Artwork Generation Research Articles

Learning-based Artificial Intelligence Artwork: Methodology Taxonomy and Quality Evaluation

With the development of the theory and technology of computer science, machine or computer painting is increasingly being explored in the creation of art. Machine-made works are referred to as artificial intelligence (AI) artworks. Early methods of AI artwork generation have been classified as non-photorealistic rendering (NPR) and, latterly, neural-style transfer methods have also been investigated. As technology advances, the variety of machine-generated artworks and the methods used to create them have proliferated. However, there is no unified and comprehensive system to classify and evaluate these works. To date, no work has generalised methods of creating AI artwork including learning-based methods for painting or drawing. Moreover, the taxonomy, evaluation and development of AI artwork methods face many challenges. This paper is motivated by these considerations. We first investigate current learning-based methods for making AI artworks and classify the methods according to art styles. Furthermore, we propose a consistent evaluation system for AI artworks and conduct a user study to evaluate the proposed system on different AI artworks. This evaluation system uses six criteria: beauty, color, texture, content detail, line and style. The user study demonstrates that the six-dimensional evaluation index is effective for different types of AI artworks.

Brain to 3D Model (Enabling tech of 3D Printers)

This study was planned to conduct and to bring the novel approach of thoughts into 3D into reality by using AI techniques & Methods. The study was conducted on user EEG signals and processed into pre-trained tokens of NLP and EEG signals to identify the probability of the EEG signal approach. The translation of EEG and ECoG signals into NLP level and generate a better prompting to Solve the issue hidden in Tokens of Prompting. These Prompt Techniques produce Generative Art by using Stable diffusion to create an image. That 2 Dimension image has Raw data at the background which is removed by using u2net & ModNet to introduce a more refined format as a preprocess for 3-D artwork Generation. The study focused on using different model like shape-e by OpenAI to create a more general approach but our code used it to produce for specifically 3-D avatar character for Metaverse. Using PifuHD estimation model by Facebook and lightweight human pose estimation.3-D art produced a more refined artwork as 3-D object file that can later be used in terms of producing into 3-D printed stuff and enable 3-D Printers closer to User Access as an efficient way of Technology.

Creative and diverse artwork generation using adversarial networks

Existing style transfer methods have achieved great success in artwork generation by transferring artistic styles onto everyday photographs while keeping their contents unchanged. Despite this success, these methods have one inherent limitation: they cannot produce newly created image contents, lacking creativity and flexibility. On the other hand, generative adversarial networks (GANs) can synthesise images with new content, whereas cannot specify the artistic style of these images. The authors consider combining style transfer with convolutional GANs to generate more creative and diverse artworks. Instead of simply concatenating these two networks: the first for synthesising new content and the second for transferring artistic styles, which is inefficient and inconvenient, they design an end‐to‐end network called ArtistGAN to perform these two operations at the same time and achieve visually better results. Moreover, to generate images of higher quality, they propose the bi‐discriminator GAN containing a pixel discriminator and a feature discriminator that constrain the generated image from pixel level and feature level, respectively. They conduct extensive experiments and comparisons to evaluate their methods quantitatively and qualitatively. The experimental results verify the effectiveness of their methods.

Technical Elements of Machine Learning for Intellectual Property Law

Recent advances in artificial intelligence (AI) technologies have transformed our lives in profound ways. Indeed, AI has not only enabled machines to see (e.g., face recognition), hear (e.g., music retrieval), speak (e.g., speech synthesis), and read (e.g., text processing), but also, so it seems, given machines the ability to think (e.g., board game-playing) and create (e.g., artwork generation). This chapter introduces the key technical elements of machine learning (ML), which is a rapidly growing sub-field in AI and drives many of the aforementioned applications. The goal is to elucidate the ways human efforts are involved in the development of ML solutions, so as to facilitate legal discussions on intellectual property issues.

Rep-tiles with Woven Horns

Rep-tiles with Woven Horns

Application of Art Work Generation Tool for Design element

Application of Art Work Generation Tool for Design element

The laser-plotter: A versatile lithographic tool for integrated optics and microelectronics

The apparatus described here represents a low cost approach to artwork generation for integrated optics and microelectronics, in the resolution range around 2 μm. Its main characteristics are given below, together with some examples of the kind of patterns it can generate.

Chameleon - an integrated desktop CAD system

A new integrated CAD system called Chameleon, which is based on an IBM PC AT compatible computer, is described. Like many commercially available systems, Chameleon can perform circuit simulation and circuit artwork generation for various technologies (i.e. PCB, thick and thin film, custom and gate array technology). Like other systems, the description of circuits to be simulated is performed using graphical schematic capture techniques, and the integration of the various modules is achieved through a database. Unlike other systems, however, Chameleon offers device characterization and modelling for linear and nonlinear circuit applications and allows the DC, AC, time and temperature behaviour of analogue circuits to be investigated on the bench. Since the scope of the system is so wide, the paper provides only a global overview of some of the capabilities of the full system.

Large Copper Substrates for Surface-Mounted Components

The development of large and functionally complex digital semiconductor chips operating at high clock rates has been paralleled by the elaboration of novel packaging concepts to accommodate the large number of input/output ports associated with such devices, and to permit pretesting and characterization before assembly. Probably the most successful packaging approach for such chips is the ceramic leadless chip carrier (LCC) which, in addition to the requirements listed above, provides low reactance interconnects with equal path lengths for all ports. Large substrates are used in combination with LCC's and other surfacemounted components to form the final circuit. For military and other high reliability applications, the preferred substrate material is alumina, which matches the temperature coefficient of the integrated circuit (IC) package; conductors and soldering pads are applied by thick-film screening techniques. Compared to the traditional conductor materials used in thick-film hybrid fabrication (gold, silver, platinum-gold), copper offers several advantages with respect to solderability and repairability but requires more sophisticated handling and processing techniques. Since it is a relatively new technology, performance and processing data are still sparse; nevertheless copper is now used in a number of critical military applications where the requirements for solderability, repairability, thermal conductivity, and cost could not easily be met by precious metal technology. The Raytheon Company has set up in its Quincy, Massachusetts, Plant a production facility capable of manufacturing large multilevel copper motherstrates (4 inch x 5 inch) at the rate of 400 units per month, with production expected to rise to a level of 1000 units per month by mid-1985. The 30 different designs in current production are intended to receive between 60 and 80 LCC's of various sizes and configurations mounted by vapor phase reflow soldering. As many as 12 desoldering and resoldering procedures may be carried out on each board to replace defective LCC's. Each substrate requires an average of 50 screening steps, with some designs calling for 60 or more. The number of conductor layers varies from five to seven, with as many as 2000 interconnecting vias per unit. Despite the complexity of this family of devices the overall yields have averaged 85 percent thanks to rigorous process and material controls. All procedures starting with computeraided design (CAD) artwork generation and screen manufacturing are carried out within the same plant. The circuits exhibit no bowing (potatochip effect) even without compensatory backside screening, thereby reducing final thickness and weight, and improving thermal transfer to the heat sink in the final system assembly.

Heat Plates, Ladders and Sinks by Photochemical Milling

The production of these passive components by Chemical Milling is becoming more common. The author discusses artwork generation, etch allowances, phototooling, types of materials, identification number and logo markings on and in the surface, the pros and cons of step etching and prepreg cutters, and concludes by considering normal tolerance inspection requirements and packing.

Laser Pattern Generator for Printed Circuit Artwork

SummaryIn the manufacture of printed circuits the preparation of artwork and master photography is time-consuming and fraught with hazards. The initial touching-up stage of the master photography and the checking of etch and/or plating resists for faults prior to processing is costly, with a manpower commitment in excess of any other production operation. A further problem is the limitation of conductor widths and spacing imposed by conventional artwork generation when modern packaging densities may require the routing of two or even three conductors between DIP pin spacing of 2.54 mm imposing line widths of 0.1 mm or less. Developed from techniques now gaining favour in news production, the use of computer controlled lasers has proved feasible and the development of high energy lasers has permitted the further development of a direct imaging process on to the sensitised surface of a printed circuit board. The costly two and three-stage retouching sequence in manufacture is thereby eliminated and line wid...

An Introduction to the Navy Manufacturing Technology Program for Computerized Thick-Film Printing

The objective of the Navy Manufacturing Technology Program for Computerized Thick-Film Printing is to establish advanced thick-film hybrid manufacturing capabilities that are cost effective and efficient when applied to the comparatively small quantities of thick-film hybrid microcircuits typically associated with defense avionics development and production programs. This program will establish a thick-film hybrid microcircuit manufacturing technology based on high-speed orifice writing processes, controlled by computer-aided hardware and software, for low-cost and fine-line deposition of thick-film materials onto ceramic substrates. As a result of this program, Navy microelectronic hardware acquisition costs will be reduced. Contractor production cycles will be shortened through the reduction or elimination of those costs presently associated with key labor-intensive thick-film manufacturing processes. Specifically, savings should be realized by elimination of 1) critical artwork generation procedures, 2) photolithographic preparation of stencil screens necessary for microcircuit fabrication, 3) intermediate production tooling as represented by the stencil screens, and 4) lengthy prototype-and-redesign cycles. The proposed manufacturing technology is directed toward, but not limited to, the hybrid microelectronics manufacturer who typically has modest thick-film and assembly capabilities, but has virtually no efficient in-house means to generate complex artwork. Currently, this manufacturer is constrained to the labor-intensive stencil screen preparation required for screen printing. Realization of this manufacturing technology will enhance even the smallest fabrication facility. It will provide not only a tooling-free microcircuit printing capability for prototype and limited production quantities, but a complementary microcircuit pattern design capability as well.

Computerized Thick-Film Printer

The computerized thick-film printer has been developed as a manufacturing tool for the efficient and economical production of small quantities of thick-film hybrid microcircuits. Its capability for fine-line definition onto ceramic substrates is based on the use of a high-speed orifice printing process. The printer reduces the time and cost of developing and producing thick-film hybrid microcircuits. Timesavings result because the printer can eliminate some of the steps involved in progressing from the design to screen printing of the circuits. Costsavings result because the printer can eliminate certain key labor-intensive thick-film manufacturing processes. Specifically, savings should be realized by the elimination of 1) critical artwork generation procedures, 2) photolithographic preparation of stencil screens for microcircuit fabrication, 3) intermediate production tooling as represented by the stencil screens, and 4) lengthy prototypeand-redesign cycles. The computerized thick-film printer provides the user with a pattern-design and printing capability suitable for producing prototypes and small-quantity production runs of hybrid.

Integrated circuit artwork generation by laser machining : M. Feldman, J. M. Moran, R. L. Ruth and R. R. Gorham. Solid St. Technol. p. 52 (May 1977)

Integrated circuit artwork generation by laser machining : M. Feldman, J. M. Moran, R. L. Ruth and R. R. Gorham. Solid St. Technol. p. 52 (May 1977)

Compensation of microstrip bends by using square cutouts

An alternative to the commonly used technique of mitring for compensation of microstrip bends is described. Experimental data are presented for the case where a square cutout is removed, at either the inner or outer corner of the 90° bend. This approach eases artwork generation.

A Fast Turn Around Electron-Beam Pattern Generation System

An electron-beam mask-generation system designed to demonstrate fast turn around and high resolution capability is described. The system has been developed using an Advanced Metals Research 900 SEM and a Nuclear Data 812 computer. Patterns are generated utilizing a matrix of 4096×4096 randomly addressable data points. Complex and/or large patterns can be generated by mechanical repositioning of the substrate and scanning of adjacent fields. A complete stepped and repeated master plate is produced in several hours as compared with several days using conventional systems. The time saving has been primarily achieved by combining the artwork generation, reduction, and step and repeat operations into a single operation. Compatibiltiy with conventional computer aided design and graphics software has been maintained by translating ordinary artwork generation data into information acceptable by the electron-beam system. Extensive software allows virtually all geometries to be generated by the system.

An interactive system for semi-automatic artwork generation of printed circuit boards

An integrated interactive system for the P.C. boards production is described. The system comprises a minicomputer, a teletype, a paper tape puncher and reader and a package of analysis, control and post-processing programs.The input data to the system consist of circuit schematics, coded in terms of electrical components and connections, and manual layouts of the P.C.B.'s. Both inputs are internally and mutually checked.This operation is performed on-line with the digitizing phase, producing an intermediate punched paper tape and diagnostic printouts.Information recorded on the paper tape are then split in order to obtain control paper for N.C. artwork, drill and insertion machines.A core-resident components library supplies all the required supplementary data, i.e. pads size, holes diameter, drawing symbols, etc.Important features of the system are:- exhausive controls of the layout against the schematic and v.v.;- very easily made and completely system controlled updating and/or correcting of both schematics and layout;- no significant limitations.Results obtained during first months of system's operation are reported; a cost reduction of about 50% and a turnaround time reduction of about 60% with respect to the manual system have been achieved.

XYTOLR-A Computer Program for Integrated Circuit Mask Design Checkout

XYTOLR is a computer program which checks integrated circuit mask designs for compliance with design rules such as those which require minimum clearances between diffused and metallized areas. The input is the same machine readable mask description that is used for automatic mask art work generation. Clearance violations, if present, are reported in graphic and printed form with pointers to the erroneous statements in the user's input.

Common formats in automated artwork generation

This paper is devoted to the forms and the generation of common formats which can be integrated into general automated artwork production for multi-layer printed-circuit boards.

Automatic Artwork Generation for Large Scale Integration

Large scale integration offers the possibility of very low-cost digital circuits. However, to realize fully the cost potential in LSI, several problems must be solved, one of which is the time and cost involved in preparing, by conventional techniques, masks for LSI chip fabrication. To facilitate mask generation, an artwork generator system has been developed. The system, comprised of a small artwork generator of high capability and a language structure which allows for compact description of chip features, has demonstrated itself capable of substantial savings in mask generation time and cost.