Signal integrity analysis of high speed and high density PCB design based on FPGA

Abstract

According to the Moore's law,it becomes more and more complex to design high-speed and high-density Printed Circuit Board (PCB).As to Signal Integrity (SI) of large or extra large high-speed and high-density PCB,a research method combing theory analysis and mode simulation with project practice was introduced;meanwhile,some solutions or design rules were put forward.Following issues were discussed:PCB stack-up,the styles of transmission line,characteristic impedance calculation,topology,terminations,delay matching,crosstalk,differential pair layout,etc.On this basis,a few of principles were given about multilayers PCB design based on Field Programmable Gate Array (FPGA).Specific project application proves that high-speed and high-density PCB design can get good practical results driven by these principles or mechanisms.