Field-effect transistors (FETs) based on oxide semiconductors, mainly In2O3 and ZnO, have been commercialized as channel materials for thin-film transistors due to their features such as electron mobility exceeding 10-50 cm2/Vs, extremely low leakage current, and low process temperature. Recently, FETs that can be applied to ferroelectric memory and back end of line have been demonstrated for implementation in ultra-integrated circuits and semiconductor memory. In order to realize various integrated devices using oxide semiconductors, it is necessary to uniformly deposit ultra-thin films of about 5 nm on a three-dimensional structure from the viewpoint of device integration and suppression of short-channel effects. This research group has shown that amorphous In-Ga-O (IGO) is a promising oxide semiconductor material that can be applied to three-dimensional integrated devices. However, it was shown that IGO-FETs have reliability issues because their threshold voltage (Vth) easily fluctuates in response to voltage stress . The purpose of this study was to examine the factors that contribute to Vth instability and to suppress it by evaluating the relationship between FET reliability and IGO composition ratio and annealing temperature, as well as the effect of crystallization. Top-contact/bottom-gate FETs with AlOx protective films were fabricated by depositing 10-11 nm-thick IGO channels on SiO2 (85 nm)/n++-Si substrates using ALD method Triethylindium and Trimethylgallium The composition ratio of In:Ga in the IGO film was controlled by adjusting the ratio of growth cycles of the InOx and GaOx layers. positive bias stress (PBS), in which a positive voltage is applied to the gate electrode. The reliability of amorphous IGO against PBS was found to depend on the composition ratio of In:Ga and annealing temperature. It is known that the formation energy of O-O bonds corresponding to excess oxygen is lower in amorphous oxide semiconductors than in single-crystal and polycrystal structures due to their higher structural degrees of freedom. It was experimentally clarified that electron capture occurs more easily in IGO systems than in other oxide semiconductors (Ex. In-Zn-O), which is consistent with theoretical calculations in previous studies. In addition, we focused on crystalline Ga-doped In2O3 to improve the reliability of the IGO system and developed a deposition process using ALD method. We demonstrated that FETs with polycrystalline IGOs as channels have superior mobility and reliability compared to amorphous IGOs. The present study clarified that excess oxygen must be reduced during deposition of oxide semiconductors using the ALD method, and that polycrystalline oxide semiconductors are effective in improving reliability.
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