Wafer Level Chip Size Package Integration of an Aero-acoustic MEMS Microphone into a Thin and Flexible Substrate

Abstract

This publication describes a novel combination of a chip-scale-package-approach for micro-electromechanical systems with flush surface chip embedding in thermal Polyurethane. The concept enables the fabrication of thin and flexible substrates in which sensor chips with fragile membranes are integrated. The presented sensor array can be used for applications like sound source localization in streams of passenger airplanes whilst test-flights.