Diamond Grinding Wheel Research Articles

Laser Brazing Diamond Grinding Wheel with Ni-Base Filler Alloy

Brazing diamond wheel was carried out via laser in an argon atmosphere. The interfacial microstructures among brazed diamond, the filler alloy and matrix were analyzed by scanning electron microscopy (SEM), energy dispersion spectrometer (EDS) and X- ray diffraction (XRD). The formation mechanism of carbide layers was also discussed. Finally, grinding examination of the grinding wheel was carried through. The results show that diamond can not fall off from the wheel even at heavy duty conditions.

Ordered diamond micro-arrays for ultra-precision grinding—An evaluation in Ti–6Al–4V

The surface topography of a conventional diamond grinding wheel can be characterised as having a perplexity of abrasive particles with random crystallographic orientations resulting in different heights of protrusion from the bond and inherent varying inter-particle spacing. The number and effectiveness of the abrasive particles during grinding depends on factors such as the abrasive concentration, the crystallographic shape and the extent of particle protrusion from the wheel’s surface. The consequence of this random layout inhibits the optimal performance of individual abrasives in the process of material removal, and where particles are clustered, chip flow is negatively affected. This paper reports on the evaluation of purpose designed precision diamond micro-arrays for the grinding a case-study material, Ti–6Al–4V and compares their performance against conventional diamond electroplated micro-cutting elements of D91 and D46 abrasive size in an imitated grinding setup. The precision diamond micro-arrays, produced from thick film CVD diamond utilising energy beam ablation offer an optimised layout of abrasive elements, each having a cutting width of 100 μm of identical crystallographic orientation, protrusion height and regular spacing to provide chip flow paths. In addition, the primary/secondary rake angles γ=−32°/+1° and clearance angle α=4.5° of each abrasive cutting element have been controlled in order to provide an enhanced cutting action. The precise layout of the abrasive cutting elements of the micro-arrays produced superior chip flow compared with the diamond electroplated grinding elements; this has been proven by in-depth scanning electron microscopy of the clogged workpiece material on the studied abrasive elements. The results show a 3.5 times improvement to surface finish and a 21.5 times improvement to flatness of the Ti–6Al–4V workpieces when ground with the proposed innovative diamond micro-arrays.

Morphology and distribution of subsurface damage in optical fused silica parts: Bound-abrasive grinding

The depth and morphology of subsurface damage (SSD) in fused silica samples ground with diamond grinding wheels were investigated. The factors possibly influencing the SSD depth of ground samples were examined. The results demonstrate that the SSD depth is most responsive to diamond grit size while the processing parameters (i.e. depth of cut, feed rate, and wheel peripheral speed) have marginal effects on the SSD depth. The SSD depth decreases with the abrasive/grit size of diamond wheels and slightly diminishes with the decrease of cutting depth but little influenced by feeding rate and wheel speed. The morphology inspection shows that the density of subsurface cracks in ground fused silica samples decays exponentially with the depth from the ground surface into the bulk and the cracks vanish at a certain depth that depends on the mechanical and physical properties of samples and diamond abrasives/grits.

Experimental study on fabrication and evaluation of micro pyramid-structured silicon surface using a V-tip of diamond grinding wheel

A mechanical fabrication of micro pyramid-structured silicon surface is proposed using crossed grooving with a 60° V-tip of diamond grinding wheel. It can obtain high form-accuracy, good surface quality and efficient productivity in contrast to laser machining and etching, and also assure a high aspect ratio in contrast to other mechanical processes. In order to describe its micro-structured topography, a white-light interferometer was employed, and its measured point cloud was matched using an Iterative Closest Point (ICP) algorithm. In micro grinding, a novel CNC mutual-wear truing was first developed to sharpen the wheel V-tip; then, the effects of microscopic wheel topography, silicon crystal-orientation and grinding parameter were investigated on ground micro-topography, truing ratio and material removal ratio; finally, its form-accuracy, pyramid top radius, groove tip radius, surface roughness and aspect ratio were evaluated. It is shown that better microscopic grain protrusion topography on wheel V-tip produces much larger material removal ratio and much better micro-structured topography in micro grinding, but it leads to much less truing ratio in finer GC truing. In micro grinding, silicon crystal-orientation has little effect on micro-structured topography due to diamond crystal-orientations that are randomly distributed on wheel V-tip. Although the micro pyramid-structured form error is only about 3.4 μm, its V-groove bottom and pyramidal top have very large form errors (23.1–47.9 μm) due to the sharpness of wheel V-tip and the frangibility of micro pyramid top. On increasing feed speed, its pyramid top radius decreases and its groove tip radius slightly increases, ultimately leading to an increase in aspect ratio, whereas its surface quality descends. It is concluded that the micro-pyramid arrays may be precisely patterned on silicon surface using a SD600 wheel with crossed tool paths, on-machine V-tip truing and the depth of cut in 1 μm.

Grinding characteristics, material removal and damage formation mechanisms in high removal rate grinding of silicon carbide

Development of advanced ceramics such as silicon carbide has gained significant importance because of their desirable properties. However, their engineering applications are still limited owing to the limitations in developing damage-free and economical machining techniques. It is often desired to increase the machining rate to improve productivity while maintaining the desired surface integrity. The success of this approach, however, requires a fundamental understanding of the material removal and damage formation mechanism in grinding. In this paper, high removal rate grinding of silicon carbide was investigated with respect to material removal and basic grinding parameters using a diamond grinding wheel. The results showed that the material removal was primarily due to the microfracture and grain dislodgement under the grinding conditioned selected. For grain dislodgement removal mode, the relationship for the removal rate in scratching based on a simple fracture mechanics analysis has been established. This research provides valuable insights into the surface and subsurface integrity and material removal mechanism during high removal rate grinding of silicon carbide.

Study on axial-feed mirror finish grinding of hard and brittle materials in relation to micron-scale grain protrusion parameters

An axial-feed mirror finish grinding of hard and brittle materials is proposed by controlling grain protrusion parameters. In this grinding, the grinding wheel feed is along the wheel axial direction rather than in the traditional wheel cutting direction. The objective is to understand how micron-scale grain protrusion parameters influence ductile-mode grinding and ultimately to realize efficient mirror finish grinding using a coarse diamond grinding wheel. In this study, the grain tip truncation (GT-truncation) was performed after dressing to improve grain protrusion topography. First, a formation model of axial-feed ground surface was constructed to analyze the effect of grain protrusion parameters and grinding parameters on the critical cutting depth transferred from brittle-mode removal to ductile-mode removal; then GC dressing and GT-truncation of #180 diamond grinding wheel were experimentally performed to investigate surface roughness and ductile-mode grinding behavior with reference to grinding parameters and grain protrusion parameters; finally, a truncated coarser #60 diamond grinding wheel was employed for mirror finish grinding to observe active grain number and grain protrusion angle. Theoretical analysis shows that this ductile-mode grinding is dominated by active grain number, active grain protrusion angle, wheel rotating speed and axial-feed speed, but it does not depend on the depth of cut assumed to be less than the grain protrusion height. Experimental results indicate that the GT-truncation may increase active grain number and grain protrusion angle for ductile-mode grinding when the axial-feed speed decreases to some extent. Moreover, the micro tip radius of diamond grain also influences the ground surface. It is confirmed that by increasing active grain number and grain protrusion angle synchronously, a truncated #60 diamond grinding wheel can be applied for efficient mirror finish grinding of the SiC ceramic plate at the axial-feed speed of 50 mm/min and the tool path interval of 0.1 mm.

The Three-Dimensional Surface Topographic Characterisation of Diamond Grinding Wheels

Surface measurement using three-dimensional stylus instruments is a relatively new technique that offers numerous advantages over more traditional profilometry methods. The information generated is, unlike profile measurement, less subjective and more statistical providing additional insight into the surface structure. One application of surface measurement that has encountered problems when using the profilometry method is that of grinding wheel characterisation. The wheel surface texture (topography) and the conditions under which it is generated have a profound effect upon the grinding performance as characterised by the grinding forces, power consumption, temperature, and surface integrity of components. A detailed knowledge of the nature of the topography of the grinding wheel would provide further insight into surface interactions between the wheel and workpiece as well as enabling improved control of the grinding process in general. In this paper four diamond grinding wheels of 91 and 181 micron grit size were subjected to differing dressing conditions to produce varying final wheel topographies. Three-dimensional surface measurement techniques were employed to quantitatively characterise the topographic change and provide an aerial estimation of the number of cutting grains. The results demonstrate that the techniques can distinguish between a worn and dressed wheel. In addition, the parametric values generated from the various surfaces can aid the user in determining when re-dressing is required.

Grindability of Micro Pyramid-Structured Surface for Various Hard and Brittle Materials

A novel grinding approach of micro pyramid-structured surface is proposed by using a 60º V-tip of #600 diamond grinding wheel in CNC system. The research objective is to understand the micro grindability of various hard and brittle materials including quartz glass, silicon, SiC ceramics and WC alloy. First, a CNC mutual-wear truing approach was developed to sharpen the wheel V-tip; then, the wheel V-tip was employed to pattern the micro pyramidal array on workpiece surface along CNC tool paths; finally, the machined micro-structured surface and its form accuracy and aspect ratio were investigated. It is shown that this CNC mutual-wear truing approach can not only produce a V-shaped diamond grinding wheel, but also sharpen the diamond grain edges on the wheel V-tip. This wheel V-tip may be used to machine the micron-scale pyramid arrays on silicon, SiC ceramics and WC alloy surfaces with CNC level reticulated cross tool paths, the depth of cut of 1 m and on-machine V-tip form-truing process. Although the average form error of machined micro-structured surface is very small, its pyramidal tops and groove bottoms appear very large form errors, which are dominated by the wheel V-tip sharpness and the grinding conditions, respectively. This leads to a decrease in the aspect ratio by about 38%, 30% and 14% in contrast to the ideal one of 0.87 for silicon, SiC ceramics and WC alloy, respectively.

Nozzle-Type ELID Grinding Characteristics of Cemented Carbides

This paper reports a systematic investigation of a nozzle-type ELID grinding characteristics of cemented carbides. Two groups of experimental scheme were carried on by using fine grain cast iron diamond wheel and nozzle-type ELID grinding apparatus. The grinding forces were measured by a dynamometer and the ground surfaces were characterized using scanning electron microscopy (SEM) and atomic force microscope (AFM). The influences of electrolytic and grinding parameters on grinding force were discussed. The material removal mode and micro-morphology characteristics were also analyzed.

High-Efficiency and Ultraprecision Grinding of Soft-Brittle CdZnTe Crystals

Ultraprecision grinding by a #6000 diamond grinding wheel on soft-brittle Cd0.96Zn0.04Te (111) crystals was conducted, and ultrasmooth machined surface was achieved. The ground surface of Cd0.96Zn0.04Te (111) was compared with that of lapping and chemical mechanical polishing (CMP). The experimental results show that the surface roughness, Ra, and machining duration by ultraprecision grinding and CMP are 4.985 nm, 1.478 nm, and 35 min, 135 min, respectively, thus ultraprecision grinding exhibits high-efficiency and ultraprecision characters. The ground surface is smooth, uniform, microcrack and imbedding-free, while the machined surface by CMP appears free abrasive imbedding at local micro-area, leading to the decrease of surface integrity.

A new two-dimensional ultrasonic assisted grinding (2D-UAG) method and its fundamental performance in monocrystal silicon machining

A new two-dimensional (i.e., elliptical) ultrasonic assisted grinding (UAG) technique is proposed to achieve high material removal rate and high surface quality in the machining of hard and brittle materials such as monocrystal silicon. In this method, the workpiece attached on an elliptical ultrasonic vibrator is ground with a resin bond diamond grinding wheel under the presence of elliptical ultrasonic vibration. The elliptical ultrasonic vibrator is produced by bonding a piezoelectric ceramic device (PZT) on a metal elastic body (stainless steel, SUS304) and its detailed structure/dimensions are determined by FEM (finite element method) analysis. When two alternating current voltages with a phase difference are applied to the PZT at the same frequency that is close to the resonant frequency of the longitudinal mode and bending mode of vibrator, two ultrasonic vibrations are generated simultaneously, and the synthesis of the vibrations results in an elliptical motion on the end face of the vibrator. If the phase difference is set at 0° or 180°, two kinds of one-dimensional ultrasonic vibrations, i.e., axial or vertical vibrations, can be obtained. Grinding experiments are carried out involving monocrystal silicon to confirm the performance of the proposed elliptical UAG. In addition, grinding experiments under the presence of the axial and vertical ultrasonic vibrations and the absence of ultrasonic vibrations, i.e., conventional grinding, are also carried out for comparison. The obtained results show that: (1) compared with conventional grinding, the axial ultrasonic vibration results in greatest improvement in the work surface quality and a slight reduction in the grinding forces; (2) under the vertical ultrasonic vibration, the grinding forces are decreased significantly but the surface roughness is increased slightly; (3) elliptical ultrasonic vibration leads to the significant reduction of both the surface roughness and grinding forces. These indicate that the high efficiency and high-quality grinding of monocrystal silicon can be performed with the proposed two-dimensional ultrasonic assisted grinding technique.

Surface/Subsurface Damage of Yttria Partially Stabilized Zirconia in Grinding Using Monolayer Brazed Diamond Wheel

A new brazed monolayer diamond grinding wheel is developed with the same continuous cutting edge distance on the wheel surface. Surface/subsurface damage of yttria partially stabilized zirconia (Y-PSZ) in grinding using monolayer brazed diamond wheel is analyzed. In this investigation, the influence of the maximum undeformed chip thickness (hm) on material removal mechanism is analyzed. The experiment results show that the ground surface is almost in ductile material removal mode when hm is below the critical value for Y-PSZ, otherwise it will be the combined removal modes of brittle and ductile when hm is above the critical value.

Wear of a brazed diamond grinding wheel with diamonds precovered by brazing alloy

The wear of a brazed diamond wheel with diamond grits precovered by brazing alloy was investigated in comparison with a traditional brazed wheel whose grits were without coverings. The two wheels were brazed in vacuum. The wear of the two wheels was tested through grinding of granite, during which grinding forces were measured and the wear states of diamond grits were observed. It is shown that the brazed diamonds precovered with brazing alloy exhibited stronger self-sharpening ability and rupture resistance. Subsequently, the wheel with precovered diamonds performed lower grinding force and better wear performance.

Wire electro discharge trueing and dressing of fine grinding wheels

In this paper fundamental investigations are presented regarding the capabilities of Wire-EDM for trueing and dressing of fine grained metal bonded diamond grinding wheels. These wheels are often used for precision grinding operations of hard and brittle mould materials like ceramics or cemented carbides. They are characterised by high profile constancies and wear resistances. Due to the electrical conductivity of the bond material, Wire-EDM offers an efficient and powerful alternative to conventional trueing and dressing. Achievable grit protrusion and possible thermal damage to smallest diamond grits are theoretically and experimentally examined. Additionally, machining strategies for high profile accuracy are presented.

Precision cryogenic drilling, turning and grinding of Ti-64 alloys

Ti-6Al-4V alloys are difficult to machine because of their low thermal conductivity and high strength and as a result high wear rates occur with low tool life. Two renowned researchers Chattopadhyay in India and Hong in the USA have reported substantial improvement in tool life during cryogenic turning of Ti-6Al-4V alloys as compared to turning under wet and dry conditions. However, the only work reported on cryogenic grinding is by Chattopadhyay et al. and they indicated that cryogenic CBN bonded grinding performed poorly when compared to wet grinding. The work done by the authors using the novel bondless diamond grinding wheel with cryogenic liquid nitrogen and oil mist showed improvement in surface finish, flatness, and lowering of forces. The only reported work on cryogenic drilling is by Bhattacharyya et al. in New Zealand and the work material was Kevlar composites that machined better when compared to wet grinding. Pin on disc test indicated different wear modes occurring in a cryogenic environment.

Wear characteristics and grinding performance of vitrified diamond grinding wheels

Wear characteristics and grinding performance of vitrified diamond grinding wheels

Precision Grinding of Reaction Bonded Silicon Carbide Using Coarse Grain Size Diamond Wheels

Reaction bonded SiC(RBSiC) is attractive for optical application because of its favorable properties and low fabrication cost. However, the difficultness and cost involved in RBSiC grinding limit its application. The investigation on high efficient and low-cost machining with good grinding quality is desired. Generally, high efficient machining for RBSiC is realized by using coarse grain size grinding wheels, but serious grinding damage is inevitable. In this paper, monolayer nickel electroplated coarse grain size diamond grinding wheels with grain sizes of 46 μm, 91 μm, and 151 μm were applied to the grinding of RBSiC. An electrolytic in-process dressing(ELID) assisted conditioning technique was first developed by using cup shape copper bonded conditioning wheels with grain sizes of 15 μm and 91 μm to generate the conditioned coarse grain size wheels with minimized wheel run-out error within 2 μm, constant wheel peripheral envelop as well as top-flattened diamond grains. Then, the grinding experiments on RBSiC were carried out to investigate the grinding performance and material removal mechanism. The experimental results indicate that the developed conditioning technique is applicable and feasible to condition the coarse grain size diamond wheels under optimal conditioning parameters, and the material removal mechanism involved in RBSiC grinding is the combination of brittle fracture and ductile deformation to generate smooth ground surface. This research is significant for the high efficient and low-cost precision grinding of RBSiC with good ground surface quality.

Numerical Simulation of Hydrodynamic Fluid Pressure in Grinding Zone with Resin-Bonded Diamond Grinding Wheel

In the grinding process, grinding fluid is delivered for the purposes of chip flushing, cooling, lubrication and chemical protection of work surface. Lubrication and cooling are the most important roles provided by a grinding fluid. Hence, the conventional method of flood delivering coolant fluid by a nozzle in order to achieve high process performance purposivelly. However, hydrodynamic fluid pressure can be generated ahead of the grinding zone due to the wedge effect between wheel peripheral surface and part surface. In the paper, a theoretical hydrodynamic pressure modeling is presented for flow of coolant fluid through the grinding zone in flood delivery mode in the surface grinding using resin-bonded diamond grinding wheel, which based on Navier-Stokes equation and continuous formulae. The numerical simulation results showed that the hydrodynamic pressure was proportion to grinding wheel velocity, and inverse proportion to the minimum gap between wheel and workpiece and the maximum pressure was generated just in the minimum clearance region in which higher fluid pressure gradient occur. It can also be concluded the pressure distribution was uniform in the direction of width of wheel except at the edge of wheel because of the side-leakage.

Special wire guide for on-machine wire electrical discharge dressing of metal bonded grinding wheels

To improve accuracy in wire electrical discharge dressing (WEDD), special attention should be given to wire vibration. In this work, the use of a specially designed wire guide is proposed, which is responsible for both ensuring the stability of the wire and improving the efficiency of dielectric delivery to the dressing zone. For carrying out experiments with metal bonded diamond grinding wheels, a WEDD-device was designed, manufactured and integrated into a grinding machine. High erosion material removal rates and dressing accuracy were achieved, thus demonstrating the feasibility and efficient performance of this in situ dressing process.

Experiment and numerical simulation study on laser truing and dressing of bronze-bonded diamond wheel

Abstract An acoustic-optic Q-switched YAG laser is newly developed for truing and dressing of bronze-bonded diamond grinding wheels through ablation in the radial direction. The laser ablation merges truing and dressing as a single process and can be easily controlled through an online closed-loop control system. The laser truing and dressing characteristics are investigated by wheel surface topography and a high-speed grinding test. A two-dimensional mathematical model is developed to simulate laser truing and dressing of bronze-bonded diamond grinding wheel. Based on the model, the ablation depth produced on bond and diamond abrasives by a pulsed laser under different parameters as well as the temperature field on grinding wheel surface produced in the laser ablation process are numerically simulated. Both the experimental results and the theoretical analysis indicate that the truing and dressing processes can be simultaneously realized with the laser ablation.