Abstract

Lateral device parameters for VDMOSFET (Vertical Double Diffused Metal Oxide Semiconductor Field Effect Transistor) with hexagonal cells are extracted using an original method based on electrical and optical measurements. Using microscopic observation of the ship of the device and C–V characterization, the lateral device structure parameters could be extracted. Values of the extracted parameters are in good agreement with the values given by the manufacturer. The advantage of this method is the high precision of results for a low cost. Perhaps the most important point of this method is that it can replace the other techniques usually employed, wherein devices are destroyed to obtain the cross section of the structure. The proposed technique can be very useful for analyzing any complex geometrical structure of VDMOS transistors (hexagonal, triangular, square etc…).

Highlights

  • The n-channel MOSFETs are the most popular for use in power switching circuits and applications

  • Various manufacturers produce power MOSFETs under the names HEXFET (International rectifier), VMOS (Phillips), SIPMOS (Siemens) and all consist of various physical designs diffused into an epitaxial substrate in multiple parallel

  • Technical progress of microelectronic integration involve an evolution towards the miniaturization which requires new structural modifications to answer the sub-micronics parasitic effects [8-111. Lateral parameters of these devices are needed for software simulation models for the components structure

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Summary

AND OPTICAL MEASUREMENTS

Radiation Technology, lnterfaculty Reactor Institute, Delft University of Technology, Mekelweg 15, 2629 JB Delft, The Netherlands (Received 22 August 2000; In finalform 13 September 2000). Lateral Device parameters for VDMOSFET (Vertical double diffused metal oxide ’miconductor field effect transistor) with hexagonal cells has been extracted by an original model based on electrical and optical measurements. Using microscopic observation for the ship of the device and by C-V characterization, the lateral device structure parameters could be extracted. Values of the extracted parameters are in good correlation with the values given by the manufactured. Advantage of this model the high precision results with a low cost. The proposed technique in this paper can be very useful for analyzing any complex geometrical structure of VDMOS transistors (hexagonal, triangular, square etc...)

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EXTRACTION METHODOLOGY
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