Special pariticle column and silicone composite thermal interface material were designed and proposed to assure reliability via CTE matching owing to the rise in the quantity of heat produced per unit area of electronic devices. Using nickel columns, a total of nine thermal interface materials (TIMs) were developed based on the mixing ratio and pattern of thermal TIMs. As a result, an experiment was carried out on thermal performance as a function of load variation. Thermal resistance reduced as load rose in all TIMs, heater power increased, and then thermal resistance was slightly raised or not altered after exhibiting the lowest value at 15W. The 10:7 mixing ratio of Silicon-Nickel produced the best thermal performance. The heat conduction performance of TP107 with a mixing ratio of 10:7 was 7 to 8% better than TP109 and 14 to 16 percent greater than TP105. Furthermore, as compared to pads with higher nickel hardness, pads with reduced nickel hardness enhanced heat transfer performance by 12-14 percent. It can be expected that there is an ideal mixing ratio for TIM via the metal pillar, and that by lowering metal hardness, contact thermal resistance between metal particles may be lowered.