AlGaN Barrier Research Articles

K/Ka‐Band–GaN–High‐Electron‐Mobility Transistors Technology with 700 mS mm−1 Extrinsic Transconductance

In this study, the impacts of fabrication technology and epitaxial layer design on the transconductance (gm) of radio frequency AlGaN/GaN high‐electron‐mobility transistors (HEMTs) are examined. Optimization of the SiNx passivation and AlGaN barrier design of 150 nm gate HEMTs enhances the extrinsic (at Vds = 10 V) and intrinsic (at Vds = 15 V) transconductance from ≈0.47/0.65 to ≈0.62/1.1 S mm−1. Notably, an extrinsic gm of 0.70 S mm−1 at Vds = 5 V is achieved, setting a new benchmark for the extrinsic transconductance of AlGaN/GaN HEMTs designed for the K/Ka frequency range with a breakdown voltage exceeding 100 V.

Dual-gate AlGaN channel HEMTs: advancements in E-mode performance with N-shaped graded composite barriers

Abstract This work evaluates the performance of dual gate AlGaN channel HEMTs on SiC substrate. The study analyzes two HEMT structures that differ only in barrier design, one design consists of fixed composite barriers (FCB-HEMT) i.e. there is fixed Aluminum composition x = 0.48 in the first Al x Ga1−x N barrier and x = 0.42 in the second Al x Ga1−xN barrier while the other design comprises N-shaped graded composite barriers (NGCB-HEMT) i.e. the Aluminum content varies gradually from 0.4 to 0.48 in the first AlGaN barrier and from 0.34 to 0.42 in the second AlGaN barrier. The paper concentrates on energy band diagrams, electron concentration profile, electric field distribution, drain and transfer characteristics, and the effects of high temperature on drain characteristics and mobility of the NGCB-HEMT. It has been reported that at zero gate bias, the FCB-HEMT has a drain current density of 0.137 A mm−1 while it decreases to 0.0058 A mm−1 in the case of NGCB-HEMT, thus presenting a novel approach towards enhancement-mode AlGaN HEMTs. Hence, grading can be optimized in the composite barriers to achieve enhancement mode operation of AlGaN channel HEMTs. Furthermore, the study reveals that the critical electric field of FCB-HEMT is 6.9975 M V cm−1, while that of NGCB-HEMT is 5.3124 M V cm−1, demonstrating their usefulness in electronic devices that operate at high voltages and harsh temperatures. Moreover, at higher temperatures, the phenomenon of optical phonon scattering leads to decreased mobilities, which in turn causes low drain currents relative to the drain voltage.

Threshold Voltage Recovery Time Measurement Technique Post VTH Instability in Normally-Off p-Gate GaN High Electron Mobility Transistors

In this study, we propose a simple measurement technique to quantitatively measure the time taken by threshold voltage of normally-off p-GaN AlGaN/GaN HEMTs to recover from a nominal operational gate stress-induced instability. The proposed technique eliminates the requirement to perform a full transfer characteristic sweep post-stress, thereby eliminating the measurement-induced instability effect, often colluding precise recovery time measurement. The rate of recovery and extracted recovery times hold significance in empirically correlating the location of traps in the p-GaN or AlGaN barrier region causing VTH instability. The gate of the HEMT is stressed at nominal operational drive voltages 1.5 V, 2 V, and 4 V for various time intervals from 500 μs to 100 s, and the time taken for the drain current to recover to prestress levels measured at near-threshold voltage (~1.1 VTH) is measured as the threshold voltage recovery time. With increasing gate stress voltages, 2DEG gets trapped at relatively deeper trap energy levels at the AlGaN/GaN interface requiring more emission time during the process of recovery, mandating larger recovery times. At higher stress voltage of 4 V, the Schottky gate leakage current is high enough enabling injected holes to cross the AlGaN barrier and counter-compensate for the deeply trapped 2DEG, requiring relatively the same recovery times as lower stress voltages where the gate leakage is negligibly small. With increasing stress time, the amount of 2DEG trapped increases, requiring more recovery time to de-trap and beyond a certain time, saturation of the trap density occurs causing the recovery time to plateau.

Novel 2D/3D Heterojunction for UV Light‐Emitting Diodes Using Hexagonal Boron Nitride as Hole Injection Layer

The AlGaN materials system has been extensively studied in order to improve the efficiency of UV‐B and UV‐C light‐emitting diodes (LEDs). While progress has been made, significant challenges remain at shorter wavelengths. Most notably, increased Al composition for shorter‐wavelength operation results in increased activation energy of Mg dopants, resulting in low p‐doping. Although p‐doped h‐BN, with a bandgap of 5.9 eV, has been proposed as a potential replacement of p‐doped AlGaN, there have not been demonstrations of LEDs fabricated from p‐doped h‐BN/AlGaN heterostructures. Such unique heterostructures combine 2D p‐doped h‐BN materials with 3D AlGaN materials. Herein, fabrication and characterization of p‐doped h‐BN/AlGaN multiple quantum wells (MQWs)/n‐AlGaN LEDs, demonstrating emission of light at 290 nm corresponding to the AlGaN MQWs, with weaker emission at 262 nm corresponding to the AlGaN barrier, are reported. These results conclusively show hole injection through p‐doped h‐BN into AlGaN and provide a proof of concept that p‐doped h‐BN can be an alternative hole injection layer for UV LEDs.

The Impact of Gate Annealing on Leakage Current and Radio Frequency Efficiency in AlGaN/GaN High-Electron-Mobility Transistors

Gallium Nitride (GaN) high-electron mobility transistors (HEMTs) are highly promising for high-frequency and high-power applications due to their superior properties, such as a wide energy bandgap and high carrier density. The performance of GaN HEMTs is significantly influenced by the interfacial states of the AlGaN barrier, and gate annealing has emerged as a key process for reducing leakage currents and enhancing DC/RF characteristics. This research investigates the impact of gate annealing on AlGaN/GaN HEMTs, focusing on two main aspects: leakage current reduction and improvements in DC and RF efficiency. Through comprehensive electrical analysis, including DC and RF measurements, the effects of gate annealing were experimentally evaluated. The results show a significant reduction in gate leakage current and noticeable improvements in DC/RF performance for the devices that underwent gate annealing. The study confirms that the annealing process can effectively enhance device performance by modifying the material properties at the gate interface.

LG = 50 nm T-gated and Fe-doped double quantum well GaN‒HEMT on SiC wafer with graded AlGaN barrier for future power electronics applications

High-performance LG = 50 nm graded double-channel (GDC)-HEMT featuring AlN top barrier, recessed T-gate and graded-AlGaN bottom barrier is designed and investigated. Two quantum wells are formed in the AlN-GaN-graded AlGaN-GaN multilayer structure developed on a SiC substrate and the clear double hump feature of the transconductance (GM), cut-off frequency (fT), and capacitance plots clearly illustrates the double-channel (DC) behavior. The investigations carried out to explore the impact of barrier thickness (both AlN & graded-AlGaN) revealed superior performance with the GM showing two peaks at 181.5 & 488.1 mS/mm, the peak-drive-current (ID_peak) with VGS biased at 3 V is 1.81 A/mm, maximum saturation drain current of 3.08 A/mm (VGS = 3V), and the fT derived from the left- and right-hump are 263.7 GHz & 354.2 GHz, respectively, when both barriers are 6 nm thin, attributable to enhanced 2DEG density due to the coordination of channels because of proximity and lower leakage. It has been noticed that when the bottom barrier is thick, the DC behaviour is less obvious due to insufficient gate access to the lower channel. We investigated the impact of varying the Al % in AlGaN top barrier on the DC/RF performance of GDC-HEMTs, demonstrating enhanced performance with increased Al content, particularly for Al0.35Ga0.65N. By using various metals, this study also investigates how gate engineering affects the electrical characteristics of the GDC-HEMT. The lower ϕm (work function) of the Al-gate led to better DC/RF performance. When the Schottky barrier rises as a result of the conduction band edge being elevated, the performance reduces, and the threshold voltage (Vth) increases. Since it is essential to comprehend the role that source resistance (Rs) & drain resistance (Rd) play in RF design, we have also conducted simulations by varying the source-gate gap (LGS) & drain-gate gap (LGD). Due to low Rs & Rd, it was determined that the GDC-HEMT performed better at the smallest LGS & LGD. The extraordinary performance strongly highlights the immense potential and applicability of the GDC-HEMTs for future broadband power amplifiers.

Development of UV light-emitting diodes based AlGaN/GaN heterojunction utilizing thermal oxidation annealing

Ultraviolet (UV) irradiation has a significant impact on enhancing the performance of sensors. Currently, there is still an urgent need for devices that are simple and easy to fabricate. In this work, a cost-effective and convenient method was employed to fabricate a UV light emitting diode. A four-inch silicon based AlGaN/GaN heterojunction substrate was used. The Ni/Au (20/20 nm) layer was deposited on the AlGaN barrier layer, followed by thermal oxidation to prepare the UV diode. The diode annealed in oxygen can emit UV light at a wavelength of 365 nm and is visible, and no light is emitted from the device in nitrogen annealing. The I–V and C–V characteristics of the device are tested to explore the mechanism. Transmission electron microscopy and technology computer aided design simulation methods were used to analyze the device luminescence mechanism.

On the coupled effect of a MIS-based anode and AlGaN-polarized super-junction to reduce the local electric field for AlGaN/GaN Schottky barrier diodes

This work employs advanced physical models with the help of technology computer-aided design tools to systematically design and investigate AlGaN/GaN Schottky barrier diodes (SBDs), focusing on enhancing forward conduction and reverse blocking characteristics. A recessed metal/insulator/III-nitride (MIS) anode is demonstrated to manage electric field distribution. The incorporation of a 1 nm thick Al2O3 layer enables a reduced leakage current and a significant increase in breakdown voltage (BV). Subsequently, tailored field plates (FPs) further improve the BV of the MIS SBD to ∼1650 V but strong electric field magnitude will be found at the edge of the FP. Hence, a MIS SBD with a graded AlGaN barrier layer (MIS-GA SBD) is designed, featuring a gradient decrease in Al content along the [0001] direction. The generation of negative polarization charges within the barrier functions as a super-junction, significantly homogenizing the electric field. As a result, the MIS-GA SBD achieves a remarkable BV exceeding 3500 V, highlighting its strong potential for high-voltage power electronic applications.

Charge trapping gate stack enabled non-recessed normally off AlGaN/GaN HEMT with high threshold voltage stability

This paper reports a non-recessed normally off AlGaN/GaN high-electron-mobility transistor (HEMT) with a charge trapping gate dielectric stack. The charge trapping gate dielectric stack featuring a low density of fixed positive charges consists of an O3-based Al2O3 tunneling layer and an O3-based HfO2 blocking layer, both deposited via atomic layer deposition. For HEMT with a 15 nm AlGaN barrier layer, a threshold voltage of 2.57 V and an on-resistance of 8.50 Ω × mm are achieved. For positive bias temperature instability (PBTI) testing, the electric field provided by the 15 nm AlGaN layer serves as a barrier to channel carriers, significantly enhancing the PBTI test stability. The optimized gate dielectric stack enables the fabrication of the non-recessed normally off metal–insulator–semiconductor-HEMT with enhanced threshold voltage (Vth) stability.

Enhanced device performance of GaN high electron mobility transistors with in situ crystalline SiN cap layer

In this paper, a ∼2 nm in situ SiN cap layer on AlGaN barrier layer is grown, which is revealed to be crystalline using high-resolution cross-sectional transmission electron microscopy. Benefitting from superior interface quality of epitaxial crystalline SiN/AlGaN interface, the gate diodes with in situ SiN cap layer feature lower interface trap state density than that with GaN cap layer. By comparing the GaN high electron mobility transistors (HEMTs) with the conventional GaN cap layer, the GaN HEMTs with in situ SiN cap layer exhibit improved device performance, showing higher electron mobility, higher drain current, larger on/off current ratio, and higher transconductance. For breakdown characteristics, the devices with in situ crystalline SiN cap layer show prominent advantages over the GaN cap layer with a 30% breakdown voltage increase to 810 V.

Capacitance reduction in AlGaN/GaN heterojunction diodes through thermally oxidized NiO anode

In this study, a thin barrier AlGaN/GaN heterojunction diode with a NiO anode is proposed. NiO as an anode combined with a 5 nm AlGaN barrier layer can significantly deplete two-dimensional electron gas in the anode region of the device. Combined with the etching-free technology, the damage caused by etching the AlGaN barrier layer is successfully avoided. The capacitance of the device was reduced from 28 pF mm−1 (Schottky) to 966 fF/mm (NiO) which reduced 97%. At the same time the NiO anode devices with a reverse current leakage of ~10−8 A/mm@−100V achieved a high current ON/OFF ratio of ~10-8. NiO not only reduces the capacitance and leakage of the device but also enhances its anti-collapse ability. Without using the structure of field plates, the breakdown voltage of the device was also increased compared with the Schottky diode.

GaN Surface Passivation by MoS2 Coating.

In this study, we investigate the impact of two-dimensional MoS2 coating on the optical properties of surface GaN/AlGaN quantum wells (QWs). A strong enhancement in GaN QW light emission is observed with monolayer-MoS2 coating, yielding luminescence intensity comparable to that from a QW capped by an AlGaN barrier. Our results demonstrate that MoS2, despite its quite different nature from III-nitride semiconductors, acts as an effective barrier for surface GaN QWs and suppresses spatially localized intrinsic surface states. This finding provides novel pathways for efficient III-nitride surface passivation.

Enhancement of Sensing Performance of GaN-Based MOS-HEMT Biosensors by Graded AlGaN Barrier

Enhancement of Sensing Performance of GaN-Based MOS-HEMT Biosensors by Graded AlGaN Barrier

Effect of temperature on the stability and performance of III-nitride HEMT magnetic field sensors

The study aimed to investigate the underlying physics limiting the temperature stability and performance of non-surface passivated Al0.34Ga0.66N/GaN Hall effect sensors, including contacts, under atmospheric conditions. The results obtained from analyzing the microstructural evolution in the Al0.34Ga0.66N/GaN Hall sensor heterostructure were found to correlate with the electrical performance of the Hall effect sensor. High-resolution x-ray photoelectron spectroscopy studies revealed the signature of surface oxidation in the GaN cap layer, as well as a slight out-diffusion of “Al” from the AlGaN barrier layer. To prevent the formation of a bumpy surface morphology at the Ohmic contact, we investigated the impact of “Pt” top Ohmic contacts. The application of a top “Pt” contact stack resulted in a smooth Ohmic contact surface and provided evidence that the bumpy surface morphology in Au-based Ohmic contacts is due to the formation of an Al-Au viscous alloy during rapid thermal annealing. In the early stages of thermal aging, the small drop in contact resistivity stabilized with subsequent thermal aging past the initial 550 h at 200 °C. The outcome is that the Al0.34Ga0.66N/GaN Hall effect sensors, even without surface passivation, exhibited a stable response to applied magnetic fields with no sign of significant degradation after 2800 h of thermal aging at 200 °C under atmospheric conditions. This observed stability in the Hall sensor without surface passivation can be attributed to a self-imposed surface oxidation of the cap layer during the early stages of aging, which serves as a protective layer for the device during subsequent extended periods of thermal aging at 200 °C.

Effect of tensile and compressive strain on the gate leakage current and inverse piezoelectric effect in AlGaN/GaN HEMT devices

The influence of external strain on the gate leakage current of AlGaN/GaN high-electron-mobility transistors was studied. The magnitude of the leakage current increased by 39% under 0.1% tensile strain but decreased by 23% under −0.1% compressive strain. The leakage current obeyed the Poole–Frenkel conduction mechanism, demonstrating a decrease/increase in the barrier height for electron emission from the trap state into the continuum dislocation state. Furthermore, the magnitude of critical reverse stressing voltage for the onset of degradation induced by the inverse piezoelectric effect became lower/higher under tensile/compressive strain compared with that of the initial state, which was attributed to the modification of the total stress in the film. In addition, using the transient current method, it was established that the detrapping time constant for the traps in the AlGaN barrier increased as a result of the tensile strain, which is ascribed to movement of the dislocation level away from the conduction band.

A Novel high-voltage DMG Fe-doped AlGaN/AlN/GaN HEMTs with sheet charge density model

In this work, two-dimensional electron gas of the dual material gate Fe doped AlGaN/AlN/GaN High Electron Mobility Transistors (HEMTs) device, sheet charge density model is demonstrated. The model is constructed by considering the electron charge in the barrier layer and the quasi triangular quantum well. This sheet charge density is calculated by Fermi-Dirac statistics by the formation of various sub energy bands and it is valid for all bias voltages. Higher carrier densities are produced and the introduction of the Fe-doped AlN layer reduces the electrons penetration to pass through the AlGaN barrier layer. The model's transcoductance variation is basically constant over an extensive variety of gate source voltages, thereby rendering it perfect regarding high-performance amplifications. The developed analytical model is demonstrated and the simulation results are validated with TCAD simulation. A good agreement is achieved with both analytical and simulation results for all of the voltages employed and device geometries.

Metal‐Organic Chemical Vapor Deposition Regrowth of Highly Doped n+ (In)GaN Source/Drain Layers for Radio Frequency Transistors

Herein, epitaxially regrown n+ (In)GaN source/drain layers for radio frequency high electron mobility transistors, addressing material and electrical characterization, are reported. A range of n+ GaN and n+ InGaN layers with indium 4–12 at% and silicon 0–5.1 × 1020 cm−3 are evaluated. The active carrier concentration in n+ InGaN exceeds 2 × 1020 cm−3. The layers exhibit so‐called V‐defects, observed by atomic force microscope and transmission electron microscope (TEM), which are associated with local composition changes. In addition to the high Si doping levels, nitrogen vacancies are also considered to contribute toward their net carrier concentration. Due to its relevance for device processing, selectivity analysis is performed, and the optimal process conditions for selective regrowth are identified. Regrowth under high temperature (800 °C) is found to be conducive to improved selectivity. However, a high thermal budget negatively impacts the overall regrowth process, as reported here for In0.17Al0.83N and Al0.26Ga0.74N barriers: whereas the InAlN barrier suffers from intermixing, the AlGaN barrier demonstrates high‐temperature stability. The impact of intermixing is studied from complementary TEM and DC electrical measurements. A low overall contact resistance of 75 Ω μm is obtained with the regrown n+ InGaN layers.

Effect of lateral inhomogeneous AlGaN barrier layer on electronic properties of GaN HEMTs

In this study, an AlGaN/GaN high electron mobility transistor with lateral inhomogeneous AlGaN barrier layer (LI-AlGaN HEMT) is proposed and studied systematically. The LI-AlGaN HEMT comprises three AlGaN regions with varying Al content, connected to the source, gate, and drain, respectively. With the increase of Al content in each region, the saturation current of the LI-AlGaN HEMT increases gradually, while the on-resistance (Ron) and breakdown voltage (BV) decrease. The threshold voltage (Vth) of the LI-AlGaN HEMT depends only on the Al content of AlGaN beneath the gate. By introducing the source field plate (FP), the calculated output current of the conventional FP-HEMT is consistent with the experimental data. After optimizing Al content, the LI-AlGaN FP-HEMT has the same Vth compared with conventional FP-HEMT. However, the saturation current is increased by approximately 20 % and the Ron is decreased by approximately 30 %. Additionally, the BV is increased to 1008 V. So the optimized lateral inhomogeneous AlGaN HEMT has better DC characteristics and is suitable for high power GaN device applications.

Impact of composition and thickness of step-graded AlGaN barrier in AlGaN/GaN heterostructures

We propose an optimization method to change the Al component and the thickness of step-graded AlGaN barrier to achieve better electrical performance of the device. Based on the polarization effect, we find that a second potential well occurs while increasing the Al fraction and thickness of the upper AlGaN layer, which contributes to better drain current performance in the simulations. The wafers with different AlGaN barriers were grown to compare their surface morphology and electrical properties. The surface roughness of the wafer is related to the lattice constant of the upper AlGaN layer. According to the Hall and TLM measurements, the electron sheet density and electron mobility of the 20 nm-Al0.35Ga0.65N/10 nm-Al0.25Ga0.75N barrier sample are 1593 cm2/Vs and 1.17 × 1013 cm−2 respectively, resulting in a high spacing current of 61.45 mA. Moreover, the maximum drain current density of this barrier device is 589.02 mA/mm under the I–V characteristics, 1.37 times as much as that of the 20 nm-Al0.25Ga0.75N barrier. The higher gate barrier height of Al0.35Ga0.65N reduces the gate leakage current.

Exploring the impact of AlGaN barrier thickness and temperature on normally-on GaN HEMT performance

We study varying barrier thicknesses in GaN/AlGaN HEMTs as well as the effect of temperature fluctuation on device functionality theoretically. Structures A, B, C, D, and E are designed each with barrier thickness 16 nm, 19 nm, 22 nm, 25 nm, and 28 nm respectively. The impact of barrier thickness on the surface barrier height, strain relaxation and 2DEG concentration is explained including GaN HEMT’s drain and transfer properties. At elevated temperatures, the polar-optical phonon dispersion is the predominant process. Yet, at lower temperatures, the interface-roughness (IFR) and alloy disorder dispersion both satisfactorily account for the calculated mobilities.