Abstract
Currently running at volumes in the millions per day on 300mm round format, Deca’s M-Series fan-out technology and Adaptive Patterning are being scaled up to 600mm for production. The SEMI standard 600 mm square format originally pioneered by Deca, provides a 500% increase in usable area per panel providing cost-effective capacity growth as well as a powerful platform for high density integration of multi-die and chiplets in 2D, 2.5D and 3D structures.The yield challenges of preparing for pilot 600 mm production will be examined including examples of how Deca’s Adaptive Patterning™ coupled with special die attach compensation modeling overcome the issues to deliver high yields at ASE. Additionally, Adaptive Patterning’s ability to provide breakthrough ultra-high density device interface pitch of 20 $\mu$m area array for leading edge silicon nodes will be outlined.The ability of laser direct imaging (LDI) coupled with Adaptive Patterning to scale to ultra-high density 2 $\mu$m line & space redistribution layers (RDL) and below will be presented demonstrating industry benchmark performance without the need for complicated embedded bridge chip structures.
Published Version
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