Deep Level Optical Spectroscopy Research Articles

Advanced Defect Spectroscopy in Wide Bandgap Semicondutors: Review and Recent Results

Abstract The study of deep level defects in semiconductors has always played a strategic role for the development of electronic and optoelectronic devices. In fact, deep levels have a strong impact on many of the device properties, including the efficiency, stability, and reliability because they can drive several physical process. Despite the advancements in crystal growth, wide and ultrawide bandgap semiconductors (such as gallium nitride and gallium oxide) are still strongly affected by the formation of defects that in general can act as carrier traps or generation-recombination centers. Conventional techniques used for deep level analysis in silicon need to be adapted for identifying and characterizing defects in wide bandap materials. This topical review paper presents an overview of reviews the theory of deep levels in semiconductor; in addition, we present a review and original results and on the application, limits and perspectives of two widely adopted most common deep -levels detection techniques, namely capacitance deep level transient spectroscopy and deep level optical spectroscopy, with specific focus on wide bandgap semiconductors. Finally, the most common traps of GaN and β-Ga2O3 are reviewed.

Identification and characterization of deep nitrogen acceptors in β-Ga2O3 using defect spectroscopies

The ability to achieve highly resistive beta-phase gallium oxide (β-Ga2O3) layers and substrates is critical for β-Ga2O3 high voltage and RF devices. To date, the most common approach involves doping with iron (Fe), which generates a moderately deep acceptor-like defect state located at EC-0.8 eV in the β-Ga2O3 bandgap. Recently, there has been growing interest in alternative acceptors, such as magnesium (Mg) and nitrogen (N), due to their predicted deeper energy levels, which could avoid inadvertent charge modulation during device operation. In this work, a systematic study that makes direct correlations between the introduction of N using ion implantation and the observation of a newly observed deep level at EC-2.9 eV detected by deep-level optical spectroscopy (DLOS) is presented. The concentration of this state displayed a monotonic dependence with N concentration over a range of implant conditions, as confirmed by secondary ion mass spectrometry (SIMS). With a near 1:1 match in absolute N and EC-2.9 eV trap concentrations from SIMS and DLOS, respectively, which also matched the measured removal of free electrons from capacitance-voltage studies, this indicates that N contributes a very efficiently incorporated compensating defect. Density functional theory calculations confirm the assignment of this state to be an N (0/−1) acceptor with a configuration of N occupying the oxygen site III [NO(III)]. The near ideal efficiency for this state to compensate free electrons and its location toward the midgap region of the β-Ga2O3 bandgap demonstrates the potential of N doping as a promising approach for producing semi-insulating β-Ga2O3.

Influence of trap-assisted and intrinsic Auger–Meitner recombination on efficiency droop in green InGaN/GaN LEDs

We study the impact of deep-level defects on trap-assisted Auger–Meitner recombination in c-plane InGaN/GaN LEDs using a small-signal electroluminescence (SSEL) method and deep-level optical spectroscopy (DLOS). Carrier dynamics information, including carrier lifetime, recombination rate, and carrier density, is obtained from SSEL, while DLOS is used to obtain the deep-level defect density. Through fitting the nonradiative recombination rates of wafers with different deep-level defect densities, we obtain the Shockley–Read–Hall (SRH) and trap-assisted Auger–Meitner recombination (TAAR) coefficients. We show that defect-related nonradiative recombination, including both SRH and TAAR, accounts for a relatively small fraction of the total nonradiative recombination, which is dominated by intrinsic Auger–Meitner recombination. The interplay between carrier localization and Coulomb enhancement has a different impact on radiative and intrinsic Auger–Meitner recombination. Evidence is presented that the imbalance between the change of radiative and intrinsic Auger–Meitner recombination is the primary cause of the efficiency droop at high carrier densities in the samples studied.

Trap characterization of high-growth-rate laser-assisted MOCVD GaN

A detailed study comparing defect incorporation between laser-assisted metal-organic chemical vapor deposition (MOCVD)-grown GaN and conventional low- and high-growth-rate MOCVD GaN was conducted. Using deep-level transient and optical spectroscopy, traps throughout the bandgap were characterized where traps were found at EC-0.25 eV, EC-0.57 eV, EC-0.72 eV, EC-0.9 eV, EC-1.35 eV, EC-2.6 eV, and EC-3.28 eV in all three samples. This indicates no new traps were observed in the laser-assisted MOCVD GaN sample. Overall, the trap concentrations in the laser-assisted MOCVD sample were ∼2× higher than the optimal low-growth-rate sample, but this is primarily due to the increase in gallium vacancy EC-2.6 eV and carbon-related EC-3.28 eV trap concentrations. The EC-0.9 eV trap concentration was ∼2× higher in the laser-assisted sample, so proton irradiation experiments were conducted to identify the physical source of this level. The results indicated this was a native point defect likely related to gallium interstitials. Overall, this study shows that the laser-assisted MOCVD growth method is promising for future thick, high-quality GaN epilayers after further growth optimizations.

Modeling the electrical degradation of AlGaN-based UV-C LEDs by combined deep-level optical spectroscopy and TCAD simulations

The long-term stability of ultraviolet (UV)-C light-emitting diodes (LEDs) is of major importance for many applications. To improve the understanding in this field, we analyzed the degradation of AlGaN-based UVC LEDs and modeled the variation of electrical characteristics by 2D simulations based on the results of deep-level optical spectroscopy (DLOS). The increase in the forward leakage current observed during ageing was ascribed an increase in trap-assisted tunneling. The analysis of the degradation kinetics suggests the role of a defect diffusion process, possibly involving impurities coming from the p-type layers.

Proton radiation effects on electronic defect states in MOCVD-grown (010) β-Ga2O3

The impact of 1.8 MeV proton irradiation on metalorganic chemical vapor deposition grown (010) β-Ga2O3 Schottky diodes is presented. It is found that after a 10.8×1013cm−2 proton fluence the Schottky barrier height of (1.40±0.05 eV) and the ideality factor of (1.05±0.05) are unaffected. Capacitance–voltage extracted net ionized doping curves indicate a carrier removal rate of 268±10cm−1. The defect states responsible for the observed carrier removal are studied through a combination of deep level transient and optical spectroscopies (DLTS/DLOS) as well as lighted capacitance–voltage (LCV) measurements. The dominating effect on the defect spectrum is due to the EC-2.0 eV defect state observed in DLOS and LCV. This state accounts for ∼75% of the total trap introduction rate and is the primary source of carrier removal from proton irradiation. Of the DLTS detected states, the EC-0.72 eV state dominated but had a comparably smaller contribution to the trap introduction. These two traps have previously been correlated with acceptor-like gallium vacancy-related defects. Several other trap states at EC-0.36, EC-0.63, and EC-1.09 eV were newly detected after proton irradiation, and two pre-existing states at EC-1.2 and EC-4.4 eV showed a slight increase in concentration after irradiation, together accounting for the remainder of trap introduction. However, a pre-existing trap at EC-0.40 eV was found to be insensitive to proton irradiation and, therefore, is likely of extrinsic origin. The comprehensive defect characterization of 1.8 MeV proton irradiation damage can aid the modeling and design for a range of radiation tolerant devices.

Studying the effect of space radiation induced defects in multijunction solar cell using APSYS simulation software and comparison with the experimental data

In this paper, the state-of-the-art triple junction solar cell with three sub cells and two tunnel diodes is modeled using two dimensional (2D) APSYS finite element analysis software tool. The effect of electron radiation at 1 MeV and 10 MeV energies for different fluences are investigated by introducing different trap levels, trap states and trap concentrations in InGaP top and InGaAs middle sub cells. Two different structures are modeled by varying layer thickness of base and emitter of both top and middle sub cells to understand its effect on the electrical parameters and efficiency of the solar cell. The main indicative parameters - trap concentration and carrier lifetime is affected by the radiation resulting in alteration of electrical performance of solar cells. The radiation induced defects cause permanent damage to the solar cell structure and degrades the electrical performance of solar cells until its end of life (EOL). In this work, APSYS software tool is used to model radiation induced traps with different trap concentrations, generated the electrical parameters and compared with the experimental results. The results obtained from simulation are in good agreement with the experimental data. Probable traps, trap concentrations and carrier lifetime for different electron radiation energies and fluences were extracted by simulation, which can prove to be difficult to perform experimentally as only a few methods like deep level trap spectroscopy and deep level optical spectroscopy exist for deep level trap studies. This study can therefore save valuable R&D time and cost..

Deep level defects in low-pressure chemical vapor deposition grown (010) β-Ga2O3

This study provides the full-bandgap evaluation of defect state distributions in beta phase gallium oxide (β-Ga2O3) grown by low-pressure chemical vapor deposition (LPCVD) on (010) β-Ga2O3 substrates at high growth of up to 20 µm/h. Deep-level optical spectroscopy and deep-level transient spectroscopy measurements applied to Ni/β-Ga2O3 Schottky diodes revealed the presence of a previously unreported defect state at EC-3.6 eV, which dominated the overall trap distribution in LPCVD grown material. However, states at EC-0.8 eV, EC-2.0 eV, and EC-4.4. eV were also detected, similar to prior studies on β-Ga2O3 grown by other methods, with similar or lower concentrations for the LPCVD samples. The EC-0.8 eV and EC-2.0 eV states were previously connected to residual Fe impurities and gallium vacancies, respectively. The total concentration of traps in the LPCVD material was on par with or lower than the state-of-the-art metal–organic chemical vapor deposition-grown materials despite the much higher growth rate, and the distribution of states showed negligible dependence on SiCl4 flow rate and doping concentration. These results demonstrate that the high growth rate of LPCVD-grown β-Ga2O3 is very promising for achieving thick, low defect density, and high-quality layers needed for multi-kV device applications.

Defect suppression in wet-treated etched-and-regrown nonpolar m-plane GaN vertical Schottky diodes: A deep-level optical spectroscopy analysis

Steady-state photocapacitance (SSPC) was conducted on nonpolar m-plane GaN n-type Schottky diodes to evaluate the defects induced by inductively coupled plasma (ICP) dry etching in etched-and-regrown unipolar structures. An ∼10× increase in the near-midgap Ec – 1.9 eV level compared to an as-grown material was observed. Defect levels associated with regrowth without an etch were also investigated. The defects in the regrown structure (without an etch) are highly spatially localized to the regrowth interface. Subsequently, by depth profiling an etched-and-regrown sample, we show that the intensities of the defect-related SSPC features associated with dry etching depend strongly on the depth away from the regrowth interface, which is also reported previously [Nedy et al., Semicond. Sci. Technol. 30, 085019 (2015); Fang et al., Jpn. J. Appl. Phys. 42, 4207–4212 (2003); and Cao et al., IEEE Trans. Electron Devices 47, 1320–1324 (2000)]. A photoelectrochemical etching (PEC) method and a wet AZ400K treatment are also introduced to reduce the etch-induced deep levels. A significant reduction in the density of deep levels is observed in the sample that was treated with PEC etching after dry etching and prior to regrowth. An ∼2× reduction in the density of Ec – 1.9 eV level compared to a reference etched-and-regrown structure was observed upon the application of PEC etching treatment prior to the regrowth. The PEC etching method is promising for reducing defects in selective-area doping for vertical power switching structures with complex geometries [Meyers et al., J. Electron. Mater. 49, 3481–3489 (2020)].

Influence of growth temperature on defect states throughout the bandgap of MOCVD-grown β -Ga2O3

The influence of growth temperature on the distribution (concentrations and energy levels) of individual defect states in metal organic chemical vapor deposition-grown, Si-doped β-Ga2O3 is investigated. A combination of deep level thermal transient/optical spectroscopies and admittance spectroscopy (AS) was used to quantitatively monitor the evolution of trap states throughout the ∼4.8 eV bandgap. States are observed at EC-0.12 eV by AS; at EC-0.4 eV by deep level transient spectroscopy; and at EC-1.2 eV, EC-2.0 eV, and EC-4.4 eV by deep level optical spectroscopy, and showed different dependencies on growth temperatures ranging from 800 °C to 920 °C. The EC-0.4 eV and EC-4.4 eV states both displayed a strong reduction in its concentration with increasing growth temperature, whereas no consistent trends were seen for the states at EC-1.2 eV and 2.0 eV over the temperature range studied. In contrast, the concentration of the EC-0.12 eV trap monotonically increased over the same range of increasing growth temperature, which tracked a slight, monotonic increase in overall Si concentration measured by secondary ion mass spectroscopy with growth temperature. The opposing trends in concentrations for some of these states shifted the dominant deep level in the bandgap from the EC-4.4 eV state at the lowest growth temperature explored here to the EC-0.12 eV state at the highest growth temperature. The shifting dominance of various bandgap states can have important ramifications on β-Ga2O3 device behavior, and the different trends for these deep levels cannot only guide further growth optimization but also advance the identification of their physical sources.

Defect incorporation in In-containing layers and quantum wells: experimental analysis via deep level profiling and optical spectroscopy

Recent studies demonstrated that the performance of InGaN/GaN quantum well (QW) light emitting diodes (LEDs) can be significantly improved through the insertion of an InGaN underlayer (UL). The current working hypothesis is that the presence of the UL reduces the density of non-radiative recombination centers (NRCs) in the QW itself: during the growth of the UL, surface defects are effectively buried in the UL, without propagating towards the QW region. Despite the importance of this hypothesis, the concentration profile of defects in the quantum wells of LEDs with and without the UL was never investigated in detail. This paper uses combined capacitance-voltage and steady-state photocapacitance measurements to experimentally identify the defects acting as NRCs and to extract a depth-profile of the traps, thus proving the incorporation upon indium-reaction. Specifically: (i) we demonstrate that LEDs without UL have a high density (9.2 × 1015 cm−3) of defects, compared to samples with UL (0.8 × 1015 cm−3); (ii) defects are located near midgap (E C-1.8 eV, corresponding to E i-E T ∼ 0.3 eV), thus acting as efficient NRCs; (iii) crucially, the density of defects has a peak within the QWs, indicating that traps are segregated at the first grown InGaN layers; (iv) we propose a model to calculate trap distribution in the QW, and we demonstrate a good correspondence with experimental data. These results provide unambiguous demonstration of the role of UL in limiting the propagation of defects towards the QWs, and the first experimental characterization of the properties of the related traps.

Probing the trap states in N-i-P Sb2(S,Se)3 solar cells by deep-level transient spectroscopy.

In this study, we provide fundamental understanding on defect properties of the Sb2(S,Se)3 absorber film and the impact on transmission of photo-excited carriers in N-i-P architecture solar cells by both deep level transient spectroscopy (DLTS) and optical deep level transient spectroscopy (ODLTS) characterizations. Through conductance-voltage and temperature-dependent current-voltage characterization under a dark condition, we find that the Sb2(S,Se)3 solar cell demonstrates good rectification and high temperature tolerance. The DLTS results indicates that there are two types of deep level hole traps H1 and H2 with active energy of 0.52 eV and 0.76 eV in the Sb2(S,Se)3 film, and this defect property is further verified by ODLTS. The two traps hinder the transmission of minority carrier (hole) and pinning the Fermi level, which plays a negative role in the improvement of open-circuit voltage for Sb2(S,Se)3 solar cells. This research suggests a critical direction toward the efficiency improvement of Sb2(S,Se)3 solar cells.

Defect-mediated metastability and carrier lifetimes in polycrystalline (Ag,Cu)(In,Ga)Se2 absorber materials

Using a combination of optical and electrical measurements, we develop a model for metastable defects in Ag-alloyed Cu(In,Ga)Se2, one of the leading thin film photovoltaic materials. By controlling the pre-selenization conditions of the back contact prior to the growth of polycrystalline (Ag,Cu)(In,Ga)Se2 absorbers and subsequently exposing them to various stresses (light soaking and dark-heat), we explore the nature and role of metastable defects on the electro-optical and photovoltaic performance of high-efficiency solar cell materials and devices. Positron annihilation spectroscopy indicates that dark-heat exposure results in an increase in the concentration of the selenium–copper divacancy complex (VSe–VCu), attributed to depassivation of donor defects. Deep-level optical spectroscopy finds a corresponding increase of a defect at Ev + 0.98 eV, and deep-level transient spectroscopy suggests that this increase is accompanied by a decrease in the concentration of mid-bandgap recombination centers. Time-resolved photoluminescence excitation spectroscopy data are consistent with the presence of the VSe–VCu divacancy complex, which may act as a shallow trap for the minority carriers. Light-soaking experiments are consistent with the VSe–VCu optical cycle proposed by Lany and Zunger, resulting in the conversion of shallow traps into recombination states that limit the effective minority carrier recombination time (and the associated carrier diffusion length) and an increase in the doping density that limits carrier extraction in photovoltaic devices.

Full bandgap defect state characterization of β-Ga2O3 grown by metal organic chemical vapor deposition

The results of a detailed investigation of electrically active defects in metal-organic chemical vapor deposition (MOCVD)-grown β-Ga2O3 (010) epitaxial layers are described. A combination of deep level optical spectroscopy (DLOS), deep level transient (thermal) spectroscopy (DLTS), and admittance spectroscopy (AS) is used to quantitatively map the energy levels, cross sections, and concentrations of traps across the entire ∼4.8 eV bandgap. States are observed at EC-0.12 eV by AS; at EC-0.4 eV by DLTS; and at EC-1.2 eV, EC-2.0 eV, and EC-4.4 eV by DLOS. While each of these states have been reported for β-Ga2O3 grown by molecular-beam epitaxy (MBE) and edge-defined film fed grown (EFG), with the exception of the EC-0.4 eV trap, there is both a significantly different distribution in the concentration of these states and an overall ∼10× reduction in the total trap concentration. This reduction is consistent with the high mobility and low background compensating acceptor concentrations that have been reported for MOCVD-grown (010) β-Ga2O3. Here, it is observed that the EC-0.12 eV state dominates the overall trap concentration, in marked contrast with prior studies of EFG and MBE material where the state at EC-4.4 eV has dominated the trap spectrum. This sheds light on possible physical sources for this ubiquitous DLOS feature in β-Ga2O3. The substantial reduction in trap concentration for MOCVD material implies great promise for future high performance MOCVD-grown β-Ga2O3 devices.

Unusual Formation of Point-Defect Complexes in the Ultrawide-Band-Gap Semiconductor β−Ga2O3

Understanding the unique properties of ultra-wide band gap semiconductors requires detailed information about the exact nature of point defects and their role in determining the properties. Here, we report the first direct microscopic observation of an unusual formation of point defect complexes within the atomic scale structure of beta-Ga2O3 using high resolution scanning transmission electron microscopy (STEM). Each complex involves one cation interstitial atom paired with two cation vacancies. These divacancy - interstitial complexes correlate directly with structures obtained by density functional theory, which predicts them to be compensating acceptors in beta-Ga2O3. This prediction is confirmed by a comparison between STEM data and deep level optical spectroscopy results, which reveals that these complexes correspond to a deep trap within the band gap, and that the development of the complexes is facilitated by Sn doping through the increase in vacancy concentration. These findings provide new insight on this emerging material's unique response to the incorporation of impurities that can critically influence their properties.

Breakdown Walkout in Polarization-Doped Vertical GaN Diodes

We demonstrate the avalanche capability and the existence of breakdown walkout in GaN-on-GaN vertical devices with polarization doping. By means of combined electrical and optical characterization, we demonstrate the following original results: 1) vertical p-n junctions with polarization doping have avalanche capability; 2) stress in avalanche regime induces an increase in breakdown voltage, referred to as breakdown walkout; 3) this process is fully-recoverable, thus being related to a trapping mechanism; 4) temperature-dependent measurements of the breakdown walkout identify $\text{C}_{N}$ defects responsible for this process; and 5) capacitance deep level transient spectroscopy (C-DLTS) and deep level optical spectroscopy (DLOS) confirm the presence of residual carbon in the devices under test. A possible model to explain the avalanche walkout is then proposed.

Investigation of dry-etch-induced defects in >600 V regrown, vertical, GaN, p-n diodes using deep-level optical spectroscopy

The impact of dry-etch-induced defects on the electrical performance of regrown, c-plane, GaN p-n diodes where the p-GaN layer is formed by epitaxial regrowth using metal-organic, chemical-vapor deposition was investigated. Diode leakage increased significantly for etched-and-regrown diodes compared to continuously grown diodes, suggesting a defect-mediated leakage mechanism. Deep level optical spectroscopy (DLOS) techniques were used to identify energy levels and densities of defect states to understand etch-induced damage in regrown devices. DLOS results showed the creation of an emergent, mid-gap defect state at 1.90 eV below the conduction band edge for etched-and-regrown diodes. Reduction in both the reverse leakage and the concentration of the 1.90 eV mid-gap state was achieved using a wet chemical treatment on the etched surface before regrowth, suggesting that the 1.90 eV deep level contributes to increased leakage and premature breakdown but can be mitigated with proper post-etch treatments to achieve >600 V reverse breakdown operation.

(Invited) Selective Area Growth of p-Type GaN for Gallium Nitride Power Switching Transistors

Superior electronic material properties of GaN semiconductors compared to Si will enable the foundational diodes and transistors for the next revolution in power management technology. To date, high-performance GaN diodes have been demonstrated with breakdown voltages near 5 kV and specific on-resistances of less than 5 mΩ-cm2 [1]. However, a viable GaN vertical power switching transistor is the missing element necessary to realize advanced power management systems utilizing GaN. While GaN transistors are now ubiquitous in RF systems, their lateral device architecture inherently limits these devices to niche applications in power systems. Rather, high-voltage systems rely on vertical device architectures where current flow is normal to the semiconductor surface. Vertical power electronics devices such as junction field effect transistors (JFETs) require selective areas of p-type semiconductor surrounded by lightly-doped n-type semiconductor. For Si power devices, p-type regions are implanted in n-type drift regions to create p/n junctions that act as a gate and pinch-off current. Ion implantation presents challenges in GaN and requires specialized equipment and processes, including high-pressure and high-temperature annealing, for dopant activation [2]. Our previous work using metal-organic chemical vapor deposition (MOCVD) where p-type GaN was regrown on a lightly-doped, non-etched n-type drift layer demonstrated planar p/n diodes with the same electrical performance as continuously-grown devices. However, when dry-etching processes are used before the regrowth of the p-type GaN layer, as would be needed to define a regrown area, planar diodes demonstrate higher forward and reverse leakage currents, and lower breakdown voltage. Deep Level Optical Spectroscopy (DLOS) was used to identify the source of the higher forward and reverse leakage currents observed in diodes with p-type anodes re-grown on inductively coupled plasma (ICP) dry-etched n-type drift layers. We will report DLOS studies of various diode structures that show the formation of a mid-gap trap located ~ 1.7 eV below the conduction band in dry-etched, lightly doped (Nd-Na = 2x1016 cm-3) drift layers. We also will show that various wet-chemical treatments of the dry-etched n-type drift layer prior to p-anode regrowth results in diodes with 1 to 2 orders of magnitude lower reverse leakage current. DLOS measurements of regrown diodes showed a 3 times reduction in the density of the mid-gap deep level trap following wet-chemical treatment. These studies establish the connection between high reverse and forward leakage currents with residual damage caused by dry-etching and that this damage can be mitigated by with wet-chemical treatments prior to regrowth of the p-anode. The information, data, or work presented herein was funded in part by the Advanced Research Projects Agency – Energy (ARPA-E), U.S. Department of Energy under the PNDIODES programs directed by Dr. Isik Kizilyalli. Sandia National Laboratories is a multimission laboratory managed and operated by National Technology and Engineering Solutions of Sandia, LLC., a wholly owned subsidiary of Honeywell International, Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA-0003525. H. Ohta et al., J. J. Appl. Phys., 57, 04FG09 (2018).T.J. Anderson et al., Elec. Lett., 50(3), 197 (2014).

Degradation Mechanism in Cu(In,Ga)Se2 Material and Solar Cells Due to Moisture and Heat Treatment of the Absorber Layer

The impact of moisture and heat treatment on the microstructural, chemical, and electrical properties of Cu(In,Ga)Se2 films and their collective effect on the solar cell device performance was studied. X-ray photoelectron spectroscopy and secondary ion mass spectroscopy measurements show that water exposure causes surface modification and alters the alkali metal distribution, while no composition or structural effect was observed. Deep level transient and optical spectroscopies revealed that the trap densities (NT) for both the EV + 0.65 eV and EV + 0.98 eV traps increase after water exposure, while the majority carrier concentration (NA) decreases. Time-resolved photoluminescence (PL) and steady-state PL measurements indicated the presence of static, not dynamic, quenching. Reduction of open-circuit voltage (VOC) and fill factor (FF) was observed for the devices but was not associated with a change of recombination mechanism, which remains in the absorber space charge region. A small increase in series resistance and shunt conductance accounts for most of the FF change, while the modification in both NA and NT yield most of the change in VOC . A gradient of majority carrier concentration, related to the alkali profile, also yields a small voltage-dependent current collection after moisture and heat treatment.

(Invited) Β-Ga2O3 Traps: Materials to Devices

Traps in β-Ga2O3 keep devices, such as power transistors, photodetectors, and diodes, from working ideally. This manifests itself as short-term (ns to ms time scales) to longer term (day to week long) instabilities in terminal characteristics including dynamic on-resistance and threshold voltage and as increased leakage currents that degrade breakdown voltage and noise equivalent power. Using both conventional deep level transient and optical spectroscopies (DLTS/DLOS) and direct, quantitative defect spectroscopy on transistors namely constant drain current DLTS (CID-DLTS), the trap energies and concentrations in test structures and metal-semiconductor field effect transistors (MESFETs) are quantified and compared with the instabilities in the MESFET threshold voltage and dynamic on-resistance are correlated showing which traps matter in these MESFETs. A critical step in defect spectroscopy is to identify the sources of defects to enable strategies to eliminate the defects or bring them down to tolerable levels. Our group and the community have made great strides in beginning to identify the defects throughout the bandgap. Using high energy proton and neutron irradiation to create native defects and controlled studies with Fe, the two primary defects that cause threshold voltage instability in MESFETs will be discussed along with mitigation strategies.