Abstract
Glass has unique properties for micro fluidic, MEMS and optical applications. However, poor machinability of glass materials limit its applications. ECDM process is one of the most utilized micro machining process for fabrication of glass micro products. In ECDM thermal energy of discharges utilizes to provide thermal loading for removal of material. However, controlled thermal loading requires for machining of glass materials owing to its poor thermal conductivity. High thermal stresses may develop at high thermal loading, which leads to uncontrolled facture of glass material. Therefore, a thorough discussion is needed to understand the effect of thermal loading on glass materials. In this study, the experiments are conducted to investigate the thermal loading effect on borosilicate glass during ECDM process. Also, an analytical model is developed to estimate the induced thermal stress during ECDM process. Theses thermal stresses are discussed during drilling of micro hole on work material. After discussion three zones are identified for machining of borosilicate glass using ECDM process, wherein zone-II (i.e. from 44 V to 52 V applied voltage) is identified for safe machining.
Published Version
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