Abstract
The J-integral and stress intensity factor around the crack tips of a self-stretching flip chip solder joint under thermal fatigue crack propagation are determined by the finite element method. A 5th order polynomial is used to best fit the J-integral and stress intensity factor as a function of the crack length in the solder joint. Thermal fatigue life of the solder joint is then estimated based on the calculated J-integral and stress intensity factor, Paris' law, and fatigue crack growth rate data on solders. A correlation between the analytical and experimental results is made.
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