Abstract
Large area substrate processing is a key solution for improving the productivity of multichip module deposition (MCM-D) technology. This project is focused on high temperature polymeric adhesives for attachment of silicon tiles to suitable pallets to facilitate large area film processing of MCM structures. Current polymeric high temperature adhesives are predominately polyimide-based that are not reworkable, which places an obstacle to remove the coated substrates and to reuse the high cost pallets. However, an approach will be presented in this paper to address this demand by introducing thermally cleavable links in the thermoset polyimide-amide resin. A series of novel reworkable high temperature (in excess of 350-400/spl deg/C) adhesives have been developed, that can meet the requirements of adhesion, viscosity, thermal stability, and reworkability of the MCM-D production. Furthermore, scanning electron microscopy (SEM) microstructure images are presented for intuitive reworkability analysis.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
