Abstract

Ultraprecision grinding by a #6000 diamond grinding wheel on soft-brittle Cd0.96Zn0.04Te (111) crystals was conducted, and ultrasmooth machined surface was achieved. The ground surface of Cd0.96Zn0.04Te (111) was compared with that of lapping and chemical mechanical polishing (CMP). The experimental results show that the surface roughness, Ra, and machining duration by ultraprecision grinding and CMP are 4.985 nm, 1.478 nm, and 35 min, 135 min, respectively, thus ultraprecision grinding exhibits high-efficiency and ultraprecision characters. The ground surface is smooth, uniform, microcrack and imbedding-free, while the machined surface by CMP appears free abrasive imbedding at local micro-area, leading to the decrease of surface integrity.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call