Abstract
The packaging structure, internal defects, and external loads have a significant impact on the reliability and ultimate failure of chip performance. Therefore, establishing a refined model that considers multiple factors is of great significance for improving the reliability and optimizing design of packaging structures. For this purpose, this study firstly adopts CT scanning technology to reconstruct the ball grid array (BGA) package structure in three dimensions, optimize the finite element meshing, and analyze the drop behavior by using the finite element method based on nonlinear damage instantiation. In addition, to further investigate the effect of fine defects on the failure of the package structure, a simulation of the damage evolution behavior of a real defective solder ball structure under impact loading is implemented with the help of submodeling techniques. The research results provide a technical reference for the reliability analysis and multi-occasion structure design of aerospace BGA package structures.
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