Abstract
Abstract Thin-film capacitors can be created on various substrates including glass, low-temperature co-fired ceramic (LTCC), and potentially on laminate PC board materials if the surface is sufficiently smooth. This paper looks at the circuit-design issues of how such a technology could be used in high-speed digital and microwave circuits for improving both signal integrity and power integrity (SI/PI). Two primary applications are examined: the formation of a low-inductance power-supply bypass allowing reduced supply ‘noise’, and the formation of AC coupling (DC blocking) circuits with improved signal return-loss.
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