Abstract
Storage tests have been performed to obtain information on the influence of the passivation material and its geometry on the mechanical reliability of Al–Cu lines. During storage tests, the stress in the lines is tensile and depends on the passivation material and passivation geometry. The passivation was either a SiO 2 layer or a SiN x layer. In both cases the influence of a conformal and a planarised passivation geometry has been studied. Passivating the lines with a material with a higher stiffness such as SiN x will increase the stress void density in the lines. Moreover, a conformal passivation layer induces less stress voids in the metal than a planarised passivation, deposited by a Dep/Etch method. The number of stress voids saturates within 24 h at 200°C. However, the voids continue to grow during longer storage times. When the lines are passivated with the lower stiffness material SiO 2, stress voids have not been observed after storage testing.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.