Abstract
The microstructure of samples of aramid fabric TSVM-DZh, subjected to the influence of the microwave electromagnetic field of an average power level with a frequency of 2450 MHz, was investigated. A significant change in the conditions of contact of individual filaments at the level of the interfibrillary bond of fibers, expressed in the integration of fibrils into agglomerates, filling gaps between the fibers with an increase in the interaction area and in the convergence of individual fibers, which improves the reliability of intermolecular bonds was established. The obtained results can be used as one of the mechanisms for increasing the strength characteristics of structural organoplastics and protective materials from aramid fabrics after microwave exposure.
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call