Abstract

Polycrystalline Si films were deposited onto glass substrates by evaporation technique. The Hall-mobility of undoped films was investigated for process substrate temperatures from 300 to 650°C. The Hall-mobility was found to be up to about 10 cm 2/Vs for 500°C. Sb-doped n-type films exhibited a conductivity up to 10 (Ω cm) −1 deposited at about 500°C. Thin film transistors were fabricated from undoped and doped polycrystalline Si used for the channel and the source/drain contacts. The TFT mobilities were found to be 10 cm 2/Vs and 2 cm 2/Vs for a highest process temperature of 550°C and 480°C respectively. The new feature of the TFT process is that these data were obtained without using ion implantation technique. For the first time a poly-Si TFT was fabricated on soda-lime glass at a very low temperature of 480°C.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.