Squaring Off with M-Series Fan-Out Technology

Abstract

Currently running at volumes in the millions of units per day on 300mm round format, Deca’s M-Series™ fan-out PLP technology and Adaptive Patterning® are being scaled up at ASE to 600 mm for production. The SEMI standard 600 mm square format pioneered by Deca, provides a 500% increase in usable area per panel providing cost-effective capacity growth as well as a powerful platform for high density integration of multi-die and chiplets in 2D, 2.5D and 3D structures. Deca’s patented Adaptive Patterning® coupled with chip attach compensation modeling overcomes the yield challenges associated with scaling to 600 mm and mitigates the compounding risk associated with the growing number of dies in a package, which is of particular importance for chiplet designs. The use of Laser Direct Imaging (LDI) overcomes the need for reticle stitching and eliminates this barrier for large package body sizes. In addition, 600mm allows for higher efficiency in terms of package count per format area over 300mm round, leading to less waste, thus a lower cost and a more environmentally friendly process. Recent advancements in LDI have allowed the potential to scale the technology to ultra-high density 2µm line & space redistribution layers (RDL) and 5μm vias. Advancement in Adaptive Patterning have led to multi-die packaging solutions without the need for complicated embedded bridge chips. With these ultra-high-density tools at hand, a breakthrough in device interface pitch of 20µm area array for leading edge silicon nodes will be outlined.