Variation tolerant and stability simulation of low power SRAM cell analysis using FGMOS

Abstract

With technology scaling, stability, power dissipation, and device variability, the impact of process, voltage and temperature (PVT) variations has become dominant for static random access memory (SRAM) analysis for productivity and failure. In this paper, ten-transistors (10T) and low power eight-transistors SRAM cells are redesigned using floating-gate MOS transistors (FGMOS). Power centric parameters viz. read power, write power, hold power and delay are the performance analysis metrics. Further, the stochastic parameter variation to study the variability tolerance of the redesigned cell, PVT variations and Monte Carlo simulations have been carried out for 10T FGMOS SRAM cell. Stability has been illustrated with the conventional butterfly method giving read static noise margin (RSNM) and write static noise margin (WSNM) metrics for read stability and write ability, respectively. A comparative analysis with standard six-transistor SRAM cell is carried out. HSPICE simulative analysis has been carried out for 32[Formula: see text]nm technology node. The redesigned FGMOS SRAM cells provide improved performance. Also, these are robust and reliability efficient with comparable stability.