In this work, we present the high performance of composite channel based In0.17Al0.83N/In0.1Ga0.9N/GaN/Al0.04Ga0.96N high electron mobility transistors (HEMTs) on a sapphire substrate. A numerical simulation is carried out for the proposed and conventional GaN channel-based HEMTs using TCAD. Due to the strong polarization of InAlN/InGaN, enhanced electron confinement and high electron mobility of composite channel based proposed device shows excellent DC and RF characteristics with improved linearity than conventional GaN channel based HEMTs. A 55 nm T-gate device demonstrates 4.45 A/mm drain current density (IDS) at VGS = 0 V, 0.7 S/mm stable transconductance (GM) for a wide range of gate bias, and excellent FT/Fmax of 274/288 GHz. Benefiting from the Al0.04Ga0.96N buffer (back-barrier), the device shows a very low sub-threshold drain leakage current and high breakdown voltage (VBR) of 43.5 V. The combination of high FT/Fmax, stable transconductance, and high breakdown voltage of the proposed HEMTs shows the great promise for high power and wide-bandwidth millimeter-wave applications.