and the energy band of DUV LED is systematically studied, and the principle of performance improvement of DUV LED is explained in detail through the analysis of the energy band. Furthermore, according to the simulation results and practical application, an appropriate inversion point is selected. Under the current of 120 mA, with polarity inversion of the hole injection layer, the light output power of the DUV LEDs increases from 21.34 mW to 29.71 mW, and the applied voltage reduces from 16.06 V to 9.63 V. The DUV LED with polarity inversion has a 132% increase in wall-plug efficiency (WPE) compared with the DUV LED which is totally along [000-1] direction. Therefore, polarity inversion is an effective way to achieve high-performance UV-LEDs.

Intelligent optimization design of electron barrier layer for AlGaN-based deep-ultraviolet light-emitting diodes

AlGaN-based deep-ultraviolet light-emitting diodes (DUV LEDs) are widely used in sterilization, sensing, water purification, medical treatment, non-line of sight (NLOS) communication and many other fields. Especially it has been reported that the global novel coronavirus (COVID-19) can be effectively inactivated by the DUV light with a wavelength below 280 nm (UVC) within a few seconds, which has also attracted great attention. However, the external quantum efficiency (EQE) of UVC LED is still at a low level, generally not more than 10%. As an important component of EQE, internal quantum efficiency (IQE) plays a crucial role in realizing high-performance DUV-LED. In order to improve the IQE of AlGaN-based DUV-LED, this work adopts an electron blocking layer (EBL) structure based on InAlGaN/AlGaN superlattice. The results show that the superlattice EBL structure can effectively improve the IQE compared with the traditional single-layer and double-layer EBL structure for the DUV-LED. On this basis, the optimization method based on JAYA intelligent algorithm for LED structure design is proposed in this work. Using the proposed design method, the InAlGaN/AlGaN superlattice EBL structure is further optimized to maximize the LED’s IQE. It is demonstrated that the optimized superlattice EBL structure is beneficial to not only the suppression of electron leakage but also the improvement of hole injection, leading to the increase of carrier recombination in the active region. As a result, the IQE of the DUV-LED at 200 mA injection current is 41.2% higher than that of the single-layer EBL structure. In addition, the optimized structure reduces IQE at high current from 25% to 4%. The optimization method based on intelligent algorithm can break through the limitation of the current LED structure design and provide a new method to improve the efficiency of AlGaN-based DUV-LED.

The influences of AlGaN barrier epitaxy in multiple quantum wells on the optoelectrical properties of AlGaN-based deep ultra-violet light-emitting diodes.

The growth conditions of the AlGaN barrier in AlGaN/AlGaN deep ultra-violet (DUV) multiple quantum wells (MQWs) have crucial influences on the light output power of DUV light-emitting diodes (LEDs). The reduction of the AlGaN barrier growth rate improved the qualities of AlGaN/AlGaN MQWs, such as surface roughness and defects. The light output power enhancement could reach 83% when the AlGaN barrier growth rate was reduced from 900 nm h-1 to 200 nm h-1. In addition to the light output power enhancement, lowering the AlGaN barrier growth rate altered the far-field emission patterns of the DUV LEDs and increased the degree of polarization in the DUV LEDs. The enhanced transverse electric polarized emission indicates that the strain in AlGaN/AlGaN MQWs was modified by lowering the AlGaN barrier growth rate.

Sidewall geometric effect on the performance of AlGaN-based deep-ultraviolet light-emitting diodes.

In this study, deep-ultraviolet light-emitting diodes (DUV LEDs) with different chip sidewall geometries (CSGs) are investigated. The structure had two types of chip sidewall designs that combined DUV LEDs with the same p-GaN thickness. By comparing the differences of the characteristics such as the external quantum efficiency droops, light output power, light extraction efficiency (LEE), and junction temperature of these DUV LEDs, the self-heated effect and light-tracing simulation results have been clearly demonstrated to explain the inclined sidewalls that provide more possibility pathway for photons escape to increase the LEE of LEDs; thus, the DUV LEDs with the CSG presented improved performance. These results demonstrate the potential of CSG for DUV LED applications.

Radiative Recombination and Carrier Injection Efficiencies in 265 nm Deep Ultraviolet Light‐Emitting Diodes Grown on AlN/Sapphire Templates with Different Defect Densities

The electro‐optical characteristics of deep ultraviolet light‐emitting diodes (DUV LEDs) emitting at 265 nm and grown on AlN/sapphire templates with different threading dislocation densities, i.e., high‐temperature annealed (HTA) AlN, epitaxially laterally overgrown (ELO) AlN, and HTA‐ELO AlN are analyzed. The external quantum efficiency of each individual device is separated into maximum radiative recombination efficiency, carrier injection efficiency, and light extraction efficiency. This is achieved by combining an ABC‐model‐based fit of the current‐dependent external quantum efficiency together with calibrated Monte Carlo ray‐tracing simulations. A maximum radiative recombination efficiency between 50% and 60% is estimated for DUV LEDs grown on ELO and HTA‐ELO AlN/sapphire, whereas the values for devices grown on HTA AlN/sapphire are around 45%. The extracted radiative recombination efficiency does not scale with the measured threading dislocation density (TDD), even when accounting for the inhomogeneous TDD in the AlN base layers. This discrepancy is attributed to the formation of dislocation half‐loops introduced by additional compressive strain caused by the HTA process and may result in the formation of additional nonradiative recombination centers in the AlGaN multi‐quantum well region. In addition, the carrier injection efficiency values ranging from 45% to 55% are determined for devices grown on all three templates.

Simulation and theoretical study of AlGaN-based deep-ultraviolet light-emitting diodes with a stepped electron barrier layer

Owing to the COVID-19 outbreak, sterilization of deep-ultraviolet light-emitting diodes (DUV LEDs) has attracted increasing attention. Effectively improving the radiative recombination efficiency and mitigating the efficiency degradation, mainly caused by electron leakage and nonradiative recombination, have also emerged as two of the main issues to be addressed. In this study, a DUV LED epitaxial structure with a novel electron-blocking layer (EBL) is proposed. The DUV LED with a luminescence wavelength of ∼297 nm was formed by the stepwise variation of the Al component. Through the simulation and analysis of its performance parameters, we found that, compared to the conventional EBL structure, this new EBL structure not only reduces the electron leakage to the p-region effectively but also increases the hole injection into the active region, resulting in an increase in carrier concentration in the active region, a two-to-three-fold increase in the radiative recombination rate, and a 58% increase in the internal quantum efficiency, thus alleviating the efficiency droop and achieving a more efficient operation at high current densities.

Enhancement of the light output efficiency and thermal stability of AlGaN-based deep-ultraviolet light-emitting diodes with Ag-nanodot-based p-contacts and an 8-nm p-GaN cap layer.

The efficiency of AlGaN-based deep-ultraviolet light-emitting diodes (DUV LEDs) is limited by the high absorption issue of the p-GaN contact layer or poor contact properties of the transparent p-AlGaN contact layer. Enhancement of the light output efficiency and thermal stability of DUV LEDs with an emission wavelength of 272 nm was investigated in this work. Ag nanodots on an 8-nm p-GaN cap layer were used to form ohmic contact, and Al and Mg reflective mirrors were employed to enhance the light output power (LOP) of DUV LEDs. However, serious deterioration of LOP occurred after the high-temperature process for the LEDs with Al and Mg reflective mirrors, which can be attributed to the damage to the ohmic contact properties. A Ti barrier layer was inserted between the Ag/p-GaN and Al layers to prevent the degeneration of ohmic contact. The wall-plug efficiency (WPE) of DUV LEDs fabricated by the Ag-nanodot/Ti/Al electrode is 1.38 times that of LEDs fabricated by adopting a thick Ag layer/Ti/Al at 10 mA after a high-temperature process. The Ag-nanodot/Ti/Al electrode on thin p-GaN is a reliable technology to improve the WPE of DUV LEDs. The experimental and simulated results show that the ohmic contact is important for the hole-injection efficiency of the DUV LEDs when p-GaN is thin, and a slight increase in the contact barrier height will decrease the WPE drastically. The results highlighted the importance of thermally stable ohmic contacts to achieve high-efficiency DUV LEDs and demonstrated a feasible route for improving the LOP of DUV LEDs with a thin p-GaN cap layer and stable reflective electrodes.

Multi-step in situ interface modification method for emission enhancement in semipolar deep-ultraviolet light emitting diodes

Semipolar III-nitrides have attracted increasing attention in applications of optoelectronic devices due to the much reduced polarization field. A high-quality semipolar AlN template is the building block of semipolar AlGaN-based deep-ultraviolet light emitting diodes (DUV LEDs), and thus deserves special attention. In this work, a multi-step in situ interface modification technique is developed for the first time, to our knowledge, to achieve high-quality semipolar AlN templates. The stacking faults were efficiently blocked due to the modification of atomic configurations at the related interfaces. Coherently regrown AlGaN layers were obtained on the in situ treated AlN template, and stacking faults were eliminated in the post-grown AlGaN layers. The strains between AlGaN layers were relaxed through a dislocation glide in the basal plane and misfit dislocations at the heterointerfaces. In contrast, high-temperature ex situ annealing shows great improvement in defect annihilation, yet suffers from severe lattice distortion with strong compressive strain in the AlN template, which is unfavorable to the post-grown AlGaN layers. The strong enhancement of luminous intensity is achieved in in situ treated AlGaN DUV LEDs. The in situ interface modification technique proposed in this work is proven to be an efficient method for the preparation of high-quality semipolar AlN, showing great potential towards the realization of high-efficiency optoelectronic devices.

Enhanced quantum efficiency in flexible AlGaN deep-ultraviolet light-emitting diodes by external strain

Flexible electronic devices have great application potential in the field of next-generation consumer electronics. In this paper, we have demonstrated that applying external bending on AlGaN-based flexible deep-ultraviolet light-emitting diodes (DUV LEDs) can modulate the electrical characteristics of the quantum-well heterostructures. The internal quantum efficiency of DUV LEDs can be significantly improved by applying external strain on the device in bend-up mode. In addition, the peak emission of the DUV LEDs can be significantly tuned by bending the device into concave or convex curvatures. This desirable feature allows a single device to be applied in different environments and fields by applying external strain.

Balanced Resistivity in n-AlGaN Layer to Increase the Current Uniformity for AlGaN-Based DUV LEDs

In this work, by sandwiching a p-AlGaN layer into the n-AlGaN layer, we generate an energy barrier in the n-AlGaN layer to improve the current spreading effect of AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs). The abrupt energy barrier can balance the resistivity in the n-AlGaN layer, and this leads to the better lateral current distribution in the p-type hole injection layer. Numerical and experimental results show that the homogenized current distribution enables the enhanced external quantum efficiency (EQE) for the proposed DUV LED. In addition, the better conductivity modulation arising from the more homogenized current distribution decreases the forward voltage and suppresses the self-heating effect.

Alleviated built-in electric field in the active region of AlGaN deep-ultraviolet light-emitting diodes with locally embedded p-i-n junctions.

The strong polarization-induced electric field in the multi-quantum well region reduces the radiative recombination rates by separating the electron and hole wave functions, which is one of the most detrimental factors that is to blame for the low luminous efficiency of AlGaN deep-ultraviolet light-emitting diodes (DUV LEDs). In this work, we redesigned the active region by incorporating Si and Mg doping at the vicinity of the quantum wells, forming a series of embedded p-i-n junctions in the multi-quantum well region. The additional electric field induced by the fixed charges from the embedded doping-induced junctions can effectively compensate for the intrinsic polarization-induced electric fields in the quantum well region and give rise to the improved overlap of hole and electron wave function, hence enhancing the radiative recombination rates and the external quantum efficiency and optical power of DUV LEDs. The mechanism behind the alleviated polarization electric field is comprehensively discussed and analyzed. The embedded p-i-n junctions can also alter the band diagram structure of the active region, decrease the effective barrier heights for holes, and diminish the electron leakage into the p-type region. In addition, different thicknesses and doping concentrations of the embedded p- and n- layers were designed, and their influence on the performance of DUV LEDs was numerically analyzed. The proposed structure with embedded p-i-n junctions provides an alternative way to achieve efficient DUV LEDs.

Local dielectric tunnel junction to manage the current distribution for AlGaN-based deep-ultraviolet light-emitting diodes with a thin p-GaN layer.

In this report, a p+-GaN/SiO2/Ni tunnel junction with a local SiO2 insulation layer is designed to manage the current distribution for commercially structured AlGaN-based deep-ultraviolet light-emitting diodes (DUV LEDs) with a thin p-GaN layer. The experimental and calculated results prove that, besides the increased hole injection at the p+-GaN/SiO2/Ni tunnel junction, the local SiO2 layer produces an in-plane unbalanced energy band in the p-GaN layer for the proposed DUV LEDs, thus modulating the carrier transport paths and increasing the spread of holes. Enhanced optical power is obtained when compared to conventional DUV LEDs. In addition, the influence of the position of the SiO2 insulation layer on the current distribution is also investigated in this work. Placing the SiO2 insulation layer in the middle position of the p+-GaN layer is most helpful for increasing the hole injection efficiency for commercially structured DUV LEDs.

Enhanced Carrier Injection in AlGaN-Based Deep Ultraviolet Light-Emitting Diodes by Polarization Engineering at the LQB/p-EBL Interface

The external quantum efficiency (EQE) of AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs) is still far from satisfactory due to the main issues of electron leakage and insufficient hole injection. The positive sheet charges generated by polarization at the interface between the last quantum barrier (LQB) and the p-type electron blocking layer (p-EBL) can induce electron accumulation and hole depletion in the vicinity of this interface, leading to electron leakage and hindering the hole injection. In this paper, we propose an Al-composition-increasing AlGaN layer (ACI-AlGaN) inserted between the LQB and p-EBL to enhance the carrier injection ability of DUV LEDs via modulating the sheet charges generated by polarization at the LQB/EBL interface and the underlying mechanism was analyzed by numerical calculation. The inserted structure can eliminate the positive sheet charges at the p-side interface of LQB and induce hole accumulation in the vicinity of the n-side interface of p-EBL, which can subsequently reduce electron leakage and favor hole injection respectively. The proposed DUV LED structure with an ACI-AlGaN layer exhibited enhanced EQE by 45.7% and its forward voltage maintained undegraded. This design scheme can provide an alternative way to promote the performance of DUV LEDs with a variety of applications.

Polarization-doped quantum wells with graded Al-composition for highly efficient deep ultraviolet light-emitting diodes

The efficiency performance of AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs) suffers from the strong polarization effect in multiple quantum wells (MQWs). Here, we propose V-shaped QWs to improve the quantum efficiency of DUV LEDs. We numerically investigated the effect of QWs with graded Al-composition on the device performance of DUV LEDs. Simulation results show that the QWs with graded Al-composition can mitigate the detrimental factors of traditional QWs with flat Al-composition, such as tilted energy band and separation of carrier wave function. Furthermore, compared to the QWs with linearly decreased or increased Al-composition along the growth direction, the V-shaped QWs can simultaneously alleviate the slope of valance and conduction band and obtain the better carrier confinement ability. Therefore, the DUV LED with V-shaped QWs exhibits a better optical performance.

A vertical AlGaN DUV light-emitting diode fabricated by wafer bonding and sapphire thinning technology

We demonstrate a vertical AlGaN DUV LED with an emission wavelength of 272 nm and submicron thickness. The device epilayers’ thickness is reduced to ∼670 nm by a combination of wafer bonding and thinning techniques, and this results in the thinnest vertical DUV LED reported to date. A light-emitting surface with a root mean square value of 74.7 nm is also induced by the thinning process without any other surface-roughing treatments. An n-contact electrode with a mesh geometry is adopted to expose the emission region, while the bottom metal electrode functions as a reflector to reflect downward-propagating light in an upward direction.

Enhanced performance of an AlGaN-based deep ultraviolet light-emitting diode using a p+-GaN/SiO2/ITO tunnel junction.

In this work, a 280-nm-wavelength deep-ultraviolet light-emitting diode (DUV LED) with a p+-GaN/SiO2/ITO tunnel junction is fabricated and investigated. Due to the decreased tunnel region width and enhanced electric field intensity in the 1-nm-thick SiO2 layer, the interband tunneling efficiency and the corresponding hole injection efficiency are promoted. Therefore, the external quantum efficiency (EQE) for the proposed device is increased when compared with a traditional DUV LED. In addition, an improved current spreading effect is observed for our proposed device. As a result, improved wall-plug efficiency (WPE) is obtained owing to the increased optical power and decreased forward operating voltage. Meanwhile, the enhanced electric field intensity in the SiO2 layer reduces the voltage drop in the p-n junction region for the proposed device, and thus the leakage current is reduced.

Optimized carrier confinement in deep-ultraviolet light-emitting diodes with AlInGaN/AlInN superlattice electron blocking layer

The optoelectronic characteristics of AlGaN-based deep ultraviolet light-emitting diodes (DUV LEDs) with AlInGaN/AlInN superlattices electron blocking layer (EBL) are numerically investigated. The results show that DUV LED with AlInGaN/AlInN EBL has superior carrier confinement capability over the DUV LED with conventional AlGaN EBL. Hence, the internal quantum efficiency (IQE) and radiative recombination rate of the proposed LED is increased by 49% and 219%, respectively as compared to conventional LED. This is assigned to the optimal recombination of electron-hole pairs in the active zone of the proposed LED. Interestingly, the proposed LED also exhibits near-droop-free efficiency.

Performance enhancement of an N-polar nitride deep-ultraviolet light-emitting diode with compositionally graded p-AlGaN.

Highly efficient hole injection into a AlGaN quantum well is desirable in nitride deep-ultraviolet light-emitting diodes (DUV LEDs) for high optical performance. In this work, we report the observation of enhanced hole injection in the N-polar AlGaN-based DUV LEDs with compositionally graded p-AlxGa1-xN (x = 0.65-0.75) by simulation and show that the enhanced hole injection leads to the increase of the peak internal quantum efficiency (IQE) and the significant reduction of efficiency droop at high current density. This work might activate researchers to realize the efficient polarization p-type doping of N-polar AlGaN with high Al content and thus to achieve high performance DUV LEDs experimentally.

Enhanced Light Extraction of DUV LEDs by Using a Quartz Lens With Three-Dimensional Structure

AlGaN based deep ultraviolet light-emitting diodes (DUV LEDs) have wide applications in many fields, such as air and water purification, disinfection, and biochemical inspection. However, the wall plug efficiency (WPE) of DUV LEDs is relatively low for these applications, which is due to the low light extraction efficiency (LEE) yielding limited light output from LED package. In this work, we proposed a quartz lens with three-dimensional (3D) structure to enhance the light extraction of DUV LEDs. The optical models of DUV LEDs were established and the optical performances of DUV LEDs were investigated by using optical simulation. The DUV LEDs with the 3D quartz lens exhibit higher light efficiency than those with traditional quartz lens structure. Compared with the traditional structure, the light output power of the 3D lens structure is enhanced by 25.93% at the current of 140 mA and the packaged DUV LED can achieve a wide light angle of 153.2°. It is attributed to the significant light extraction enhancement of the sidewall emission from DUV LED chip.

On the impact of a metal-insulator-semiconductor structured n-electrode for AlGaN-based DUV LEDs.

In this work, a 280 nm AlGaN-based deep ultraviolet light-emitting diode (DUV LED) with a metal-insulator-semiconductor (MIS) structured n-electrode is fabricated and studied. The SiO2 insulator layer is adopted to form the MIS structure by using an atomic layer deposition system. After adopting the MIS-structured n-electrode, the SiO2 intermediate layer enables electron affinity for the contact metal to be higher than the conduction band of the n-AlGaN layer, which favors the electrons to be injected into the n-AlGaN layer by intraband tunneling rather than thermionic emission. Moreover, the thin SiO2 insulator can share the applied bias, which makes the n-AlGaN layer surface less depleted and thus further facilitates the electron injection. The improved electron injection capability at the metal-semiconductor interface helps reduce the contact resistance and increase electron concentration in the active region, which then improves external quantum efficiency and wall-plug efficiency for the proposed DUV LED.