Array Package Research Articles

Design of Power Amplifiers for BDS-3 Terminal Based on InGaP/GaAs HBT MMIC and LGA Technology.

With the development and popularization of the Beidou-3 navigation satellite system (BDS-3), to ensure its unique short message function, it is necessary to integrate a radio frequency (RF) transmitting circuit with high performance in the BDS-3 terminal. As the key device in an RF transmitting circuit, the RF power amplifier (PA) largely determines the comprehensive performance of the circuit with its transmission power, efficiency, linearity, and integration. Therefore, in this paper, an L-band highly integrated PA chip compatible with 3 W and 5 W output power is designed in InGaP/GaAs heterojunction bipolar transistor (HBT) technology combined with temperature-insensitive adaptive bias technology, class-F harmonic suppression technology, analog pre-distortion technology, temperature-insensitive adaptive power detection technology, and land grid array (LGA) packaging technology. Additionally, three auxiliary platforms are proposed, dedicated to the simulation and optimization of the same type of PA designs. The simulation results show that at the supply voltage of 5 V and 3.5 V, the linear gain of the PA chip reaches 39.4 dB and 38.7 dB, respectively; the output power at 1 dB compression point (P1dB) reaches 37.5 dBm and 35.1 dBm, respectively; the saturated output power (Psat) reaches 38.2 dBm and 36.2 dBm, respectively; the power added efficiency (PAE) reaches 51.7% and 48.2%, respectively; and the higher harmonic suppression ratios are less than -62 dBc and -65 dBc, respectively. The size of the PA chip is only 6 × 4 × 1 mm3. The results also show that the PA chip has high gain, high efficiency, and high linearity under both output power conditions, which has obvious advantages over similar PA chip designs and can meet the short message function of the BDS-3 terminal in various application scenarios.

Research on Processability and Transmission Performance of Low Temperature Co-Fired Ceramic Ball Grid Array Packaging Based on Electroless Plating Surface Modification for Microwave Transceiver Circuits.

A microwave transmitter/receiver using the low-temperature co-fired ceramic substrate and ball grid array packaging demonstrates superior properties, including high integration, miniaturization, and high electromagnetic shielding. However, it holds limitations of inadequate hermeticity (that is, gas or moist impermeability), high cost, and low reproducibility. In this work, we aim to overcome these difficulties by introducing a new packing technique. The packaging utilizes an electroless plated Ni/Pd/Au surface, resulting in a significant enhancement of the packaging hermeticity by orders of magnitude, approaching the level of <5 × 10-9 Pa·m3/s. Both Sn63Pb37 and Au80Sn20 solder alloys demonstrate exceptional solderability, attributed to Pd atoms diffusing to the Au layer during soldering at 310 °C. A reliability test of the packaging shows that the shear strength of the solder balls drops after thermal shocks but negligibly affects the hermeticity of the packaging. Furthermore, a meticulously designed internal vertical interconnect structure and I/O interconnections were engineered in the ball grid array packaging, showcasing excellent transmission characteristics within the 10-40 GHz frequency range while ensuring effective isolation between ports.

Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations

This study experimentally and numerically investigated the endurance life and mechanical behavior of the ball grid array (BGA) packages according to the presence of underfill and the properties of underfill materials. Using non-underfill, medium Tg underfill (120 °C) and high Tg underfill (165 °C), we thoroughly investigated which underfill determines the reliability of BGA package structures. The presence or absence of the underfill fundamentally determines the reliability of the BGA package.

Flow behavior during solder/Cu column friction plunge micro-welding

PurposeThe author proposed a friction plunge micro-welding (FPMW) method and applied it to column grid array packaging to realize the connection of copper columns without precision molds assisted positioning. The purpose of this paper is to study the flow behavior of the solder undergoing frictional thermo-mechanical action during the FPMW and to determine the source of the solders in the micro-zones with different microstructure characteristics near the solder/Cu column friction interface.Design/methodology/approachThree kinds of Sn58Bi/SAC305 and SAC305/Pb90Sn composite solder samples were designed to study the flow behavior of the solder during FPMW using Bi and Pb as tracer elements.FindingsThe results show that most of the solders in the position occupied by the copper column was softened and plasticized during the welding process and was extruded to side of the copper column, flowing axially, circumferentially and radially along a trajectory similar to a conical spiral line. Under the drive of the tangential friction force and the radial hold-tight force, the extruded out visco-plastic solders fully mixed with the visco-plastic solders on the sides of the copper column, and bonded with the solders that deformed plastically on the periphery, so that a stir zone and a dynamic recrystallization zone finally evolved. The outside plastically deformed solders evolved into a thermo-mechanical affected zone.Originality/valueThe flow behavior of the solder during the FPMW was determined, as well as the source of the solders in micro-zones with different microstructure characteristics.

ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design

With the rapidly growing demand for system-level integration, package substrates have become one of the most important carriers in semiconductor industry. Fine pitch ball grid array (FBGA) packaging is a widely used technology thanks to its relative cost-effectiveness compared to other advanced packaging technologies. In addition, it is also widely used in space-constrained applications, such as mobile and handheld devices. These packaging substrate interconnections are usually customized by layout engineers taking many complex and stringent design rules into consideration. However, fully net-by-net manual design for FBGA is time-consuming and error-prone. In this article, we propose an integer linear programming (ILP)-based router for wire-bonding FBGA packaging design. Our ILP formulation not only can handle design-dependent constraints but also take the problem of mismatched via dimension into account, which is caused by the mechanical processes and greatly increases design complexity. In addition to the ILP formulation for substrate routing, three optimization stages and several ILP constraint reduction techniques are also developed to boost the run time of ILP solver. Experimental results indicate that the proposed framework can achieve high routing completion rates, which could effectively reduce the cycle time of substrate layout design. In addition, in combination with the proposed optimization strategies, 278× speedup can be achieved compared to the ILP constraint optimized router.

Design and simulation of a flexible piezoelectric sensing array with stable sensitivity and high duty cycle

Flexible piezoelectric sensing arrays (FPSA) have an irreplaceable role in the fields of stress detection and self-energy supply and are part of the current hotspots of research in flexible electronics. In this paper, a FPSA with stable sensitivity and high duty cycle is designed to achieve high sensitivity over a wide range and a high duty cycle of 84.17%. The sensing unit uses two inverted trapezoidal prismatic structures (ITPS) with piezoelectric layers with stable sensitivity to pressure. For practical fabrication, a single-electrode array and cut package are proposed to solve the crosstalk problem between the highly duty cycle array units. The single-electrode array reduces the array structure’s complexity and the process’s difficulty. The cut package reduces crosstalk between units and improves the stress sensitivity of the array. Comsol Multiphysics and Abaqus provide strong validation and analysis of this design. The designed FPSA, which has demonstrated excellent performance in simulation analysis, significantly decreases the time and economic cost of device preparation. Given the compelling features, this study offers an effective solution for mitigating unit crosstalk in flexible sensing arrays, which hold significant academic research promise and application value.

Size-on-demand preparation of SAC305 solder balls based on pulsated orifice ejection method

Drop-on-demand ejection of solder droplets has significant potential applications in field such as ball grid array packaging and microcircuit printing. To apply this technique successfully, it is important to ensure stability during the ejection of droplets and control the size of the droplets accurately as required. In this study, the pulsated orifice ejection method (POEM) is used to investigate the relationship between key parameters and the stability and size of SAC305 droplet ejection. Additionally, the microstructural morphology changes in solder balls with different sizes are investigated. Reducing the duration of the tup, increasing of voltage, and decreasing rod distance all lead to bigger solder balls. To achieve stable and size-on-demand droplet ejection, key parameters should be coordinated to ensure the deviation between the actual solder ball size and the target solder ball size remains within a range of ±10 μm. Observation and analysis of the microstructure reveal that as the size of solder ball increase, the cooling rate decreases rapidly, resulting in significant differences in the dendritic growth within the solder balls. This study presents an effective method and parameter selection for the drop-on-demand droplet ejection process, providing a solid foundation for direct solder bump deposition and microcircuit printing.

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions.

Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of -40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly.

Mechanical properties of Sn–Pb based solder joints and fatigue life prediction of PBGA package structure

Solder joints are generally the weakest part in electronic packaging structure whose fatigue life depends to a large extent on the durability of solder joints. In pursuit of a balance between environmental protection and soldering performance, commonly used Sn–Pb solder should be modified by adding other chemical elements to reduce Pb content. This work aims to investigate the performance of different solder materials and explore the impact of different electronic package structures. Firstly, tensile experiments are performed on three kinds of solders (Sn–Pb, Sn–Pb–In, Sn–Pb–Bi) to obtain their mechanical behavior, and then the constitutive laws of them are calibrated by Anand model. Additionally, finite element method (FEM) is used simulate the response of plastic ball grid array (PBGA) package structure under thermal cycles, and mechanical variables including deformation, equivalent stress, and equivalent strain are analyzed. Finally, Coffin-Manson and Engelmaier equations are adopted to predict the fatigue life of package structures and the effects of various factors such as solder materials, dimensions of components, and welding quality are further investigated. Results reveal that adding Bi into Sn–Pb solder can make the solder joints have better performance. From the perspective of optimum fatigue life, the plastic package thickness is recommended in the range of 0.8 mm–0.9 mm, the chip thickness is recommended as 0.35 mm, the substrate thickness is recommended to be less than 0.34 mm, and the ratio of stand-off height to solder ball diameter should be controlled between 0.6 and 0.7. According to the prediction, the solder ball diameter is suggested to be 0.54 mm so that fatigue life could reach 194 cycles, and the stand-off height for this package structure is suggested to be 0.36 mm so that fatigue life could reach 123 cycles.

Refined simulation method and failure study of BGA package structure based on image drive

The packaging structure, internal defects, and external loads have a significant impact on the reliability and ultimate failure of chip performance. Therefore, establishing a refined model that considers multiple factors is of great significance for improving the reliability and optimizing design of packaging structures. For this purpose, this study firstly adopts CT scanning technology to reconstruct the ball grid array (BGA) package structure in three dimensions, optimize the finite element meshing, and analyze the drop behavior by using the finite element method based on nonlinear damage instantiation. In addition, to further investigate the effect of fine defects on the failure of the package structure, a simulation of the damage evolution behavior of a real defective solder ball structure under impact loading is implemented with the help of submodeling techniques. The research results provide a technical reference for the reliability analysis and multi-occasion structure design of aerospace BGA package structures.

Cost-Effective Broadband and Compact Patch Antenna Based on Ball Grid Array Packaging for 5G NR FR2 Band Applications

This brief introduces a compact, cost-effective broadband patch antenna based on ball grid array (BGA) packaging technology for 5G millimeter wave new radio (NR) FR2 band application. Based on the low-cost FR-4 substrate and single-layer configuration, the patch antenna achieves an ultra-low cost, which is attractive for large-scale 5G millimeter-wave array applications. Parasitic patches are added to the antenna to obtain broadband impedance bandwidth. To further reduce the antenna size and eliminate bulky connectors, solder balls are added to form a BGA package with connectorless interconnects. Consequently, the proposed antenna element achieves a compact size of 5.2 mm × 3.2 mm × 1.4 mm. Antenna elements and 1 × 8 array prototypes have been fabricated and verified. The measurement results show that the proposed antenna element has a -10 dB bandwidth of 56.1% (20-35.6 GHz), fully covering the 5G millimeter wave n257 (26.5-29.5 GHz), n258 (24.25-27.5 GHz), and n261 (27.5-28.35 GHz) bands. The maximum realized gains of the antenna elements and the 1 × 8 array prototype are 7.2 dBi and 13.9 dBi, respectively.

Reliability and failure modelling of microelectronic packages based on ultrasonic nondestructive evaluation data

Reliability testing and failure modelling is crucial and very challenging for modern electronics, especially safety critical electronics-based systems working under harsh environmental conditions. In this paper, an approach based on ultrasonic Non-Destructive Evaluation (NDE) is proposed to establish a failure model for solder joints which is urgently needed for prognostic and health management of electronics. Printed Circuit Boards (PCB) containing flip-chip and Area Array packages were designed and aged using Accelerated Thermal Cycling (ATC) testing. During ATC testing solder joint degradation was regularly monitored by taking out the test boards from the temperature chamber at four thermal cycle intervals for ultrasonic micro-imaging. Data pre-processing techniques including dynamic range-based intensity normalization, gain compensation, and calibration for random transducer defocusing errors were developed to enhance the data consistency, integrity and accuracy. Furthermore, solder joint image labelling and segmentation methods were developed by exploiting the geometrical features of the solder joints to extract individual solder joints and Region of Interests (ROIs) from the sequential ultrasound images collected throughout the testing. The mean intensity of the ROIs was used as the precursor to degradation to build the solder joint failure model, from which cycles to failure for individual solder joints are finally derived for life prediction.

Drop and impact reliability investigation of BGA and LGA interconnects

PurposeBecause of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims to investigate the mechanical shock and impact reliability of various solder alloys and BGA/LGA interconnect configurations.Design/methodology/approachTherefore, this paper uses drop testing experiments and numerical finite element simulations to evaluate and compare the reliability performance of both LGA and BGA components when exposed to drop and impact loadings. Additionally, three common solder alloys, including 63Sn37Pb, SAC305 and Innolot, are discussed.FindingsThe results of this study showed that electronic packages’ drop and impact reliability is strongly driven by the solder configuration and the alloy type. Particularly, the combination of stiff solder alloy and shorter joint, LGA’s assembled with SAC305, results in highly improved drop reliability. Moreover, the BGA packages’ performance can be considerably enhanced by using ductile and compliant solder alloys, that is, 63Sn37Pb. Finally, this paper discussed the failure mode of the various solder configurations and used simulation results to explain the crack and failure situations.Originality/valueIn literature, there is a lack of published work on the drop and impact reliability evaluation and comparison of LGA and BGA solders. This paper provides quantitative analysis on the reliability of lead-based and lead-free solders when assembled with LGA and BGA interconnects.

Proposal of intense pulsed light soldering process for improving the drop impact reliability of Sn–3.0Ag–0.5Cu ball grid array package

Until now, electronic packages have been manufactured using the conventional convection reflow process. However, it is becoming challenging to apply the reflow process because it is time-consuming and produces thick intermetallic compounds (IMCs) at the joint interface. In addition, the reflow process consumes a lot of power because of the preheating required and the generation of waste heat, thereby interfering with carbon neutrality. To overcome these issues, the feasibility of intense pulsed light (IPL) radiation soldering for the ball grid array package assembly process was investigated in this study. A very thin IMC was formed at the IPL-soldered joint (IMC thickness = 1.2 μm) because of the short IPL process time. However, the IMC formed during the reflow process was 6.1 μm-thick. Thus, the drop impact reliability of the IPL-soldered joint (number of drops to failure = 277) substantially improved compared with that of the reflow-soldered joint (number of drops to failure = 103). In addition, the power consumption of the IPL radiation soldering process was 17.95 kWh, considerably lower than that of the conventional convection reflow process (29.50 kWh). Therefore, we suggest that IPL soldering has a high potential to reduce process time, IMC thickness (enhancing the drop impact reliability), and power consumption.

New Packaging Technology for 2-dimensional VCSEL Arrays and Their Electro-Optical Performance and Applications

At IMAPS2021, we reported on 1-dimensional VCSEL arrays and the packaging technology developed for these arrays, but this time we present the manufacturing workflow and look at the challenges presented by the packaging of special long-wavelength 2-dimensional vertical-cavity surface-emitting laser (VCSEL) arrays in various dimensions. We will show that available packaging technologies for epoxy application by silk screening, die- and wire bonding can be adapted for the unique properties of the 2D VCSEL arrays, delivering high accuracy for production with great overall yield. Proof of the excellent reliability and lifetime will be given through mechanical and electro-optical testing results. The technologies developed for 2D laser arrays will enable new devices for various new applications like high channel count interconnects for data communication and high power VCSEL solutions for 3D sensing. The perfected wire bonding process secured a homogeneous monometallic structure of the wire bonds, a reduced, well defined bond loop height, with sufficient clearance of the bonding wire above the VCSEL surface. Properly set-up manufacturing procedures for the packaging of the VCSEL arrays are necessary to achieve high performance and reliability of the products presented. Processing of large 2D-VCSEL arrays will be part of the paper. 2D arrays have enabled VCSEL technologies to address a wide range of new laser-based sensing applications. VCSEL products vary from laser chips with only a few emitters for proximity sensors up to several thousands of emitters for LiDAR systems. Applications include systems for the automotive, industrial, medical and consumer markets. There is a strong and growing market opportunity for long wavelengths VCSELs, e.g. based on InP material enabling single mode and multi-mode 2D-VCSEL arrays from 1.3 to beyond 2 µm. For 3D sensing systems and free-space optical communication, long wavelength 2D-VCSEL arrays offer improved eye safety and further benefits. The long wavelength VCSELs discussed in this paper can be deployed in a wide range of sensing and optical communication applications.

Development of high performance flip chip ball grid array (FCBGA) packages for automotive application processors

Automobiles have witnessed rapid proliferation of infotainment, driver assistance and autonomous driving features which have led to significant increase in semiconductor content per car. However, this has also required increased integration of device functionality to meet the new automotive requirements for in-vehicle networking, autonomous driving, infotainment, and sensor integration. Advance technology/packages are needed to provide ideal solutions for automotive grade reliability, high electrical performance, and multi-function integration for automotive application processors. To address these requirements, innovative packages including Flip Chip Ball Grid Array (FCBGA) are the potential solutions. In this study FCBGA packages are developed for automotive processor application and qualified for AEC2 qualification tier. To achieve higher performance and reliability, different package substrate materials such as core dielectric and build-up dielectric were evaluated. Mechanical modelling and simulation of package reliability and influence of key material properties such as coefficient of thermal expansion (CTE), modulus of elasticity (E) and glass transition temperature (Tg) was used to provide guidance for the selection of substrate and assembly materials. Developed packages met all the product performance requirements and passed package qual conditions of high temperature storage life (150°C, 500 hours), temperature cycling (-55 °C to 125 °C, 1000 cycles), temperature humidity bias (85 °C, 85% RH, 1000 hours) and board level temperature cycling (-40 °C to 125 °C, 1000 cycles).

Deformation behaviors of flip chip plastic ball grid array packages subjected to temperature change using moiré interferometry

When the temperature of the package assembly is changed, non-uniform deformation and local stress may occur owing to the different thermal expansion coefficients of the constituent materials, while concentrated thermal stress may cause significant failure. In this study, we carry out an experiment and analysis of the thermal deformation of a flip chip plastic ball grid array package with respect to temperature change. Interference fringe patterns representing the displacement distribution of each temperature stage are obtained using a Moiré interferometry and the bending deformation behavior and the strain of the solder ball are analyzed thereafter. We compare the deformation behavior of a single-sided package assembly and a double-sided package assembly. The effective strain, which significantly affects the failure of the solder ball, is found to be the largest in the solder ball just outside the edge of the chip in the case of the single-sided package assembly. In the case of the double-sided package assembly, the maximum effective strain is found in the solder ball just inside the edge of the chip, with a value approximately 50 % larger than in the case of the single-sided package assembly. Wenn sich die Temperatur eines Gehäuses ändert, kann es aufgrund der unterschiedlichen Wärmeausdehnungskoeffizienten der einzelnen Werkstoffe zu ungleichmäßigen Verformungen und lokalen Spannungen kommen, während konzentrierte thermische Spannungen zu erheblichen Ausfällen führen können. In dieser Studie führen wir ein Experiment und eine Analyse der thermischen Verformung einer Flip-Chip Kunststoffkugel Gitteranordnung in Abhängigkeit von der Temperaturänderung durch. Mit Hilfe der Moiré-Interferometrie werden Interferenzstreifenmuster aufgenommen, die die Verschiebungsverteilung jeder Temperaturstufe darstellen und anschließend werden das Biegeverformungsverhalten und die Dehnung der Lötkugel analysiert. Wir vergleichen das Verformungsverhalten einer einseitigen und einer doppelseitigen Gehäusebaugruppe. Es zeigt sich, dass die effektive Dehnung, die das Versagen der Lötkugel maßgeblich beeinflusst, im Fall der einseitigen Baugruppe in der Lötkugel direkt außerhalb des Chiprands am größten ist. Bei der doppelseitigen Baugruppe ist die maximale effektive Dehnung in der Lötkugel direkt innerhalb des Chiprands zu finden, mit einem Wert der etwa 50 % größer ist als bei der einseitigen Baugruppe.

Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis

Under alternating temperatures, the fatigue failure of solder balls caused by the mismatch of the thermal expansion coefficient is a key problem in a Ball Grid Array (BGA). However, the combined effects of the solder ball location and the size of voids within it can seriously affect the thermal fatigue reliability of BGA solder balls, which can be easily ignored by researchers. Firstly, the thermal fatigue reliability of the board-level solder balls was evaluated by a temperature cycling test of the BGA package at -20 °C-+125 °C. The experimental results showed that the thermal fatigue reliability of the outer ring's solder joint was lower than that of the inner ring. Secondly, the reliability of the solder balls in the BGA package was studied under the same thermal cycling condition based on finite element analysis (FEA). The influences of voids on fatigue life were investigated. Generally, a linear correlation between the void content and the fatigue life of the inner rings' solder balls could be identified with a gradually smoothed relationship for solder balls closer to the center. In addition, when the size of the void exceeded a critical volume, the inner ring's solder ball with the void would fail before the outermost ring. The results of FEA showed that the critical void volume ratio from the second to fifth ring increased from 10.5% to 42.3%. This study provides a valuable reference for the influence of voids on the thermal fatigue reliability of BGA solder balls.

Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation

The objective of this study is to investigate warpage of a Flip-Chip Ball Grid Array (FCBGA) package experimentally and numerically. Projection Moiré technique was used to measure full-field warpage during heating experiment from room temperature up to 250 °C. As temperature changes within the FCBGA package, different thermal strains are generated in the package resulting from the mismatch in the Coefficient of Thermal Expansion (CTE) between the constituent material layers. A finite element model and analytical equations based on the classical bending theory were used to analyze the thermally induced deformations of package under test. The results show that a maximum warpage value of 67 μm with a concave or smiling shape occurred at the neighborhood of 70 °C during heating and 87 μm warpage with a convex crying shape at 250 °C by assuming a stress-free temperature at 175 °C. Warpage analysis showed that the studied FCBGA package exhibits a different curvature in the die region at the center of the package compared to the region outside the die. At temperatures higher than 175 °C, a concave or smiling warpage shape was shown in the die region while a convex or crying shape in the region outside the die. In contrast, at room temperature, the die area has a convex shape warpage, while outside this area presented a concave shape.Furthermore, the good agreement between warpage of the studied package from finite element simulation and measurements was achieved thanks to the use of the measured material's thermal-mechanical properties of the substrate and Molding Compound (MC) rather than using datasheet data. In-plane CTE and Young's modulus of the substrate were measured using stereo-digital image correlation. Moreover, temperature dependent Young's modulus of the MC was measured by nanoindentation.

Investigation of an Embedded Cooling RF Silicon Interposer for an Ultrahigh Heat Flux GaN TR Array

To achieveefficient thermal management with the increase in the heat flux of radio frequency (RF) microsystems, an embedded micro pin-fin flow boiling cooling RF silicon interposer was looked into. Since through-silicon via (TSV) arrays have to be constructed through micro pin-fin pillars, the cooling cavity architecture of uneven micro pin-fin arrays is defined by the TSVs’ distribution in a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$4\times $ </tex-math></inline-formula> 4 RF transceiver/receiver (TR) array package. Based on the validation of a flow boiling visualization, the hydro-thermodynamic behaviors of a triangular micro pin-fin geometry might allow the detachment time of the quickest nucleation boiling bubbles. Comprehensively considering the functioning stability (single-phase flow or two-phase flow at 100 mL/min) and temperature uniformity (less than ±4.45 °C), the optimized regular (28.8 W/400 W/cm2 heat flux) and shock (64.8 W/900 W/cm2 heat flux) modes could be dependably operated for the embedded cooling RF silicon interposer to serve the RF microsystem. In addition, the analytical solutions on the wrapped TSV RF signal (4–40 GHz) vertical transmission showed good agreement (less than 0.08 dB, 0.152 variance) with the measurements. Overall, the demonstrated thermal–electric codesign verification process in this study can be applied to the embedded cooling packages used in high-power RF devices.