A new method is put forward to measure the proof stress and strain-hardening exponent of polycrystalline films (Cu, TiN) under a biaxial residual stresses state on the substrates. The Cu and TiN films were deposited on the steel substrates by ion beam-assisted magnetron sputtering and plasma-assisted chemical vapor deposition (PACVD), respectively. During the tensile test, the longitudinal stress ( σ 1) and transverse stress ( σ 2) of the films were determined by in-situ X-ray diffraction, and the applied strain ( ε a) of the films were measured by a strain gauge. Based on the experimental results, the equivalent stresses σ̄ and equivalent uniaxial strains ε t can be obtained. From the σ̄– ε t curves, the proof stresses σ 0.1 of the Cu and TiN films have been calculated. The results indicate that the values of σ 0.1 of the Cu and TiN films are 328 MPa and 4.2 GPa, respectively, and the values of the strain-hardening exponents for them are 0.62 and 0.36, respectively. In addition, evidence that the plastic flow of TiN film occurred under the tensile load is also obtained.