Use of compliant adhesives in the large area processing of MCM-D substrates

Abstract

Large area substrate processing is a key solution for improving the productivity of multichip module deposition (MCM-D) technology. This project is focused on high temperature polymeric adhesives for attachment of silicon tiles to suitable pallets to facilitate large area film processing of MCM structures. Current polymeric high temperature adhesives are predominately polyimide-based that are not reworkable, which places an obstacle to remove the coated substrates and to reuse the high cost pallets. However, an approach will be presented in this paper to address this demand by introducing thermally cleavable links in the thermoset polyimide-amide resin. A series of novel reworkable high temperature (in excess of 350–400 °C) adhesives have been developed, that can meet the requirements of adhesion, viscosity, thermal stability, and reworkability of the MCM-D production. Furthermore, scanning electron microscopy (SEM) microstructure images are presented for intuitive reworkability analysis.