Ammonia Molecular Beam Epitaxy Research Articles

Tackling residual tensile stress in AlN-on-Si nucleation layers via the controlled Si(111) surface nitridation

This work is devoted to the study of the influence of controlled Si(111) surface nitridation on the epitaxial growth of AlN-on-Si nucleation layers with reduced tensile stress on ordered crystalline silicon nitride phase. The Si(111) surface nitridation process was performed at low ammonia flux and substrate temperatures in the range of 700–900 °C and was studied using RHEED and STM techniques. A universal criterion, namely the stage of the nitridation process completion is introduced, taking into account the influence of substrate temperature, ammonia flux and nitridation time. The 100 nm AlN nucleation layer on silicon substrates grown by ammonia molecular beam epitaxy is studied using AFM, XRD, HR-TEM and Raman spectroscopy techniques. The Raman data show that reducing the nitridation temperature from 900 °C to 700 °C not only deteriorates the crystalline quality of the subsequent AlN nucleation layers, but also reduces the residual tensile stress by almost 30 %. In the present contribution, micro-Raman spectroscopy is used to determine the nature of the defects formed during the high temperature growth of the AlN nucleation layers and confirms them to be inversion domains. The HR-TEM technique was used to study the AlN/Si interface in AlN-on-Si nucleation layers grown on a nitridated silicon surface at 700 °C and 900 °C at the optimum stage of the nitridation process completion. HR-TEM images of AlN nucleation layers revealed regions with different AlN/Si(111) interfaces: 1) AlN/amorph-Si3N4/Si, 2) AlN/SiN(8 × 8)/Si, and 3) AlN/Si with a sharp interface boundary. Using fast Fourier transform image analysis, it is shown that the presence of amorphous Si3N4 phase inclusions in the AlN/Si interface boundary introduces tensile stresses in the AlN nucleation layer which can be reduced by lowering the nitridation temperature. The results obtained clearly show that one of the causes of cracks in III-nitride layers grown on silicon substrates is the formation of tensile AlN layers with a high content of the amorphous Si3N4 phase at the AlN/Si interface, which is characteristic of silicon nitridation at elevated temperatures (> 700 °C).

NbN thin films grown on silicon by molecular beam epitaxy for superconducting detectors

Superconducting nanowire single photon detectors (SNSPDs) made with thin NbN films can reach high performances. While sputtering has been the deposition method of choice, here, we show that ammonia-molecular beam epitaxy (NH3-MBE) can produce pertinent epitaxial cubic NbN thin films on silicon substrates using an AlN buffer. Despite granular morphology and a high density of grain boundaries as well as the presence of rotational twins, Tc = 12.7 K for a 5.6 nm thick film and saturation of internal detection efficiency up to 850 nm are achieved. Morphology and stoichiometry as well as strain have a strong impact on the detector properties, highlighting the importance of a precise control of the growth parameters. These results pave the way for high fabrication yield of SNSPDs on large-scale silicon wafers using epitaxial NbN thin films grown by MBE.

(Invited) Vertical GaN Diodes: Effect of Growth Parameters, Indium Surfactants, and Device Development for High-Power Electronics

GaN has achieved widespread interest in high-power and high-speed electronics due to its wide-bandgap (WBG), large breakdown field, and high mobility compared to Si and SiC. There is also continued interest in the growth and development of GaN vertical devices owing to their advantageous properties of high current capability from backside ohmic, better field management, scaling feasibility, and enhanced thermal transport, which is not feasible with the lateral device topology. To realize the predicted high breakdown voltage and low on-resistance from vertical devices, high-quality drift layers with low unintentional doping and low compensating defects are fundamentally required. Hence, our research aims to pursue a comprehensive investigation of growth and device development with vertical GaN structures, building from the optimization of thick GaN homoepitaxy with high growth rate but low impurities, improving surface morphology using Indium as a surfactant as well as realizing punch-through field-plate p-n diodes to maximize the average electric field in high-voltage operation.Toward the goal of high-quality GaN epitaxy growth, we performed systematic studies of growth rate effects on the drift layer doping using ammonia molecular beam epitaxy (NH3 MBE) and plasma-assisted molecular beam epitaxy (PA MBE) [1]. The NH3 MBE homoepitaxy GaN demonstrated an unintentional doping (UID) of ~1015 cm-3, significantly lower than that of the conventional metalorganic chemical vapor deposition (MOCVD) reports, which can be potentially contributed by clean growth environment of MBE.We further focused on improving surface morphology using Indium as a surfactant. Through a combination of varying V/III ratios, In flux and growth temperatures, an optimal condition for surface morphology, characterized by atomic force microscopy, was achieved for fast growth rates (on the order of 1 µm/hr and beam equivalent pressures on the order of 5 × 10-7 Torr). However, excessive indium causes the surface morphology to degrade, potentially due to the enhancement of the Ga desorption from the surface as a result of the reaction of indium with ammonia for high indium fluxes. The indium surfactant can also reduce silicon impurities as revealed from the Secondary ion mass spectrometry (SIMS) (Fig. 2).Subsequently, we developed vertical p-n GaN power devices using the NH3 MBE-grown high-quality epitaxy [2]. The vertical p-n GaN diode consisted (from bottom up): ~0.25 µm of n+ GaN ([Si]: 1×1019 cm-3) buffer, ~4 µm UID GaN drift layer for n-type region, ~0.4 µm p+GaN ([Mg]: 3×1019 cm-3) for p-type region, and ~10 nm p++ GaN cap ([Mg]: 3×1020 cm-3) to support the anode ohmic contact. Circular p-n diodes of 80-100 µm diameter were fabricated with Pd/Pt anode and a backside Ti/ Au ohmic contact. The field management was achieved by field-plate of 15 µm formed with Ti/Au metals on top of a field-plate dielectric of a Al2O3 (26 nm)/ Si3N4 (205 nm) stack (Fig. 3).The p-n GaN diodes exhibited an outstanding forward J-V behavior with a low specific on-resistance (Ron,sp) of 0.28 mΩ-cm2 and a minimum ideality factor of 1.36 (Fig. 4), which are among the best achieved in vertical homoepitaxy GaN p-n diodes [2-4]. The best diodes also exhibited a breakdown voltage of > 1 kV (equipment limit 1 kV). These reverse-voltage properties imply a punch-through characteristics with peak electric field (EC) >2.6 MV/cm, as revealed by Silvaco simulation (Fig. 5). The combination of >1 kV breakdown voltage and on-resistance of 0.28 mΩ-cm2 represents one of the best performances of the p-n GaN diodes, achieved with a significantly downscaled (~4 um) drift layer compared to the MOCVD GaN p-n diodes of ≥ 8 um (Fig. 6). Work is ongoing to develop NHE MBE p-n diodes with indium surfactant-assisted drift layer growth which will be promising to further improve the surface morphology, reduce leakage, and enhance breakdown performance of the vertical devices.

Indium as a surfactant: Effects on growth morphology and background impurity in GaN films grown by ammonia-assisted molecular beam epitaxy

We report on the improvement of the surface morphology of c-plane GaN films grown at high growth rates (∼1 µm/h) using ammonia molecular beam epitaxy through a series of growth optimizations as well as the introduction of indium as a surfactant. The indium surfactant was expected to help with the adatom mobility and, thus, provide smoother growth surfaces. Through a combination of varying V/III ratios, In flux, and growth temperatures, an optimal condition for surface morphology, characterized by atomic force microscopy, was achieved. At higher Ga fluxes for fast growth rates (∼1 µm/h and beam equivalent pressures of ∼5 × 10−7 Torr), higher ammonia flows were necessary to preserve the surface morphology. In addition, indium was an effective surfactant—reducing the roughness and improving the overall surface morphology. However, excessive indium causes the surface morphology to degrade, potentially due to the enhancement of the Ga desorption from the surface as a result of the reaction of indium with ammonia for high indium fluxes. The indium surfactant also resulted in a reduction of background Si impurity concentrations in the film. These effects allow for the growth of thick drift layers with low background dopant concentrations for vertical GaN power devices.

Vertical hole transport through unipolar InGaN quantum wells and double heterostructures

We report unipolar hole transport through unintentionally doped (UID) c-plane Ga-polar InGaN heterostructures to investigate the impact of alloy disorder on vertical transport. Simulations and experimental investigations were conducted on unipolar InGaN double heterostructures (DHs) and quantum well (QW) test structures by varying thicknesses and the number of QWs. The structures were simulated using one-dimensional (1D) and three-dimensional (3D) algorithms, incorporating the effects of random alloy disorder in the 3D model using the newly developed Localization Landscape theory. The electrical polarization discontinuity between GaN and InGaN results in a significant barrier for vertical carrier transport. Band-diagram and current density-voltage simulations indicate asymmetric polarization barriers to the vertical hole transport for the InGaN DHs. For the QW structures, however, the simulations indicate a symmetric barrier to the hole transport in forward and reverse bias. In the case of the InGaN DH layers, the 3D simulation results indicate a smaller barrier to hole transport compared to 1D simulations. For QW simulations, the barriers were found to be the same in both 1D and 3D simulations. The simulation results are experimentally verified using unipolar p-type vertical transport structures, enabled by n-to-p tunnel junctions to facilitate the current spreading within the bulk material for the mesa structures grown by ammonia-molecular beam epitaxy. The results indicate that increasing the UID ${\mathrm{In}}_{0.1}{\mathrm{Ga}}_{0.9}\mathrm{N}$ DH layer thickness from 15 to 30 nm increases the forward bias voltage drop (\ensuremath{\sim}2 V at $500\phantom{\rule{0.16em}{0ex}}\mathrm{A}/\mathrm{c}{\mathrm{m}}^{2}$) more than the reverse bias voltage drop (\ensuremath{\sim}0.2 V at $500\phantom{\rule{0.16em}{0ex}}\mathrm{A}/\mathrm{c}{\mathrm{m}}^{2}$). For the QW structures, increasing the number of QWs from one to three increases the voltage penalty similarly in forward and reverse directions (\ensuremath{\sim}0.25 V per QW at $500\phantom{\rule{0.16em}{0ex}}\mathrm{A}/\mathrm{c}{\mathrm{m}}^{2}$). The results are beneficial in understanding the impact of alloy disorder on the transport properties of the III-nitride heterostructures.

Electrophysical parameter comparison of 2DEG in AlGaN/GaN heterostructures grown by the NH3-MBE technique on sapphire and silicon substrates

A comparative study of the structural properties of GaN layers and the electrophysical parameters of 2DEG in AlGaN/GaN heterostructures grown by ammonia molecular beam epitaxy on sapphire and silicon substrates using identical buffer layer designs has been carried out. It is demonstrated that GaN layers grown under the same growth conditions have the similar surface morphology, regardless of the substrate material. It is shown that the dislocation density of compressed GaN layers grown on sapphire substrates up to 5 times lower than in crack-free and stretched GaN layers grown on silicon substrates. The measured values of electron mobility in heterostructures with 2DEG grown on sapphire substrates are higher by 30% than on silicon substrates (∼1600 cm2/V × s and ∼1200 cm2/V × s).

Determination of the AlN nucleation layer thickness formed on the Al-=SUB=-2-=/SUB=-O-=SUB=-3-=/SUB=-(0001) surface during nitridation process by XPS and IR spectroscopy

The effect of different degrees of the sapphire surface nitridation process completion on the AlN buffer layer morphology has been studied. It was found that ~85% completion of the AlN crystalline phase formation promotes the growth of a two dimensional AlN buffer layer with a smooth surface morphology, regardless of the substrate temperature and ammonia flux. In contrast, during the AlN nucleation layer formation as a result of weak or excessive sapphire nitridation, a polycrystalline or three-dimensional AlN structures with a high density of inversion domains, respectively, were formed. Using independent methods of X-ray photoelectron spectroscopy and infrared spectroscopy of surface polaritons, the thickness of the AlN nucleation layer was determined at ~85% degree of the nitridation process completion, which amounted to ~1 monolayer. Keywords: ammonia molecular beam epitaxy, AlN, sapphire, reflection high-energy electron diffraction, nitridation, inversion domains, X-ray photoelectron spectroscopy, surface polaritons.

Defect Tolerance of Intersubband Transitions in Nonpolar GaN/(Al,Ga)N Heterostructures: A Path toward Low-Cost and Scalable Mid- to Far-Infrared Optoelectronics

We report on the impact of structural defects on mid-infrared intersubband (ISB) properties of $\mathrm{Ga}\mathrm{N}/(\mathrm{Al},\mathrm{Ga})\mathrm{N}$ heterostructures grown by ammonia molecular beam epitaxy (${\mathrm{NH}}_{3}$ MBE). Twenty-period $\mathrm{Ga}\mathrm{N}/(\mathrm{Al},\mathrm{Ga})\mathrm{N}$ multi-quantum-well (MQW) heterostructures are grown on co-loaded a-plane freestanding $\mathrm{Ga}\mathrm{N}$ substrates and heteroepitaxial a-plane $\mathrm{Ga}\mathrm{N}$ on r-plane sapphire templates (a-$\mathrm{Ga}\mathrm{N}$/r-sap) for three different quantum-well (QW) widths (3.0, 3.3, and 3.7 nm). Co-loaded structures grown on freestanding a-plane with no basal-plane stacking faults (BSFs), prismatic stacking faults (PSFs), and partial dislocations (PDs), with low threading dislocation (TD) densities of about ${10}^{5}\phantom{\rule{0.25em}{0ex}}{\mathrm{cm}}^{\ensuremath{-}2}$ are compared with those grown on a-$\mathrm{Ga}\mathrm{N}$ templates on $(10\overline{1}2)$ r-sapphire with BSF, PSF, PD, and TD densities of about 4 \ifmmode\times\else\texttimes\fi{} ${10}^{5}$ to ${10}^{6}\phantom{\rule{0.25em}{0ex}}{\mathrm{cm}}^{\ensuremath{-}2}$, 5 \ifmmode\times\else\texttimes\fi{} ${10}^{3}$ to 2 \ifmmode\times\else\texttimes\fi{} ${10}^{4}\phantom{\rule{0.25em}{0ex}}{\mathrm{cm}}^{\ensuremath{-}2}$, about 9 \ifmmode\times\else\texttimes\fi{} ${10}^{10}$ to 2 \ifmmode\times\else\texttimes\fi{} ${10}^{11}\phantom{\rule{0.25em}{0ex}}{\mathrm{cm}}^{\ensuremath{-}2}$, and about ${10}^{10}\phantom{\rule{0.25em}{0ex}}{\mathrm{cm}}^{\ensuremath{-}2}$, respectively. Fourier-transform infrared absorption spectroscopy indicates ISB transition energies in the range of about 250--300 meV (wavelength range 4.1--4.8 \textmu{}m) for MQWs with different QW widths. The ISB absorption spectra indicate about 5% smaller transition energies and only about 10%--20% larger spectral linewidths for structures grown on a-$\mathrm{Ga}\mathrm{N}/$r-sapphire templates compared with those on freestanding $\mathrm{Ga}\mathrm{N}$ substrates. The strong defect tolerance in the nonpolar a-plane ISB structures could be due to the nature of defects and their energy levels with respect to the conduction-band minima, which do not affect the ISB properties. Our results pave the way toward the production of low-cost scalable nonpolar III-nitride MQW heterostructures for a variety of passive and active optical materials and devices based on intersubband transitions.

(Invited) Vertical GaN Devices for High-Power Electronics

With the demand of high-power and high-speed electronics, GaN has achieved widespread interest owing to its wide-bandgap (WBG), large breakdown field, and high mobility that can provide superior performance compared to the Si and SiC that are limited by inherent material properties. In power electronics, GaN is a potential candidate due to its high-quality p-n junctions and availability of native substrates to prevent dislocation-assisted leakage, particularly for vertical devices. For high-power electronics, these vertical devices are more advantageous compared to their lateral counterparts due to their high current capability from large-area backside ohmic, high breakdown voltage from confined electric field within WBG material, scaling feasibility, and better thermal management. Moreover, the punch-through vertical device can extract the full potential of the WBG semiconductors by maximizing the average electric field over the fully depleted drift layer.For high-performance vertical device, high-quality drift layers with low controlled background doping and low compensating defects are essential to obtain the expected high breakdown voltage and low on-resistance. Hence, we have focused on both materials and device development for GaN power devices. Toward the first goal of high-quality GaN epitaxy, we optimized the growth condition for controlled low unintentionally doped (UID) and low impurity drift layer from ammonia molecular beam epitaxy (NH3 MBE). For this, we performed a systematic study of growth rate effects on the drift layer doping for a series of growth rates from 0.37 µm/hr to 1.68 µm/hr in both sapphire and free-standing GaN substrates (Fig. 1). A low background UID doping of ~1015 cm-3 was achieved with a growth rate 1.4 µm/hr on the free-standing GaN substrate. This UID background doping is one of the lowest reported for GaN homoepitaxy [1-3]. The potential of NH3 MBE-growth for low-doped epitaxy is recognized from our work, contributed from the cleaner growth environment of MBE, compared to the conventional metal-organic chemical vapor deposition (MOCVD).The next step of our work involved developing high-performance power devices with these high-quality epitaxies. Our vertical p-n GaN diode consisted of a ~4 µm UID GaN drift layer on ~0.25 µm of n+ GaN ([Si]: 1×1019 cm-3) buffer for the n-type region. The p-type region included a 10 nm p++ GaN cap ([Mg]: 3×1020 cm-3) to support the anode ohmic contact followed by a 0.4 µm p+GaN ([Mg]: 3×1019 cm-3) to form the p-n junction.The sample was fabricated with circular diodes of 80-100 µm diameter Pd/Pt Anode and a backside Ti/ Au Cathode. The field management was achieved by a combination of ~1.4 µm dry etch mesa isolation with a sidewall angle of ~55° and field plate (Fig. 2). For the field-plate dielectric, a stack of atomic layer deposition of Al2O3 (26 nm) and plasma-enhanced chemical vapor deposition of Si3N4 (205 nm) at 300 °C was used. Finally, a Ti/Pt metal stack of 15 µm length was patterned to form the field-plate.Capacitance-Voltage characteristics performed in these p-n diodes showed a doping of ~3×1015 cm-3 in the n- drift layer (Fig. 3a). Secondary ion mass spectrometry (SIMS) detected Si~2×1015 cm-3 and O ~2×1016 cm-3 respectively across the n-layer (Fig. 3b), likely the source of UID doping, accounting for their possible partial ionization. The compensating carbon impurities was less than the SIMS detection limit, certifying the high-quality NH3 MBE-growth. The forward J-V characteristics (Fig. 4) revealed the leakage current below the detection limit (~1.6 pA) for V<2 V. At higher forward biases (V=2.87 V) in the diffusion current region, the ideality factor reaches to a minimum of 1.36. The extracted specific on-resistance (Ron,sp) of 0.28 mΩ-cm2 and the minimum ideality factor of 1.36 are among the best achieved in vertical homoepitaxy GaN p-n diodes [1-3]. The highest breakdown voltage of these diodes were > 1 kV (equipment limit 1 kV) whereas some diodes exhibited breakdown at -890 V (Fig. 5). Silvaco simulation showed a punch-through breakdown of the diodes with peak electric field (EC) >2.6 MV/cm. Remarkably, this breakdown performance with NH3 MBE GaN of only ~4 um channel is comparable with the best available MOCVD GaN p-n diodes with a significantly thicker drift layer of ≥ 8 um (Fig. 6). Our work thus demonstrates the potential of high-performance power devices by NH3 MBE, benefitted from high-quality epitaxy, controlled low doping, and fast growth rates, that will be promising for high-voltage devices.

Impact of growth parameters on the background doping of GaN films grown by ammonia and plasma-assisted molecular beam epitaxy for high-voltage vertical power switches

We report on ammonia and plasma-assisted molecular beam epitaxy (NH3-MBE and PAMBE) grown GaN layers with a low net carrier concentration (Nnet). Growth parameters, such as growth rate, V–III ratio, and plasma power, were investigated on different substrates to study their impact on surface morphology and background doping levels using atomic force microscopy and capacitance–voltage (C–V) measurements, respectively. The elevated growth rates are especially interesting for vertical power switches, requiring very thick drift regions (over 10 μm) with low background concentrations. For our NH3-MBE-grown layers, Nnet shows an almost linear increase with the growth rate. Using a freestanding substrate and at a fast growth rate of 1.4 μm hr−1, a Nnet value as low as 1 × 1015 cm−3 was achieved. For samples grown via PAMBE, the lowest Nnet among samples grown under a Ga adlayer was 2 × 1016 cm−3 for a growth rate of 0.32 μm h−1 on a GaN-on-sapphire template. The results support the use of MBE for growing high-quality GaN material with reasonably fast growth rates maintaining low background doping levels for high-voltage vertical power electronic devices.

Подложки с алмазным теплоотводом для эпитаксиального роста GaN

Silicon wafers with a polycrystalline diamond heat sink were fabricated; silicon and diamond layers were 300 nm and 250 µm thick, respectively. The thermal conductivity of the diamond was 1290 ± 190 W / m • K. Nitride heterostructures with a two-dimensional electron gas on silicon substrates with a polycrystalline diamond heat sink were grown by ammonia molecular beam epitaxy. Carrier mobility in two-dimensional electron gas and sheet resistance were 1400 cm2 /V•s of 300 Ω/□, respectively.

III-nitride blue light-emitting diodes utilizing hybrid tunnel junction with low excess voltage

Tunnel junctions (TJs) offer alternative designs and promise in some cases improved performances for nitride-based light-emitting diode (LEDs) and laser diodes (LDs) and are widely used in academic studies. However, the voltage penalty of the LEDs and LDs, in comparison with standard contact technologies, has been a major concern especially for commercial applications. In this study, we investigated methods to achieve low excess voltage. Using ammonia molecular beam epitaxy (NH3 MBE), GaN TJs were grown on commercial metalorganic chemical vapor deposition (MOCVD) grown blue LED wafers. Atom probe tomography (APT) and secondary ion mass spectrometry (SIMS) indicate 1 min buffered HF (BHF) clean of the regrowth interface reduced Mg and impurity incorporation into the n++ regrown TJ layers. The wafers were processed and measured in parallel to reference wafers using both university processes and industry processes. At 20 A cm−2, TJ LEDs grown with Si δ-doping at the junction interface processed in the university cleanroom had a forward voltage of 3.17 V in comparison to 2.86 V for LEDs processed with a standard indium tin oxide (ITO) contact. Unencapsulated TJ LEDs processed by industrial process without ITO or current blocking layer had about 0.3 V excess voltage compared to reference LEDs. The TJ LEDs also had more uniform light emission profile. The low excess voltage and consistent results acquired in both settings suggest that TJ can be scaled for industrial processes.

Over 1 kV Vertical GaN-on-GaN p-n Diodes With Low On-Resistance Using Ammonia Molecular Beam Epitaxy

Vertical GaN-on-GaN p-n diodes grown by ammonia molecular beam epitaxy (NH <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> MBE) are reported in this letter for prospective high-power application devices. The diodes, consisting of only 4 μm drift layer with low unintentionalbackgrounddoping of ~ 3×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">15</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-3</sup> , showed a maximum breakdown voltage of >1.0 kV and a low differential specific on-resistance of 0.28 mΩ-cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> . Moreover, these diodes exhibited an excellent rectifying behavior with a low minimum ideality factor of 1.36 and a punch-through electric field comparable to the state-of-the-art vertical GaN-on-GaN p-n diodes grown by metalorganic chemical vapor deposition (MOCVD). These results suggest that all-MBE vertical GaN-on-GaN p-n diodes grown by NH <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> MBE can be promising for small-size high-power electronic devices.

Growth of Nitride Heteroepitaxial Transistor Structures: from Epitaxy of Buffer Layers to Surface Passivation

It is demonstrated that it is possible to use the ammonia molecular beam epitaxy for growing structurally perfect high-ohmic GaN layers which allow generating SiN/Al(Ga)N/GaN heterostructures for transistors with a high mobility of electrons. The growth conditions are determined for GaN layers with smooth surface morphology (with a mean-squared deviation of $${\sim}$$ 2 nm) appropriate for creating sharp heteroboundaries. The possibility of improving the crystalline perfection of GaN layer due to the use of buffer high-temperature AlN layer (with the growth temperature above 940 $${}^{\circ}$$ C) is demonstrated. It was shown that in situ surface passivation of Al(Ga)N/GaN heterostructures by the ultrathin SiN layer allows generating normally closed transistors with unprecedented low values of the current collapse ( $${\sim}1\%$$ ).

Theoretical and experimental investigations of vertical hole transport through unipolar AlGaN structures: Impacts of random alloy disorder

We report on the vertical hole transport through unipolar unintentionally doped (UID) and p-type doped AlGaN heterostructures to evaluate the effectiveness of the UID and doped AlGaN as barriers to the hole transport. Band diagram and current density–voltage (J–V) simulations are conducted in one-dimensional and three-dimensional schemes, with the latter including compositional fluctuations within the alloy AlGaN barrier layer. The simulation results using a self-consistent Poisson-drift diffusion scheme, incorporating the Localization Landscape theory, indicate a large asymmetric barrier to the hole transport by UID AlGaN. The asymmetric J–V characteristics are attributed to the asymmetric band diagrams calculated for the unipolar structure. The simulation results are verified by experiments using unipolar vertical hole transport structures enabled by n-to-p tunnel junctions (TJs) grown by ammonia molecular-beam epitaxy. The TJ structures are utilized to minimize the issues with the high spreading resistance of p-regions and to eliminate the need for its dry etching, which normally results in degraded p-contacts. The experimental results show that even a thin UID AlxGa1−xN (x = 14%, 13 nm) introduces an asymmetric barrier to the hole transport; a nearly 100% increase in the voltage drop induced by a thin UID AlGaN at 50 A/cm2 in the reverse direction is observed compared to an only 25% corresponding increase in the forward direction. Furthermore, p-type doping of the AlGaN layer results in a drastic drop in the potential barrier to hole transport in both directions. The results are beneficial for understanding the behavior of various structure designs within optoelectronics and power electronics.

Structural and optical properties of nonpolar m- and a-plane GaN/AlGaN heterostructures for narrow-linewidth mid-infrared intersubband transitions

Mid-infrared intersubband transitions are investigated in nonpolar m-plane and a-plane GaN/AlGaN multi-quantum well heterostructures. Nominally identical heterostructures were grown by ammonia molecular-beam epitaxy on free-standing m-plane and a-plane GaN substrates. A total of 12 well- and barrier-doped samples with intersubband transition energies in the range of 220–320 meV (wavelength range 3.8–5.6 μm) were grown. The intersubband absorption lines of the m-plane samples were 10–40% narrower than those of the a-plane samples, and a very narrow intersubband absorption linewidth of 38 meV (full width at half maximum) at a transition energy of approximately 250 meV (5 μm wavelength) was observed in an m-plane sample. Narrower intersubband absorption linewidths of m-plane samples can be explained by more abrupt heterostructure interfaces revealed by structural characterization, which is attributed to a higher stability of the m-plane compared to the a-plane. No significant difference in the intersubband absorption linewidth was observed between the barrier- and well-doped samples.

Ultraviolet Stimulated Emission in AlGaN Layers Grown on Sapphire Substrates Using Ammonia and Plasma‐Assisted Molecular Beam Epitaxy

Ammonia and plasma‐assisted (PA) molecular beam epitaxy modes are used to grow AlN and AlGaN epitaxial layers on sapphire substrates. It is determined that the increase in the thickness of the AlN buffer layer grown by ammonia molecular beam epitaxy (MBE) from 0.32 to 1.25 μm results in the narrowing of 101 X‐Ray rocking curves (XRCs), whereas no clear effect on the 002 XRC width is observed. It is shown that strong GaN decomposition during growth by ammonia MBE causes AlGaN surface roughening and compositional inhomogeneity, which leads to deterioration of its lasing properties. AlGaN layers grown by ammonia MBE at an optimized temperature demonstrate stimulated emission (SE) which peaks at λ = 330, 323, 303, and 297 nm, with SE threshold values of 0.7, 1.1, 1.4, and 1.4 MW cm−2, respectively. In comparison with these, AlGaN layers grown using PA MBE pulsed modes (migration‐enhanced epitaxy, metal‐modulated epitaxy, and droplet elimination by thermal annealing) show SE with a relatively low threshold (0.8 MW cm−2) at a considerably shorter wavelength of λ = 267 nm.

Evidence for trap-assisted Auger recombination in MBE grown InGaN quantum wells by electron emission spectroscopy

We report on the direct measurement of hot electrons generated in the active region of blue light-emitting diodes grown by ammonia molecular beam epitaxy by electron emission spectroscopy. The external quantum efficiency of these devices is &amp;lt;1% and does not droop; thus, the efficiency losses from the intrinsic, interband, electron–electron–hole, or electron–hole–hole Auger should not be a significant source of hot carriers. The detection of hot electrons in this case suggests that an alternate hot electron generating process is occurring within these devices, likely a trap-assisted Auger recombination process.

Forming the GaN Nanocrystals on the Graphene-Like g-AlN and g-Si3N3 Surface

The formation of GaN nanocrystals on the graphene-like AlN (g-AlN) modification and graphene-like (g-Si3N3) silicon nitride by ammonia molecular beam epitaxy has been investigated. It has been found that the GaN growth on the g-Si3N3 surface leads to the formation of misoriented nanocrystals. During the GaN growth on the g-AlN surface, the epitaxial growth of similarly oriented GaN quantum dots of the graphite-like modification has been observed. The lattice parameters and energy structure of two graphite-like GaN modifications with the alternating AB (graphite structure) and AA+ (hexagonal boron nitride structure) layers have been calculated.

Undoped High-Resistance GaN Buffer Layer for AlGaN/GaN High-Electron-Mobility Transistors

It is shown that intentionally undoped high-resistance GaN buffer layers in AlGaN/GaN heterostructures with high electron mobility for transistors can be formed by ammonia molecular beam epitaxy. The GaN growth conditions have been optimized using calculations of the background impurity and point defect concentrations at different ratios of the gallium and ammonia fluxes.