Abstract
Abstract Flexible Hybrid Electronics (FHE) can be described as thinned, flexible silicon chips packaged on flexible circuit board (FCB) with printed conductors and passives. The flexibility of ICs can be achieved only if the thickness of the silicon is reduced to 50μm or less. The bend testing of the ultra-thin dies is a critical issue in the FHE technology as it allows to establish the fundamental relationships between the die flexural strength, die geometry, and the methods for thinning and dicing the silicon. The conventional bend tests are not adequate for testing ultra-thin dies. Presented is a semi-empirical test method, which allows for the estimation of the flexural strength of the highly compliant ultra-thin dies. The limiting Radius of Curvature (RoC) is an important parameter for the FHE device since it accounts for the bending characteristics of the entire FHE device, not only the IC. Presented is a simple analytical approach that allows to estimate the minimum RoC for an FHE assembly.
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