Abstract
In this paper, the responses of a self-stretching flip chip solder joint under thermal fatigue crack propagation have been study. Emphasis is placed on the determination of the J-integral and stress intensity factor around the crack tips of the solder joint by the finite element method. A 5th order polynomial has been used to best fit the J-integral and stress intensity factor as a function of the crack length in the solder joint. Thermal fatigue life of the solder joint was then estimated based on the calculated stress intensity factor, Paris' law, and fatigue crack growth rate data on solders. Furthermore, a correlation between the analytical and experimental results has also been made.
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