Thick Aluminum Layer Research Articles

Low-loss and low-temperature Al2O3 thin films for integrated photonics and optical coatings

Amorphous aluminum oxide (Al2O3) is a key material in optical coatings due to its notable properties, including a broad transparency window (ultraviolet to mid-infrared) and excellent durability. Moreover, its higher refractive index contrast relative to silica cladding layers and high solubility of rare-earth ions make it well suited for optical waveguides and the development of various functionalities in integrated photonics. In many coatings and integrated photonics applications, the substrates are temperature and stress sensitive, while relatively thick (∼1 μm) alumina layers are required; thus, it is crucial to fabricate low optical loss alumina thin films at low deposition temperatures, while maintaining high deposition rates. In this study, plasma-assisted reactive magnetron sputtering, operated in an alternating current mode, is investigated as a reliable, straightforward, and wafer-scale compatible technique for the deposition of high optical quality and uniform Al2O3 thin films at low temperature. One-micrometer-thick amorphous Al2O3 planar waveguides, deposited at 150 °C and a rate of 23.3 nm/min, exhibit optical losses below 1 dB/cm at 638 nm and as low as 0.1 dB/cm in the conventional optical communication band.

Development and application of an algorithm to estimate the effective energy of x-rays on conventional mammography

Mammography is a radiation medical exam, which makes detection of mammary microcalcifications possible at an early stage. The dose received by the patient’s breast is known as the average glandular dose, which is considered a quality control indicator. Estimation of this parameter implies knowing the effective energy of the x-ray beam delivered. This is the case when thermoluminescent dosimetry is the method of choice. The algorithm developed to discriminate the x-ray energy the mammography patient has been exposed to while undergoing routine procedures, applies two thermoluminescent dosimeters, one of them filtered by a 1 mm thick aluminum layer. The effective energy of the x-ray beam and the correction factor are obtained by knowing the relation between the filtered and non-filtered dosemeters readout. This algorithm was then used to estimate the average glandular dose following the IAEA TRS 457 protocol. The dose values computed were compared with the international diagnostic reference levels suggested by the technical literature.

Characterizing the response of Timepix solid state detectors to dust impacts

Timepix Solid State Detectors (TSSDs) are used in a range of applications, including high energy particle physics, x-ray imaging spectroscopy, medical imaging, radiation monitors and compact dosimeters. In space sciences, such detectors have been used for characterizing the radiation environments of the Earth and lunar surface. This study is a pilot investigation of the response of TSSDs to high-velocity dust impacts. The setup used for the measurements is a silicon slab with 500μm thickness combined with the Timepix 2 read-out chip with a pixel size of 55×55 μm2. The outer surface of the SSD is coated with a 150 nm thick layer of aluminum to eliminate the sensitivity to light. The dust accelerator facility operated at the University of Colorado is used to expose the TSSD to micron- and sub-micron sized iron particles in a velocity range of 1–10 km/s. A fraction (5%) of the impacting dust particles were detected by the TSSD. The primary mechanism of the detection is through the light generated upon the impact and the charge signal spreads over multiple pixels. The fraction of dust particles kinetic energy that is converted to detectable charge on the TSSD is small, in the range of 10−3−10−6. The largest craters generated by the dust impacts were examined using a scanning electron microscope (SEM). The SEM images confirm that the particles penetrated the aluminum layer and the craters contain iron residue from the dust material. Over the investigated impact parameter range, the TSSD does not suffer a permanent damage from the dust impacts. Due to their small size and relatively low sensitivity to dust impacts, TSSDs could be used as dust detectors only in environments with high dust fluxes (e.g., in cometary trails), or where the precision measurements of the impact location are desired.

Numerical simulation and multi-objective optimization of thin-walled aluminum/carbon fiber reinforced plastic hybrid tubes under axial crushing

Crushing behavior analysis and energy absorption optimization are crucial for lightweight structures in automotive applications. The present paper aims to investigate the crushing behavior of thin-walled aluminum/CFRP hybrid tubes under axial loading using an explicit finite element (FE) simulation. The damage constitutive models of aluminum and CFRP are implemented by coding the user-defined subroutine VUMAT in ABAQUS/Explicit, which includes the damage initiation and evolution laws and element deletion scheme. Parametric studies are conducted to assess the effects of radius and aluminum layer thickness on the crushing performance of hybrid tubes. Additionally, a multi-objective optimization is performed on the Isight platform using a non-dominant sorting genetic algorithm (NSGA-II) and technique for order preference by similarity to ideal solution (TOPSIS) with entropy weight method. The optimization aims to maximize crashworthiness and increase energy absorption capacity, enabling designers to select an optimum size ratio.

Electrocoagulation using aluminum electrodes as a sustainable and economic method for the removal of kinetic hydrate inhibitor (polyvinyl pyrrolidone) from produced wastewaters

Electrocoagulation is a water treatment technology capable to remove a variety of organic pollutants from water. It is advantageous compared to chemical coagulation due to the controlled dissolution of coagulants by regulating the current density and pH. In this work, the removal of kinetic hydrate inhibitor (KHI) (polyvinyl pyrrolidone, PVP) from water by electrocoagulation using Al electrodes was investigated. The effects of several experimental conditions including the nature of the supporting electrolyte, the current density, and the initial pH value on the electrochemical dissolution of aluminum was evaluated. The findings of the experiments revealed that both chemical and electrochemical dissolution play important roles in the generation of hydroxo-aluminum species. Corrosion studies demonstrated that the presence of chloride ions in water promotes aluminum dissolving via pitting corrosion, whereas the presence of phosphate ions inhibits aluminum corrosion by the deposition of a thick passive layer of aluminum hydroxide/phosphate on the metal surface. The theoretical and experimental amounts of aluminum, increase linearly with increasing specific electrical charge for Q< 2.5 Ah/L, which correlates well with Faraday's Law. The removal of KHI from 0.1M NaCl aqueous solutions by electrocoagulation using aluminum electrodes achieved high removal efficiency in terms of total organic carbon (TOC) up to 95%. TOC decay during galvanostatic electrolysis confirmed the removal of KHI molecules by Al-electrocoagulation at different current densities and pH conditions. The primary mechanism involved in eliminating KHI from water by electrocoagulation using Al electrodes includes mainly the adsorption of PVP molecules on the surface of Al(OH)3 flocs and their enmeshment inside the solid coagulants.

An Aluminum-coated sCMOS Sensor for X-Ray Astronomy

In recent years, tremendous progress has been made on scientific Complementary Metal Oxide Semiconductor (sCMOS) sensors, making them a promising device for future space X-ray missions. We have customized a large-format sCMOS sensor, G1516BI, dedicated for X-ray applications. In this work, a 200 nm thick aluminum layer is successfully sputtered on the surface of this sensor. This Al-coated sensor, named EP4K, shows consistent performance with the uncoated version. The readout noise of the EP4K sensor is around 2.5 e− and the dark current is less than 0.01 e− pixel−1 s−1 at −30°C. The maximum frame rate is 20 Hz in the current design. The ratio of single pixel events of the sensor is 45.0%. The energy resolution can reach 153.2 eV at 4.51 keV and 174.2 eV at 5.90 keV at −30°C. The optical transmittance of the aluminum layer is approximately 10−8 to 10−10 for optical lights from 365 to 880 nm, corresponding to an effective aluminum thickness of around 140 to 160 nm. The good X-ray performance and low optical transmittance of this Al-coated sCMOS sensor make it a good choice for space X-ray missions. The Lobster Eye Imager for Astronomy, which has been working in orbit for about one year, is equipped with four EP4K sensors. Furthermore, 48 EP4K sensors are used on the Wide-field X-ray Telescope on the Einstein Probe satellite, which will be launched at the end of 2023.

Studying Molecular Rearrangement of P1 Dye at a Passivating Alumina Surface Using Vibrational Sum-Frequency Generation Spectroscopy: Effect of Atomic-Level Roughness.

The effect of roughness and thickness of alumina layers, mimicking the passivation layer commonly used in dye-sensitized photoelectrodes, on the molecular adsorption of P1 dye, 4-(bi(4-(2,2-dicyano-vinyl)-thiophene-2-yl]-phenyl]-aminobenzoic acid) has been studied using surface-sensitive vibrational sum frequency generation(VSFG) spectroscopy. The VSFG spectra reveal the formation of poorly ordered dye layers on relatively rough surfaces where XPS measures a higher dye loading. Furthermore, these poorly ordered dye molecules are responsible for the generation of trapped electronic states as probed by successive photoluminescence (PL) measurements. Surface sensitive VSFG spectroscopy in combination with XPS and PL measurements provide complementary spectral information on ordering of the adsorbed dyes, their density on the surface and electronic states of the adsorbed monolayer which are prerequisite for improving our understanding of molecularly functionalized photoelectrodes and their further development.

Influence of current density on constant current electric field enhanced aluminum induced crystallization of amorphous silicon thin films

In this study, electric field-enhanced aluminum-induced crystallization (AIC) of amorphous silicon (a-Si) thin films was investigated considering various current densities. Constant electric currents of 4, 5, and 6 A were applied to assess the Joule heating characteristics during specific durations (40, 15.5, and 9 s). The samples were prepared by depositing a 200-nm thick a-Si layer on a glass substrate and sputtering a 300-nm thick aluminum (Al) layer onto the a-Si layer. During the AIC process, layer exchange occured via the diffusion of silicon (Si) into the Al layer. This phenomenon was verified by the in-situ reflectivity, which was in excellent agreement with thin-film optics calculations. During the annealing, processing temperatures were lower than 470 °C, which is less than the Al-Si eutectic temperature of 577 °C. The Raman peak observed near a wavenumber of 519 cm−1 revealed the formation of polycrystalline silicon films through Joule heating processes. Field-effect scanning electron microscopy images were captured and analyzed to investigate the surface morphology of the samples, specifically focusing on grain growth.

Mechanically resilient, alumina-reinforced carbon nanotube arrays for in-plane shock absorption in micromechanical devices

Microelectromechanical systems (MEMS) are of considerable interest due to their compact size and low power consumption when used in modern electronics. MEMS devices intrinsically incorporate three-dimensional (3D) microstructures for their intended operations; however, these microstructures are easily broken by mechanical shocks accompanying high-magnitude transient acceleration, inducing device malfunction. Although various structural designs and materials have been proposed to overcome this limit, developing a shock absorber for easy integration into existing MEMS structures that effectively dissipates impact energy remains challenging. Here, a vertically aligned 3D nanocomposite based on ceramic-reinforced carbon nanotube (CNT) arrays is presented for in-plane shock-absorbing and energy dissipation around MEMS devices. This geometrically aligned composite consists of regionally-selective integrated CNT arrays and a subsequent atomically thick alumina layer coating, which serve as structural and reinforcing materials, respectively. The nanocomposite is integrated with the microstructure through a batch-fabrication process and remarkably improves the in-plane shock reliability of a designed movable structure over a wide acceleration range (0–12,000g). In addition, the enhanced shock reliability through the nanocomposite was experimentally verified through comparison with various control devices.

Investigation of the Influence of Sublayer Thickness on Pairing of Metallic MEMS Shutter Blades

For the 3D self-assembly of microstructures, the net intrinsic stress within a hybrid metal layer stack is utilised to study the dynamics of the pairing of metallic MEMS shutter blades with dimensions of 150 × 400 µm2, representing a highly nonlinear Casimir system. The study focuses on two main geometries: (i) unpaired (freestanding) and (ii) paired metallic Micro-Electro-Mechanical Systems (MEMS) shutter blades. The hybrid metal stack comprises three metal layers that are under intrinsic stress, which enables the curling of the freestanding shutter blades. The top aluminum layer thickness is varied systematically, creating tailored stress in the shutter blades, resulting in the freestanding blades curling differently, as well as geometrical changes in the paired shutter blades. Concerning the thickness variations, a large technological processing window has been identified, during which the pairing of the neighbouring shutter blades occurs (the top aluminum layer thickness ranges between 70 and 88 nm). Circles and ellipses have been fitted to micrographs obtained by scanning electron microscopy (SEM) and Confocal Laser Scanning Microscopy (CLSM). We observed a trend of the reduction of the radius of curvature RoC (ranging between 17 and 79 µm) for the unpaired shutters, and eccentricity (0.36 < ε < 0.67) occurs throughout the system for the paired shutters. Concerning the specific shape of the overlapping region of the two blades of the paired shutters, three pairing scenarios (I, II, and III) have been identified, classified, evaluated, and reported. The overlapping length lo between the paired shutter blades ranges between 31 and 8 µm. These scenarios also reveal nonlinearities in the pairing process.

Designing porous photonic crystals for MIR spectral region—a deeper insight into the anodic alumina layer thickness versus charge density relation

The mid-infrared region (MIR) is crucial for many applications in security and industry, in chemical and biomolecular sensing, since it contains strong characteristic vibrational transitions of many important molecules and gases (e.g. CO2, CH4, CO). Despite its great potential, the optical systems operating in this spectral domain are still under development. The situation is caused mainly by the lack of inexpensive and adequate optical materials which show no absorption in the MIR. In this work, we present an easy and affordable way to develop 1D photonic crystals (PCs) based on porous anodic alumina for MIR region. The porous PCs were produced by the pulse anodization of aluminum using charge-controlled mode. The first order photonic stopbands (λ 1) were located within ca. 3.5–6.5 μm. Annealing of the material at 1100 °C for an hour has allowed to recover the wavelength range from around 5.8 to 7.5 μm owing to the decomposition of the absorption centers (oxalate anions) present in the anodic oxide framework while maintaining the PC structural stability. The spectral position and the shape of the resonances were regulated by the charge passing under high (U H) and low (U L) voltage pulses, porosity of the corresponding d H and d L segments, and dura tion of the process (t tot). The thickness of the d H and d L layers was proportional to the charge passing under respective pulses, with the proportionality coefficient increasing with the applied voltage. Despite the constant charge (2500 mC cm−2) applied during the anodization, the thickness of anodic alumina (d) increased with applied voltage (10–60 V) and anodizing temperature (5 °C–30 °C). This behavior was ascribed to the different kinetics of the anodic alumina formation prompted by the variable electrochemical conditions. The photonic material can be used in portable nondispersive gas sensors as an enhancement layer operating up to around 9 μm.

Hybrid laser processes for thick silver coating fabrication on AlN substrate

Aluminum nitride (AlN) are particularly suitable as integrated circuits (ICs) substrates due to its high thermal conductivity and excellent electricity insulation. However, its poor weldability with metals limits its usage. Recent research on surface metallization of AlN provides possible solutions to tackle this defect. Nevertheless, these solutions show some shortages such as complicated processes or insufficient electrical conductivity. In this paper, we report a method that consists of laser induced surface metallization and laser sintering of silver (Ag) coatings. A nanosecond laser was applied to induce a 10 μm thick aluminum (Al) layer from the AlN substrate. Afterwards, laser sintering of Ag layers was implemented, which could enhance the conductivity and the bonding performance between layers. With optimized laser parameters applied, both the electrical conductivity and the bonding tests demonstrated excellent physical properties. Finally, simulation and EDS analysis illustrated the melting evolution and confirmed a metallurgical combination of Al and Ag, thus enhancing bonding strength. Thanks to the small size of focused laser spot, electrical circuits width could be greatly narrowed if these findings were applied; hence highly dense ICs on AlN substrate become potentially available.

Integration Aspects of Plasmonic TiN-based Nano-Hole-Arrays on Ge Photodetectorsin a 200mm Wafer CMOS Compatible Silicon Technology

During the last decade optical sensor technologies have attracted increased attention for various applications. Plasmon-based optical sensor concepts for the detection of refractive index changes that rely on propagating surface-plasmon polaritons at metal-dielectric interfaces or on localized plasmons in metallic nanostructures prove their potential for these application due to their fast detection speed, high specificity and sensitivities [1, 2]. Combining plasmonic structures directly with optoelectronic devices could enable a high level of integration, however, it represents a significant technological challenge to develop an on-chip solution for these concepts including the integration of sensor and detector components. Previous works demonstrated first approaches mainly for the integration of refractive index sensor components on wafer level [3, 4]. In [5] and [6] a proof-of-concept of a fully integrated on-chip solution with high sensitivities was presented, which can be easily combined with microfluidics [7] for potential applications in biosensing. In this concept, a nanohole array (NHA) was structured in a 100 nm thick aluminum layer on top of a vertical PIN germanium photodetector (GePD) with an intrinsic germanium sheet of 480 nm. This sensor concept relies on extraordinary optical transmission through the NHA [8]: Light transmission is only possible for narrow wavelength ranges determined by the NHA geometry which determine the transmission peaks at the resonance wavelength of the NHA. Thus, the NHA acts as a high quality wavelength filter. Due to the change in the refractive index, a material under test (MUT) contacting directly the surface of the NHA, provokes a shift of the wavelength maximum, which can be detected by measuring the photocurrent spectra of the GePD. While responsivities and sensitivities of (0 V) = 0.075 A/W and = 1200 nm/RIU could be attained in this proof-of-concept device [6, 7], the semiconductor device layers were deposited using molecular beam epitaxy (MBE). Furthermore the vertical PIN GePD was realized by a mesa procedure to enable large areas for top illuminated operations. These techniques are unsuitable for an industrial CMOS fabrication process with high throughput. Therefore, the development of a CMOS compatible technology process with low costs and high yields is an important step towards large-scale fabrication of this sensor concept.In this work we present the progress for the realization of a surface plasmon resonance (SPR) refractive index sensor in a 200 mm wafer Silicon based technology. One main challenge is the fabrication of a large area photodetector for top illuminated sensor devices. We developed a process, which is mainly based on the IHP electronic photonic integrated circuits (ePIC) technology [9]. This ePIC technology enables the production of waveguide coupled lateral PIN GePDs with high bandwidth and high responsivities [10]. However, these PDs are unsuitable for top illuminated applications because of their small germanium areas. Due to certain process conditions with respect to chemical mechanical polishing procedures there are limits for feasible large detector areas. Furthermore, large detector areas for lateral PIN GePDs would result in very low electric fields in the intrinsic zone where carriers are generated by photon absorption. Thus, very high voltages for reversed bias are necessary for sufficient carrier drifts.For the first time we have developed a modern detector design concept which is compatible to the IHP ePIC technology. This concept allows the realization of large area detectors of 1600µm² (40µm x 40µm) with optimized optical responsivities for top illuminated applications. The detector consists of several parallel connected lateral PIN GePDs. We designed different variations and varied Ge width and distance between neighboring GePDs in order to investigate process limits. The p- and n-doped regions were defined by dopant implantation using a photo resist mask. We used a finger-like design as implantation masks to enable one contact area for each p-doped and each n-doped region (Fig. 1). This contacting approach differs from the standard GePD offered in the IHP ePIC technology. We analyzed I-V characteristics in dependence of detector design and contacting scheme (Fig. 2). In addition, process adjustments for the optimization of the germanium quality were investigated to reduce dark currents and to improve optical responsivities (Fig.3).Titanium nitride (TiN) is very promising metallic alloy with respect to thickness homogeneity and low surface roughness. Therefore we used titanium nitride which was deposited by a sputtering process to develop plasmonic active NHA layers. Various process development runs were done to evaluate the NHA performance. Ellipsometry and atomic force microscope measurements were performed to characterize the quality of the TiN layer (Fig.4). Figure 1

Effects of Ni and Co on the Corrosion Resistance of Al-Si-Cu-Zn-Fe Alloys in NaCl Solution

The corrosion behavior of Fe-containing directionally solidified (DS) and centrifugally cast (CC) Al-Si-Cu-Zn alloys with either Co or Ni additions has been investigated. Electrochemical and immersion corrosion methods were used to investigate the corrosion behavior in 0.6 M NaCl after short (1-h) and long (30-day) exposure periods. The employed solidification methods allowed the production of samples with a wide range of secondary dendrite arm spacing (SDAS) while preserving Si and Fe-containing phases. The 0.5 wt.% Ni and Co additions led to the growth of the AlFeSi(Ni) and AlFeSi(Co) phases, but no binary AlNi nor AlCo intermetallic particles have been generated. Potentiodynamic polarization studies at early exposure revealed an increase in the corrosion potential as the Ni was added for either fast or slow solidified samples. The electrochemical impedance spectroscopy at early exposure demonstrated that the Ni-modified alloy, on the other hand, was associated with smaller charge transfer resistances, indicating a reduction in the corrosion resistance after a short elapsed time into the electrolyte. However, the 30-day immersion tests revealed much lower corrosion rate of the Ni-modified alloy than the other alloys, while the corrosion rates of the Co-modified and non-modified alloys were similar. In the Ni-containing alloy, a decreased corrosion rate under a long-term corrosion process was attributed to the formation of a thick and dense alumina layer, effectively protecting the surface under such conditions. This work contributes to better knowledge of the corrosion behavior of Ni- and Co-corrected Al industrial scrap compositions.

Measurements of cyclotron resonance of the interfacial states in strong spin–orbit coupled 2D electron gases proximitized with aluminum

Two dimensional electron gases (2DEGs) in InAs quantum wells proximitized by aluminum are promising platforms for topological qubits based on Majorana zero modes. However, there are still substantial uncertainties associated with the nature of electronic states at the interface of these systems. It is challenging to probe the properties of these hybridized states as they are buried under a relatively thick aluminum layer. In this work, we have investigated a range of InAs/In1−xGaxAs heterostructures with Al overlayers using high precision time-domain THz spectroscopy (TDTS). Despite the thick metallic overlayer, we observe a prominent cyclotron resonance in a magnetic field that can be associated with the response of the interfacial states. Measurements of the THz range complex Faraday rotation allow the extraction of the sign and magnitude of the effective mass, density of charge carriers, and scattering times of the 2DEG despite the close proximity of the aluminum layer. We discuss the extracted band parameters and connect their values to the known physics of these materials.

Experiments to improve the performance of the GTS-LHC ECR ion source

The GTS-LHC 14.5 GHz ECR ion source provides the ion beam, which after acceleration in the ion injector complex, is injected into the LHC, as well as being sent to fixed target experiments at CERN. Two experiments have been performed on the source. The stainless steel plasma chamber has been sputter-coated with a rather thick layer of aluminium on the surface facing the plasma; and the lead micro-oven has been modified to avoid the build-up of lead-oxide on the oven outlet. Details of the changes will be given, and results of beam measurements will be shown, with particular attention on how the stability and oven-refill schedule is impacted by these changes.

Fabrication and characterisation of Frequency Selective Surface (FSS) for Terahertz Sensing Application

Abstract A frequency selective surface (FSS) structure based on a circular slot with 28 to 31 μm was fabricated using Electron Beam Lithography combined with wet etching technique on a 400 μm thick quartz substrate. The circular slot pattern, designed using the CST software, was transferred during the Electron Beam (EBL) exposure with 100 kV voltage acceleration, 2 nA of e-beam current, and line dosage of 1000 μC2. A 0.5 μm thick aluminium layer was deposited on a quartz substrate using the thermal evaporator technique. The aluminium thickness was confirmed by laser microscope and surface profiler measurement. The investigation shows that 20 seconds is the optimal etching time for producing the desired FSS circular slot structure compared to 40 and 60 seconds. The fabricated samples surface metrology was examined using an optical microscope, Field Emission Scanning Electron Microscope (FESEM) and Atomic Force Microscope (AFM). The material compositions of the samples were confirmed by using the Energy Dispersive X-ray (EDX) measurement. Results show that, on average, there are ±1.5 μm of tolerance produced for fabricated sample size on the circular slot pattern compared to the CST simulation results. FSS performance slightly shifted in the frequency from actual 1.80 THz to 1.79 THz, whereas the transmission magnitude has increased by 0.03 from 0.91 to 0.94.

Design and discrete optimization of hybrid aluminum/composite drive shafts for automotive industry

Fiber reinforced composites have been widely used in automotive industry since they offer significant weight reduction, low manufacturing and tooling cost, and better integration of parts compared to metal counterparts. In this study, design optimization of a hybrid aluminum/composite drive shaft subjected to torsion was carried out using ANSYS Workbench with ACP module. The numerical validation of finite element (FE) model was carried out by means of theoretical, experimental, and numerical studies in the literature. The ply material, lay-up orientations, and thickness of aluminum layer were considered as design variables. The geometric parameters in design were the length and inner diameter of the drive shaft. Two important design constraints, the minimum first mode natural frequency and design torque, were considered to satisfy the design requirements of a rear-wheel drive shaft used in automotive industry. The optimum design variables were determined by using screening method. The optimum design parameters (length, inner diameter, ply angle, and material) were presented in tabular form. Compared to nonoptimized scenario, the optimized solution reduced the cost of the hybrid composite drive shaft about 30% without ignoring the design requirements.

Channel deformation of bilayer material using tool rollers: part II-effect of layer thickness on springback

ABSTRACT In this second part of the two-part paper, the layer thickness in the top-layer aluminium alloy and bottom-layer aluminium alloy samples were changed to see the effect if layer thickness has any influence on the deformation and springback behaviour. Four thickness were considered 0.2, 0.4, 0.6, and 0.8 mm for aluminium layer either as a top layer or the bottom layer. To match the bilayer thickness of 1 mm, the remaining thickness was given to the carbon fibre composite layer. Again the 10-process variation were simulated for each layer thickness of aluminium material and results were presented. As found in the first part of the paper the fixed roller and no roller process provides the highest springback in all considered cases. Three distinct regions in the springback profiles were observed with the top-layer or the bottom-layer aluminium material. If the aluminium material layer is towards the punch side and punch rollers are fixed and if the aluminium alloy material is towards the die side and die rollers are fixed the springback profiles are in between the highest and lowest springback cases. It was also noted that the springback increases with increase in the aluminium layer thickness.

Experimental and analytical assessment of the hypervelocity impact damage of GLAss fiber REinforced aluminum

This article addresses the response of GLAss fiber REinforced aluminum to hypervelocity impacts of micrometeoroid analogs at impact velocities of 7 km/s and beyond. In relation, the damage modes of different GLAss fiber REinforced aluminum configurations have been exemplified. The GLAss fiber REinforced aluminum configurations comprised six to twelve variably thick aluminum layers and up to four plies of glass fiber reinforced epoxy per composite laminate. Hypervelocity impact experiments have been conducted with the help of a two-stage light-gas gun, wherein aluminum- and stainless steel projectiles were launched at velocities up to 7.15 km/s. Visual inspection of the damage area suggested the dissipation of impact energy in elastic-plastic deformation, petalling, delamination, debonding, tensile failure of fibers, and pyrolysis of epoxy. A prevailing damage mode was not apparent albeit. The quasi-isotropic ply orientation of S2-glass/FM94-epoxy laminates promoted the interference of shock- and rarefaction waves and suppressed the damage area of GLAss fiber REinforced aluminum. To discriminate between the impact performance of different GLAss fiber REinforced aluminum configurations, the energy dissipated in different damage modes of GLAss fiber REinforced aluminum has been assessed quantitatively. In terms of normalized energy, the cross-ply GLAss fiber REinforced aluminum dissipated higher energy in petal formation than in other primary damage modes. The normalized petalling energy was found to decline with the increase of impact energy. The outcomes of this study will help to optimize the GLAss fiber REinforced aluminum laminate, which will be employed as a bumper shield to prevent the fatal damage and the unzipping of a spacecraft pressure bulkhead.