Abstract
This study experimentally and numerically investigated the endurance life and mechanical behavior of the ball grid array (BGA) packages according to the presence of underfill and the properties of underfill materials. Using non-underfill, medium Tg underfill (120 °C) and high Tg underfill (165 °C), we thoroughly investigated which underfill determines the reliability of BGA package structures. The presence or absence of the underfill fundamentally determines the reliability of the BGA package.
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