Ag Nanoparticle Ink Research Articles

Conductive Inks with Chemically Sintered Silver Nanoparticles at Room Temperature for Printable, Flexible Electronic Applications

Conductive inks composed of chemically sintered silver (Ag) nanoparticles were prepared. The enlargement of particle size was accompanied by the increase in conductivity of the Ag nanoparticle ink. The resistance of the as-prepared and sintered Ag nanoparticles printed on different substrates was measured, and results showed that the formulated conductive ink works best on glossy paper. This is due to the compatibility of the conductive ink with the porosity and surface roughness of the glossy paper. The conductive ink formulation was also used as printer ink, and results showed a decrease in resistance as the printing pass was increased.

Physical Characteristics of Sintered Silver Nanoparticle Inks with Different Sizes during Furnace Sintering.

The influence of nanoparticle (NP) size on the physical characteristics of sintered silver NP ink was studied using four different types of inks. The Ag NP inks were spin-coated on glass substrates with an average thickness of 300 nm. Each sample was sintered for 30 min, with temperatures from 50 °C to 400 °C by an interval of 50 °C. After sintering, the specific resistance of each case was obtained using the resistance and surface profile measurements. The minimum specific resistance obtained by the experiment was 2.6 μΩ·cm in the case in which 50 nm-sized Ag NP ink was sintered at 350 °C. The transformed surface morphology and grain size of each case were observed using scanning electron microscopy and atomic force microscopy. The results of this study can be a reference for future manufacturers in selecting the Ag NP size and the sintering temperature.

Graphene-based flexible temperature/pressure dual-mode sensor as a finger sleeve for robotic arms

The design of sensors with multiple sensing functions has become a new challenge to meet the measurement of multiple stimulus signals in people's productive lives. In this article, a sandwich type dual-mode flexible sensor is designed to achieve simultaneous detection of pressure and temperature by constructing different sensing model structures. The dual-mode flexible sensor essentially comprises graphene, melamine sponge and Ag nanoparticle ink. Graphene is coated on the melamine sponge to form a 3D conductive sponge using the dip coating method, while Ag nanoparticle ink is printed on PET to form a serpentine electrode through inkjet printing technology. The sensor has high sensitivity (1.937 × 10−4 Pa−1, R2 = 0.953), a wide operating range (from 0 to 40 kPa), speedy response time (248 ms) and remarkable stability in pressure measurement. It also shows high linearity (TCR = 1.035 × 10−3 °C−1, R2 = 0.987) from 10 to 60 °C and is pressure insensitive in temperature measurement. Experimental results show that the different sensing mechanisms and structural configurations allow the sensors to detect pressure and temperature signals independently or simultaneously without signal coupling. The fabricated sensor has applications in health monitoring, rehabilitation therapy, human-machine interaction and intelligent prosthetics.

Inkjet‐Printed Flexible Spin Seebeck Thermopile Device for Low‐Cost Spintronics Device Fabrication

Spin‐momentum‐mediated heat–charge conversion technologies for developing thin thermoelectric generators and heat flow sensors have been extensively studied. The thermoelectric generation (TEG) based on the spin Seebeck (SSE) effect is a promising technology. In this study, a flexible SSE thermopile device is fabricated using inkjet printing with Fe3O4 and Ag nanoparticle (NP) ink. A square Fe3O4 NP and a wire‐shaped Ag NP layer are used as the first and second layers, respectively. These layers are overlaid using inkjet printing twice. To obtain the SSE voltage (VSSE), a thin Pt film is deposited on a printed thermopile device. SSE generators consisting of a Pt thin film/Fe3O4 NP layer are connected through a Ag NP wire to form a thermopile structure. The saturated VSSE of the SSE thermopile device increases with the number of SSE generators. In addition, the SSE‐TEG of an SSE thermopile device is observed using a heat source with a curved surface. In these results, it is indicated that the inkjet‐printing fabrication method holds great potential in both the SSE thermopile devices and the flexible spintronic devices because it is a simple and fast process that does not require lithography.

Simulation of two nanoparticle melting to understand the conductivity drop of 3D-printed silver nanowires

The future flexible sensor technology will require low-temperature, fast processing 3D printing techniques that will rely heavily on the quality of nanoparticle (NP) Ink. Electrical conductivity has been found to decrease in majority of the 3D printed electronic wires. Herein we report a fundamental understanding in drop of electrical conductivity in processed silver (Ag) line wire, generally found in Ag-nanoparticle Ink, using large-scale atomistic molecular dynamics (MD) simulations of sintering of five different sizes of Ag NPs. To preserve the high conductivity of pure silver wires, the integrity of the pristine face-centered cubic (FCC) crystalline structure must be retained in the processed line wires. Simulations show that the pristine Ag FCC structures of the nanoparticles are not recovered after melting and resolidification, instead, the resolidified material is paracrystaline. The breakdown of pristine FCC structures might be the cause of the drop in conductivity of processed Ag wires. Simulation results suggest that the intermediate size nanoparticles retain highest percentage of the pristine silver face-centered cubic (FCC) structure after pulse treatments. Our results show that the most promising Ag-Ink should contain smaller to medium size silver NPs that can retain FCC structure after 3D printing of the Ag-Ink.

Fine conductive line printing of high viscosity CuO ink using near field electrospinning (NFES)

Modern printed electronics applications require patterning of fine conductive lines of sufficient thickness. However, the two requirements for pattern width and thickness are a trade-off. To print fine pattern at a micrometer size, the nozzle diameter must be approximately the size of the pattern width, so only low-viscosity inks are used. As a result, the pattern is likely to be very thin and multiple overlapping printing is required for sufficient conductance. In order to use high viscosity ink for fine patterning, near field electrospinning (NFES) is attracting attention because it can print very thin and thick patterns using large nozzles (high-viscosity ink). Until now, silver paste ink has been used for microconductive patterning using electrospinning. However, Ag nanoparticle (NP) inks are expensive. In this study, we report the use of a relatively inexpensive CuO NP ink for electrospinning-based printing. For implementation, the material preparation, printing and post-processing process are discussed. For post-processing, a continuous wave (CW) green laser with a 532 nm wavelength was used to reduce the CuO to Cu and sinter the nanoparticles. After sintering, the 50 μm width and 1.48 μm thick Cu conductive line exhibited a resistivity of 5.46 μΩ·cm, which is 3.25 times of the bulk resistivity of Cu.

Voidless metal lines sintered with intense pulsed light and their applications as transparent metal-mesh electrodes

An optimal metal ink that can be sintered without void generation by intense pulsed light (IPL) was systematically formulated. This ink is a hybrid ink in which silver (Ag) nanoparticle ink and copper (Cu) precursor ink are mixed in an optimal weight ratio, and the reduced Cu fills the space between Ag nanoparticles during the sintering process. The optimization process of the ink encompasses the shape and size of nanoparticles, the type of solvent, and the mixing ratio of the Cu precursor ink. This optimized ink was filled in the engraved trenches and IPL-sintered to fabricate flexible transparent metal-mesh electrodes. If there are voids in the metal lines after IPL sintering, the metal lines may shrink under condition of high temperature and high humidity for a long time, which may deteriorate the stability of the metal electrode. It was confirmed that the hybrid ink optimized in this study hardly shrinks due to no voids inside the metal lines after IPL sintering and has excellent environmental and mechanical stability. The metal-mesh electrode produced using this ink showed superior properties compared to other competing transparent electrodes such as indium-tin oxide or Ag nanowires when used for transparent heaters and electromagnetic shielding applications.

Inkjet Printing of High Aspect Ratio Silver Lines via Laser-Induced Selective Surface Wetting Technique

The field of printed electronics for highly integrated circuits and energy devices demands very fine and highly conductive electric interconnections. In this study, conductive lines having a high cross-sectional aspect ratio were printed via the inkjet printing of Ag nanoparticle inks assisted by a laser-induced selective surface wetting technique: a hydrophobic layer of self-assembled monolayer-treated ZnO nanorods was coated on a glass substrate and selectively ablated by a laser to form micro-channels for the inkjet, whose surface energy changed from 36.3 mJ/m2 to 51.5 mJ/m2 before and after the laser irradiation. With the varying width of the laser-ablated channels and pitch of jetted ink drops, the 3D shapes of the printed silver lines were measured to investigate their effects on the widths, heights, and uniformities of the printed patterns. The results showed that the present technique realized a uniform line of 35 μm width and 0.46 μm average thickness, having an aspect ratio of 0.013, which is 7.6 times higher than that printed on bare glass.

Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature

Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature

Additive-free silver nanoparticle ink development using flow-based Laser Ablation Synthesis in Solution and Aerosol Jet printing

• Optimum conditions determined for high yield LASiS Ag NP at 1.08 mg mL −1 . • Process control developed for Ag particle production in range of 27–39 nm. • Aerosol Jet printing of LASiS Ag NP for supercapacitor and humidity sensor. • Track resistance of 83 Ω improved to 51 Ω after thermal sintering treatment. • Resistivity of 7.72 × 10 −6 Ω m −1 improved to 4.74 × 10 −6 Ω m −1 for sintered tracks. Additive free conductive ink formulation via green techniques and its direct printing is critical for many applications including smart electronics, solar cells, healthcare and electrochemical energy storage. The available printable ink generations are far away from ideal. This study reports the development of additive free silver (Ag) nano particle (NP) inks via flow-based Laser Ablation Synthesis in Solution (LASiS) system and Aerosol Jet printing. Examples of LASiS Ag NP printed tracks and patterns on unprocessed glass, rubber, and plastic substrates with spatial uniformity and high printing resolution are demonstrated. For thermally sintered Ag NP track, the resistivity decreased to 4.74 × 10 −6 Ω m and conductivity improved to 2.11 × 10 5 S/m. The track resistance of ≈ 83 Ω improved to ≈ 51 Ω and the resistivity of 7.72 10 −6 Ω m (conductivity: 1.29 × 10 5 S/m) improved to 4.74 × 10 −6 Ω m. This work highlights that LASiS is a versatile, additive-free conductive ink formulation method for the scalable production of next generation printed electronic components and devices, using the emerging Aerosol Jet printing technology.

Conformal laser printing and laser sintering of Ag nanoparticle inks: a digital approach for the additive manufacturing of micro-conductive patterns on patterned flexible substrates

ABSTRACT The laser induced forward transfer and sintering of metal nanoparticle inks has been proven a key enabling technology for flexible electronics. Nevertheless, many challenges concerning the conformal processing of non-planar substrates incorporating thermally sensitive layers are yet to be addressed. In this work, we study the behaviour of conformal laser printing of silver nanoparticle inks on patterned samples comprising sensitive underlying structures, by correlating the laser sintering powers employed to the undesired effects on the adjacent interfaces. The latter include demanding surface topographies with periodic patterns and micro-components exhibiting aspect ratio in the nano to 100-micron scale. We investigate the contribution of crucial processing parameters, such as the per pulse energy, repetition rate and the pulse to pulse spatial and temporal overlap to the overall result. The demonstrated results validate the versatility of laser processing which can offer application specific solutions on different use cases involving multilayered and multimaterial electronics.

(Digital Presentation) Electrodeposition of Re on Aerosol Jet Printed Metal Seed Layers on Flexible Substrates

Quantum computers (QCs) are expected to run advanced algorithms to solve currently intractable challenges in chemistry simulations, cryptography, medicine, and finance.[1] The Josephson Junction based qubits that power a quantum computer must reside in a cryogenically cooled chamber at 10 mK. Communications with this chip is currently carried out with a chandelier of rigid cables.[2] A flexible cable containing superconducting interconnect lines could in principle simplify the design of QC interconnects and lead to improvement in qubit density and efficiency. We have previously demonstrated the use of aerosol jet printing (AJP) for the patterning of electrodeposited Cu and Ni [3]. We have also recently reported on the development of a water-in-salt method to electrodeposit superconducting Re on evaporated Au on Si substrates. These Re components have a critical temperature above 4.2 K, which makes the superconductivity easily accessible with liquid He cooling[4].We report for the first time the metallization of flexible Kapton substrates with printed Au and Ag nanoparticle inks by aerosol jet printing as the seed for superconductor electrodeposition. Electrodeposition of Re onto the printed structures was performed using the water-in-salt method. ASTM D3359 tests demonstrated that Au has superior adhesion to Kapton, while the Ag seed does not survive rhenium deposition, potentially due to the high internal stress of Re. Further, improved adhesion was demonstrated when Kapton substrates were roughened with 1200 grit sandpaper. Electrodeposited Re on AJP Au seed layer on flexible Kapton substrates, as shown in Figure 1, demonstrated a superconducting transition temperature of 6K. In addition, electrodeposited Re on Au survived 200 cycles of flexure testing under >30 MPa load and 1.2% strain. These efforts demonstrate the proof-of-principle for patterning of superconducting interconnects for the further development of QCs. SNL is managed and operated by NTESS under DOE NNSA contract DE-NA0003525. SAND2022-11522 A References [1] F. Bova, A. Goldfarb, and R.G. Melko “Commercial Applications of Quantum Computing.” EPJ Quantum Tech. (2021) 8:2.[2] S. Krinner, S. Storz, P. Kurpiers, P. Magnard, J. Heinsoo, R. Keller, J. Lütolf, C. Eichler & A. Wallraff. “Engineering cryogenic setups for 100-qubit scale superconducting circuit systems.” EPJ Quantum Tech. (2019) 6:2.[3] L. K. Tsui, S. C. Kayser, S. A. Strong, and J. M. Lavin, “High Resolution Aerosol Jet Printed Components with Electrodeposition-Enhanced Conductance.” ECS J. Solid State Sci. Tech. (2021). 10, 047001.[4] W. D. Sides, E. Hassani, D. P. Pappas, Y. Hu, T. S. Oh, Q. Huang “Grain growth and superconductivity of rhenium electrodeposited from water-in-salt electrolytes.” J. App. Phys. (2020). 127, 085301.Figure 1. (a) Photograph of a well adhered Re on Au sample. (b) Superconducting transition data for Re on printed Au on Kapton. Figure 1

Stability Bounds for Micron Scale Ag Conductor Lines Produced by Electrohydrodynamic Inkjet Printing.

Continuous conducting lines of width 5–20 μm have been printed with a Ag nanoparticle ink using drop-on-demand (DOD) electrohydrodynamic (EHD) inkjet printing on Si and PDMS substrates, with advancing contact angles of 11° and 35°, respectively, and a zero receding contact angle. It is only possible to achieve stable parallel sided lines within a limited range of drop spacings, and this limiting range for stable line printing decreases as the contact angle of the ink on the substrate increases. The upper bound drop spacing for stable line formation is determined by a minimum drop overlap required to prevent contact line retraction, and the lower bound is governed by competing flows for drop spreading onto an unwetted substrate and a return flow driven by a Laplace pressure difference between the newly deposited drops and the fluid some distance from the growing tip. The upper and lower bounds are shown to be consistent with those predicted using existing models for the stability of inkjet printed lines produced using piezoelectric droplet generators. A comparison with literature data for EHD printed lines finds that these limiting bounds apply with printed line widths as small as 200 nm using subfemtoliter drop volumes. When a fine grid pattern is printed, local differences in Laplace pressure lead to the line width retracting to the minimum stable width and excess ink being transported to the nodes of the grid. After printing and sintering, the printed tracks have a conductivity of about 15%–20% of bulk Ag on the Si substrate, which correlates with a porosity of about 60%.

Screen printing of silver nanoparticles on the source/drain electrodes of organic thin-film transistors

Herein, we systematically investigate the screen printing of Ag nanoparticle (AgNP) inks for the use of source and drain (S/D) electrodes of organic thin-film transistors (OTFTs), controlling printing process condition such as printing speed annealing temperature, as well as the surface modification for the substrate. The optimization of screen-printed AgNPs showed high electrical conductivity, nice pattern-fidelity and good adhesion to the substrate. Although the printed AgNP pattern indicated the thickness of about 11 μm (measured at the center area of the pattern) which is too high compared with that of semiconductor layer (∼100 nm), the edge side of the pattern showed the trapezoid shape with an angle of 18.2° enabling the feasible charge injection and extraction between electrodes and semiconductor layer. Based on the optimized AgNP S/D electrode, the OTFTs with 2,9-di-decyl-dinaphtho-[2,3-b:2,3-f]-thieno-[3,2-b]thiophene (C 10 -DNTT) semiconductor layer were fabricated on Si/SiO 2 and flexible polyethylene terephthalate (PET) substrates with bottom-gate, bottom-contact (BGBC) and top-gate, bottom-contact (TGBC) device structure, respectively. Consequently, BGBC on Si/SiO 2 showed the best device performance, with a μ FET of 0.186 cm 2 V −1 s −1 and threshold voltage ( V th ) of −0.41 V. In addition, TGBC OTFTs on the PET substrate obtained an electrical performance with a μ FET of 0.012 cm 2 V −1 s −1 . • Screen-printed Ag nanoparticle (AgNP) patterns were applied as source/drain electrodes of organic thin-film transistors. • The printed AgNP showed high electrical conductivity, nice pattern fidelity, and good adhesion to the substrate. • The printed AgNP electrode had a thickness of about 11 μm and a trapezoidal edge with an angle of 18.2°.

Resistivity study of inkjet-printed structures and electrical interfacing on flexible substrates

Development and evaluation of electronics with printing techniques such as inkjet printing is currently an active subject of research with various outstanding results in sensing applications. Printing technologies have shown high efficiency and compatibility with various types of inks and substrates, enhancing the opportunity for scientific innovation and research in this field. The present work reports on the evaluation of the resistivity and the sheet resistance of inkjet-printed conductive commercial Ag-nanoparticle ink, graphene ink and a custom functionalized reduced graphene oxide ( f- rGO) ink on Kapton substrate using the Van-der-Pauw method. Two different approximations have been used to determine the sheet resistance (R s ) and the corresponding resistivity (ρ). The results showed differences in the extracted sheet resistance value, which emphasizes the importance of the adopted calculation method. Furthermore, in order to demonstrate the ability to fabricate printed structures with efficient electrical connection to external devices, we have evaluated standard methods for interfacing two inkjet-printed materials on Kapton substrate, namely: commercial Ag-nanoparticle ink and graphene ink. Two standard connection techniques implementing a 4-pin Flexible Printed Circuit (FPC) connector and an Amphenol Clincher connector were evaluated, along with a custom direct interconnection approach. Direct interconnection between Cu patterned tracks and printed structures attracts special interest because it addresses one of the main problems in printed electronics, which is the interfacing of the printed structure with other electronic or read-out components. Thus, the printed Ag-Graphene/Cu direct interconnection case was further investigated. Two-point [2p] and four-point [4p] measurements were performed in order to study the effect of the various probe locations of engagement to the extracted resistance. The results acquired for this interconnection method revealed the importance of the measurement probe location. To support these experimental results, FEA simulations were performed and the outcomes were consistent with the experimental findings. • Two approaches in the calculation process of sheet resistance, implementing Van-der-Pauw test structures showed the significance of the evaluation method to the results. • Application-level approaches for electrical interfacing, which utilize copper interconnections are presented and evaluated. • Both Ag ink and graphene ink can be inkjet-printed onto Kapton substrate and used as a reliableinterconnection method. • Direct interconnections revealed how the probe location, the contact resistance and the localization of electric field affect the measurement process.

A wearable gamma radiation-responsive granulocyte colony-stimulating factor microneedle system protecting against ionizing radiation-induced injury

Exposure to a nuclear accident or a radiological attack may cause serious death events due to ionizing radiation-induced injury and acute radiation syndrome (ARS). Recombinant human granulocyte colony-stimulating factor (G-CSF) is now used for the treatment of ARS. However, the current injection formulation might not ensure treatment as early as possible after a nuclear accident, resulting in a decrease in therapeutic efficiency. In the present study, we have developed a G-CSF wearable system (GWS) consisting of a commercial microchip, a temperature sensor, a gamma-ray detection sensor, a flexible heater, and a G-CSF temperature-sensitive microneedle (GTSMN) patch. G-CSF-containing hyaluronic acid solutions were cast into the mold to obtain G-CSF microneedles (GMNs), which were coated with a temperature-sensitive layer of dodecanoic acid-cetylamine salt to obtain GTSMNs. The flexible heater was prepared by jet printing Ag nanoparticle inks. The GWS and its components are explored and optimized in the aspects of electronics, mechanics, heat transfer and drug diffusion. The γ radiation signal is sensitively monitored by the GWS. The wearable G-CSF system immediately releases G-CSF into the body in response to signal feedback and provides maximal protection against ionizing radiation-induced injury. Therefore, the GWS is a promising wearable system against emergent ionizing radiation injury. Statement of significanceIonizing radiation-induced injury is always the very important public health problem all the global people care. Some medicines have been applied to protect the body from the injury. Unfortunately, sometimes the injuries accidently happen and the medicines cannot be administered in time, leading to serious acute radiation syndrome. Here, we design a wearable system loading G-CSF that has been approved by FDA to protect the body from ionizing radiation-induced injury. This system consists of a commercial microchip, a temperature sensor, a Gamma-ray detection sensor, a flexible heater, and a G-CSF temperature-sensitive microneedle patch. It can monitor γ radiation and immediately release G-CSF into the body to protect the body to the maximal extent. Therefore, the system is a promising wearable medical device against emergent ionizing radiation injury.

Highly Conductive Networks of Silver Nanosheets.

Although printed networks of semiconducting nanosheets have found success in a range of applications, conductive nanosheet networks are limited by low conductivities (<106 S m-1 ). Here, dispersions of silver nanosheets (AgNS) that can be printed into highly conductive networks are described. Using a commercial thermal inkjet printer, AgNS patterns with unannealed conductivities of up to (6.0 ± 1.1) ×106 S m-1 are printed. These networks can form electromagnetic interference shields with record shielding effectiveness of >60dB in the microwave region at thicknesses <200nm. High resolution patterns with line widths down to 10 µm are also printed using an aerosol-jet printer which, when annealed at 200 °C, display conductivity >107 S m-1 . Unlike conventional Ag-nanoparticle inks, the 2D geometry of AgNS yields smooth, short-free interfaces between electrode and active layer when used as the top electrode in vertical nanosheet heterostructures. This shows that all-printed vertical heterostructures of AgNS/WS2 /AgNS, where the top electrode is a mesh grid, function as photodetectors demonstrating that such structures can be used in optoelectronic applications that usually require transparent conductors.

Digital laser printing and sintering of silver nanoparticle inks for the additive manufacturing of micro-conductive patterns on non-planar patterned flexible substrates

Current trends in flexible and large area electronics require low temperature, solvent- free and mask-less processing of patterns with versatile form factors and aspect ratio. In this work, we explore the boundaries of conformal laser printing and laser processing of Ag nanoparticle inks applied on particularly sensitive substrates and structures. The latter involve challenging surface topographies, such as patterns and micro-components with periodicity and aspect ratio in the nano to 100-µm scale. The demonstrated results validate the versatility and flexibility of laser sintering, which can offer a specific solution to particularly challenging use cases and applications in flexible multimaterial multilayered electronics.

The Effect of Current Supply Duration during Stepwise Electrical Sintering of Silver Nanoparticles

We studied the effect of current supply duration at final-step currents during the stepwise electrical sintering of silver (Ag) nanoparticles (NPs). Ag NPs ink was inkjet-printed onto Eagle-XG glass substrates. Constant final-step currents of 0.4 and 0.5 A with various time intervals were applied to the printed samples. The final-step current of 0.5 A damaged the line at a comparatively shorter time duration. On the other hand, the lower final-step current of 0.4 A prevented the line damage at longer time durations while producing comparatively lower Ag NPs specific resistance. The minimum specific resistances of the printed samples sintered at 0.4 and 0.5 A were 3.59 μΩ∙cm and 3.79 μΩ∙cm, respectively. Furthermore, numerical temperature estimation and scanning electron microscope (SEM) analysis were conducted to elaborate on the results. The numerical temperature estimation results implied that the lower estimated peak temperature at the final-step current of 0.4 A helped prevent Ag NP line damage. The SEM micrographs suggested that a high surface porosity—caused by higher sintering peak temperatures—in the case of the 0.5 A final-step current resulted in a comparatively higher Ag NP line-specific resistance. This contribution is a step forward in the development of Ag NP sintering for printed electronics applications.

Stepwise Current Increment Sintering of Silver Nanoparticle Structures

Owing to its unique properties, silver (Ag) in the form of nanoparticle (NP) ink promises to play a vital role in the development of printed and flexible electronics. Once printed, metal NP inks require a thermal treatment process called sintering to render them conductive. Among the various methods, electrical sintering is a highly selective and rapid sintering method. Here, we studied the electrical sintering of inkjet-printed Ag NP lines via a stepwise current increment sintering (SCIS) technique. In the SCIS technique, the supplied electric current was gradually increased in multiple steps from low electric currents to higher electric currents to avoid thermal damage to the printed Ag NP ink lines. In less than 0.15 s, a line resistivity as low as 6.8 μΩcm was obtained which was comparable with furnace sintered line resistivity of 6.13 μΩcm obtained at 250 °C in 600 s. Furthermore, a numerical model was developed for the SCIS process temperature estimation. The results enabled us to elaborate on the relationship between the Ag NP line resistivity and the process temperature under various electric currents. Under the applied SCIS technique, a stable sintering process was carried out avoiding the conductive ink line and substrate damage.