Study of signal integrity for PCB level

Abstract

With the rapid development of high-speed digital circuits and high-integration-chip technology, more high-speed signals need to be transferred in high-speed interconnection. However, high-speed signals will experience delay, reflection, attenuation and crosstalk during the transferring. The transmission characteristic of printed circuit board (PCB) is very important as PCB is the support for the whole circuit systems. As the signal integrity is very critical for the electronic products, both designers of high-speed circuit and PCB manufactures focus on solving the signal integrity problem. Signal integrity in high-speed circuit design is very important. In this study, discontinuous ground and the via hole signal integrity analysis in the PCB level were carried out on the basis of transmission lines. Based on the results of the experiments, guidelines for design and manufacturing process were proposed to improve the signal integrity problem.