High power and low noise sources are essential for the successful development of transmitter and receiver sub-systems respectively for applications in microwave and millimetre wave frequency ranges. About two decades earlier, Impatts and Baritts were considered to be most promising semiconductor devices for such applications. Keeping in view the emerging trends and inherent capabilities of these two families of devices, a systematic effort of developing device design, fabrication technology and characterization techniques was initiated at Central Electronics Engineering Research Institute (CEERI), Pilani. Under this program, packaged devices with reasonable power output and noise characteristics were developed, characterized and delivered to users for field trials. Due to scarcity of commercial vendors to supply the suitable packages for these devices, a parallel effort was made to develop coaxial type package technology to cover a frequency range of 10–100 GHz in different configurations to meet the typical circuit requirements. A number of unit processes, developed in this connection, have also been used in other areas of applications besides those in semiconductor device fabrication. A brief review of the entire effort, made in this context, is presented here in this paper as an example of the indigenous high-tech product development for strategic applications.